Section9.3

BasicAuWireBondProcess6/20/20251

ASMPacificTechnologyLtd.?2009ContentsBasicIntroductionGoldWireBonderBondingSequenceMaterial&ToolsBondQuality6/20/20252

ASMPacificTechnologyLtd.?2009BasicIntroductionUnderstandanICPackageICManufacturingFlowWireBondingIntroduction6/20/20253

ASMPacificTechnologyLtd.?2009Cross-sectionofanICPackageDieGoldWireLeadFrame6/20/20254

ASMPacificTechnologyLtd.?2009WaferGrindingDieBondingWaferSawToasterWireBondingDieSurfaceCoatingMoldingLaserMarkSolderBallPlacement

SingulationPackingICManufacturingFlowDejunk

TrimSolderPlatingSolderPlatingForming/SingulationTrim/Forming

BGASURFACEMOUNTPKGTHROUGHHOLEPKG6/20/20255

ASMPacificTechnologyLtd.?2009GoldWireBondingDiePadLeadGoldwireBallBond(1stBond)WedgeBond(2ndBond)6/20/20256

ASMPacificTechnologyLtd.?2009WedgeBonding6/20/20257

ASMPacificTechnologyLtd.?2009WhattechniqueisusedinGoldWireBonding?6/20/20258

ASMPacificTechnologyLtd.?2009WireBondingTechniquesTherearethreebasicwirebondingtechniques:Thermosonicbonding:utilizestemperature,ultrasonicandlowimpactforce,andball/wedgemethods.Ultrasonicbonding:utilizesultrasonicandlowimpactforce,andthewedgemethodonly.Thermocompressionbonding:utilizestemperatureandhighimpactforce,andthewedgemethodonly.6/20/20259

ASMPacificTechnologyLtd.?2009Thermocompression

vs

ThermosonicThermocompressionweldingusuallyrequiresinterfacialtemperatureoftheorderof>300°C.Thistemperaturecandamagesomedieattachplastics,packagingmaterials,andlaminates,aswellassomesensitivechips.Thermosonicwelding,theinterfacetemperaturecanbemuchlower,typicallybetween100to150°C,whichavoidssuchproblems.Theultrasonicenergyhelpsdispersecontaminatesduringtheearlypartofthebondingcycleandhelpscompletetheweldincombinationwiththethermalenergy.6/20/202510

ASMPacificTechnologyLtd.?2009AdvantagesofThermosonicMetallurgicaljoiningismorereliablethanconductiveparticlesandadhesivejoining.Processcycletimecanbereducedfromseveralminutestolessthan10seconds.Lowermanufacturingcostperunit.6/20/202511

ASMPacificTechnologyLtd.?2009Wirebonding

OperatingTemperatureWireMaterialsPadMaterialsNoteThermo-compression300-500°CAuAl,AuHighpressure,noultrasonicenergyUltrasonic25°CAu,AlAl,AuLowpressureinultrasonicenergyThermosonic100-240°CAu,CuAl,AuLowpressureinultrasonicenergyComparisonofDifferentWireBondingTechniques6/20/202512

ASMPacificTechnologyLtd.?2009WhataretheimportantparametersinGoldWireBonding?6/20/202513

ASMPacificTechnologyLtd.?2009BondingParametersThermosonicBondingPressure(Force)Amplify&Frequency(Power–138KHz)WeldingTime(BondTime)WeldingTemperature(Heater)

HighPower3.2WmaxLowPower1.6WmaxUltra-LowPower0.8WmaxPower-mWVib.-umPower-mWVib.-umPower-mWVib.-um32003.2116002.268001.596/20/202514

ASMPacificTechnologyLtd.?2009SiO2Si

BondingPrincipleAlPressure(Force)Vibration(Power)ContaminationMoistureAl2O3GlassHeat6/20/202515

ASMPacificTechnologyLtd.?2009NexttoGoldWireBonder6/20/202516

ASMPacificTechnologyLtd.?2009GoldWireBonderMachineRoadmapUnderstandIndividualPartMachineSpecificationBondingTemperature6/20/202517

ASMPacificTechnologyLtd.?2009ASMGoldWireBonderRoadmapMachineModel(ATS)AB308

AB309

AB309A

AB339

AB339Eagle

Eagle60

Eagle60AP

Harrier

TwinEagle

HummingBird

Eagle50??6/20/202518

ASMPacificTechnologyLtd.?2009ASMGoldWireBonderMachineModel(ATS)DescriptionEagle60-00ICApplicationsEagle60-01TO-92Eagle60-02Opto(BentLeadframe)ApplicationsEagle60-03VerticalLEDorOptoApplicationsEagle60-08Power&HybridDeviceApplicationsEagle60-09Power&HybridDeviceApplications6/20/202519

ASMPacificTechnologyLtd.?2009MatchingEagle60APEagle60-03HummningBirdHarrierTwinEagle.....ACEDB6/20/202520

ASMPacificTechnologyLtd.?2009Eagle60AP

MachineIntroduction6/20/202521

ASMPacificTechnologyLtd.?2009Eagle60vsEagle60AP

Eagle60Eagle60APFinepitch35μm.30μm.Speed60+ms.<60ms.BondheadDigitalbondheadNewbondheadwith8~10%fasterBondPlacementAccuracy±3μm@3sigma±2.5μm@3sigmaLoopTypesStandardloopingdatabaseAdditionalEscargot,Flex,BellloopOptics

ProgrammableBallFormationMonitoringStandard8xfasterCapacitancenon-stickdetectionStandard10xfaster6/20/202522

ASMPacificTechnologyLtd.?2009LowimpactforceRealtimeBondingForcemonitoringHighresolutionz-axispositionwith0.4micronperencoderstepFastcontactdetectionSuppressedForcevibration&FastForceresponseFastresponsevoicecoilwireclampBondHeadASSY6/20/202523

ASMPacificTechnologyLtd.?2009XYTableLinearMotorHighpowerACCurrentAmplifierDSPbasedcontrolplatformHighX-Ypositioningaccuracyof+/-3um@3sigmaResolutionof0.2umperencoderstep6/20/202524

ASMPacificTechnologyLtd.?2009W/HASSYIndexingresolutionof1umperencoderstepFullyprogrammableindexer&tracksMotorizedwindowclampwithsoftclosefeatureOutputindexerwithleadframejamprotectionfeatureToollessconversionwindowclampsandtopplateenablesfastdevice6/20/202525

ASMPacificTechnologyLtd.?2009BondingSystemBondingMethod

Thermosonic(TS)BQMMode

Multi-modewithprogrammableBQMBdWireSize 15.2umupto76.2um(Au,Cu)WireLength 0.6to8mmBondingAccuracy +/-2.5um@3sigmaBondingArea 54mmX65mm(LFWidth72mm) 54mmX(137-LFWidth)mmBondingSpeed +60msfor2mmWire(Qloop)BondForceRange 1~400gramLoopType

Q-Auto,Square&PentaLoopHeightRange

3~16milXYResolution

0.2umZResolution

0.4umFinePitchCapability

30umpitch@0.6milwireNo.ofBondingWires

upto3000ProgramStorage

1000programsonHardDiskTransducerSystem 138KHZEagle60APMachineSpecifications(1)6/20/202526

ASMPacificTechnologyLtd.?2009VisionSystemPatternRecognitionTime

60ms/pointPatternRecognitionAccuracy

0.37umLeadLocatorDetection

12ms/leadMinimumLeadPitch 80umPostBondInspection

1st,2ndBondandWire TracingDepthofField

3.5X(320um) 8X(100um)FacilitiesSinglePhase110VAC(optional100/120/200/210/220/230/240VACFloorSpacing

720mm(width)X 820mm(length)X 1600mm(height)

Eagle60APMachineSpecifications(2)6/20/202527

ASMPacificTechnologyLtd.?2009MaterialHandlingSystemIndexerResolution

1umLeadframePositionAccuracy

2milApplicableLeadframe

W=23~90mm@bondingareainY=65mmL=140~295mmT=0.1~0.8mmApplicableMagazine

W=16~100mm(Maximum) L=140~295mm H=180mm(Maximum)MagazinePitch

2.4~10mm(0.09”~0.39“)DeviceChangeover

<4minutes(withinsameLFtype)PackageChangeover

<5minutes(betweenLFtype)NumberofBufferMagazine

3(max.435mm)Eagle60APMachineSpecifications(3)6/20/202528

ASMPacificTechnologyLtd.?2009SPCCapabilityMTBF:168HoursMTBA:2HoursMTTA:1MinuteMTTR:30MinutesOthersAbletolinkuptoformInlineSystem(IDEALine)CompatibletoOLP(OfflineProgrammingSoftware)PowerFailureProtectionEagle60APMachineSpecifications(4)6/20/202529

ASMPacificTechnologyLtd.?2009TheWireBondTemperature

Material Preheat Bondsite CUL/F 200+/-10 200+/-10 ALL/F 210+/-10 230+/-10 BGA 150+/-10 160+/-10 TFBGA 150+/-10 160+/-10 LBGA 150+/-10 160+/-10NotIncludeDedicateLine6/20/202530

ASMPacificTechnologyLtd.?2009NexttoBondingSequence6/20/202531

ASMPacificTechnologyLtd.?2009BondingSequence6/20/202532

ASMPacificTechnologyLtd.?2009PadLeadBondingSequenceWireClampCapillaryGoldWireFreeAirBall6/20/202533

ASMPacificTechnologyLtd.?2009PadLeadMovefromResetPositionFirst,wireclampopenSecond,bondheadmovedownto1stbondpositionThird,FABiscapturedatthechamfer6/20/202534

ASMPacificTechnologyLtd.?2009Approachto1stBondSearchHeightPadLeadSearchHeight6/20/202535

ASMPacificTechnologyLtd.?2009Goingto1stBondPositionSearchSpeed1SearchTol.1PadLead6/20/202536

ASMPacificTechnologyLtd.?2009SearchSpeed1SearchTol.1PadLeadGoingto1stBondPosition6/20/202537

ASMPacificTechnologyLtd.?2009SearchSpeed1SearchTol.1PadLeadGoingto1stBondPosition6/20/202538

ASMPacificTechnologyLtd.?2009SearchSpeed1SearchTol.1PadLeadGoingto1stBondPosition6/20/202539

ASMPacificTechnologyLtd.?2009TouchDownSearchSpeed1SearchTol.1PadLead6/20/202540

ASMPacificTechnologyLtd.?2009ImpactForcePadLeadFormationof1stBond6/20/202541

ASMPacificTechnologyLtd.?2009heatPressureUltraSonicVibrationPadLeadFormationof1stBond(ContactPhase)6/20/202542

ASMPacificTechnologyLtd.?2009heatPressureUltraSonicVibrationPadLeadFormationof1stBond(BondPhase)6/20/202543

ASMPacificTechnologyLtd.?2009CapillaryrisestoReverseHeightPositionPadLead6/20/202544

ASMPacificTechnologyLtd.?2009PadLeadCapillaryrisestoReverseHeightPosition6/20/202545

ASMPacificTechnologyLtd.?2009PadLeadCapillaryrisestoReverseHeightPosition6/20/202546

ASMPacificTechnologyLtd.?2009PadLeadCapillaryrisestoReverseHeightPosition6/20/202547

ASMPacificTechnologyLtd.?2009PadLeadCapillaryrisestoReverseHeightPosition6/20/202548

ASMPacificTechnologyLtd.?2009RHPadLeadCapillaryrisestoReverseHeightPosition6/20/202549

ASMPacificTechnologyLtd.?2009GoingtoReverseDistancePositionRD(ReverseDistance)PadLead6/20/202550

ASMPacificTechnologyLtd.?2009FormationofaLoopPadLead6/20/202551

ASMPacificTechnologyLtd.?2009PadLeadFormationofaLoop6/20/202552

ASMPacificTechnologyLtd.?2009CalculatedWireLengthWireClampClosePadLeadGoingtoLoopTop6/20/202553

ASMPacificTechnologyLtd.?2009CalculatedWireLengthPadLead6/20/202554

ASMPacificTechnologyLtd.?2009SearchDelayTrajectoryPadLead6/20/202555

ASMPacificTechnologyLtd.?2009PadLeadTrajectoryAtthismoment,starttocheck1stbondstickdetection6/20/202556

ASMPacificTechnologyLtd.?2009PadLeadTrajectory6/20/202557

ASMPacificTechnologyLtd.?2009PadLeadTrajectory6/20/202558

ASMPacificTechnologyLtd.?2009PadLeadTrajectory6/20/202559

ASMPacificTechnologyLtd.?2009PadLeadTrajectory6/20/202560

ASMPacificTechnologyLtd.?2009PadLeadTrajectory6/20/202561

ASMPacificTechnologyLtd.?2009PadLeadTrajectory6/20/202562

ASMPacificTechnologyLtd.?2009PadLeadTrajectory6/20/202563

ASMPacificTechnologyLtd.?2009PadLeadTrajectory6/20/202564

ASMPacificTechnologyLtd.?2009PadLeadTrajectory6/20/202565

ASMPacificTechnologyLtd.?20092ndSearchHeightApproachto2ndSearchHeightPadLead6/20/202566

ASMPacificTechnologyLtd.?2009SearchSpeed2SearchTol2PadLeadGoingto2ndBondPosition6/20/202567

ASMPacificTechnologyLtd.?2009SearchSpeed2SearchTol2PadLeadGoingto2ndBondPosition6/20/202568

ASMPacificTechnologyLtd.?2009PadLeadheatFormationof2ndBond6/20/202569

ASMPacificTechnologyLtd.?2009heatPadLeadFormationof2ndBond(ContactPhase)6/20/202570

ASMPacificTechnologyLtd.?2009heatheatPadLeadFormationof2ndBond(BondPhase)6/20/202571

ASMPacificTechnologyLtd.?2009TailLengthPadLead6/20/202572

ASMPacificTechnologyLtd.?2009TailLengthPadLead6/20/202573

ASMPacificTechnologyLtd.?2009TailLengthPadLead6/20/202574

ASMPacificTechnologyLtd.?2009TaillengthTailLengthPadLead6/20/202575

ASMPacificTechnologyLtd.?2009DisconnectionoftheTailPadLeadAtthismoment,starttocheck2ndbondstickdetection6/20/202576

ASMPacificTechnologyLtd.?2009PadLeadDisconnectionoftheTail6/20/202577

ASMPacificTechnologyLtd.?2009PadLeadDisconnectionoftheTail6/20/202578

ASMPacificTechnologyLtd.?2009FormationofaNewFreeAirBallPadLeadApply5000Vtogeneratethesparktomeltthegoldwire6/20/202579

ASMPacificTechnologyLtd.?2009PadLeadFormationofaNewFreeAirBall&BacktoResetPosition6/20/202580

ASMPacificTechnologyLtd.?2009ChipInter-connectionUsingWireBonding6/20/202581

ASMPacificTechnologyLtd.?2009NexttoMaterial&Tools6/20/202582

ASMPacificTechnologyLtd.?2009Material&ToolsLeadFrameCapillaryGoldWireWindowClamp&TopPlate6/20/202583

ASMPacificTechnologyLtd.?2009LeadFrame(1)6/20/202584

ASMPacificTechnologyLtd.?2009LeadFrame(2)6/20/202585

ASMPacificTechnologyLtd.?2009Capillary(1)CapillaryManufacturer(SPT,GAISER,PECO,TOTO…)CapillaryData(Tip,Hole,CD,CA,FA&OR,IC)6/20/202586

ASMPacificTechnologyLtd.?2009Capillary(2)Capillariesaretypically1/16"(.0625"/1.587mm)indiameterand.437"(11.10mm)inlength.

6/20/202587

ASMPacificTechnologyLtd.?2009HowToDesignYourCapillaryCapillary(3)TIP

PadPitchx1.3~TIPHole

Wirediameter+40%10%CD

Padsize/open/1stBallCD+0.4~0.6=1stBondBallsizeFA&OR

Padpitch(um) FA >100 0,4 ~90/100 4,8,11 <90 11,15ICtype

looptype6/20/202588

ASMPacificTechnologyLtd.?2009Capillary(4)WireDiameter(mil)RecommendedHole(mil)MinRecommendedHole(mil)2.03.02.41.52.21.81.31.81.51.21.71.41.11.61.31.01.51.20.91.21.10.81.00.950.70.90.856/20/202589

ASMPacificTechnologyLtd.?2009Capillary(5)MatteFinishenlargesEffectiveFaceandcreatesbetterfrictionwiththegoldwireduringbondformation.PolishFinishprovidessmooth2ndbondandprolongsthecapillarylifespanduetoreducecontaminationaccumulationrate.6/20/202590

ASMPacificTechnologyLtd.?2009

CapillaryParameterswhichAffecttheBondingProcess

LoopingFeedholeInnerChamferOuterRadiusandFaceAngle6/20/202591

ASMPacificTechnologyLtd.?2009

CapillaryParameterswhichAffecttheBondingProcessSmallerORSharperEdgeLikelihoodofCracksBiggerORReducesCracksReducesEffectiveFaceIncreaseFACompensateSmallerTipAreaHigherCrossSection6/20/202592

ASMPacificTechnologyLtd.?2009

CapillaryCondition6/20/202593

ASMPacificTechnologyLtd.?2009GoldWireGoldWireManufacturer(MKE,MEM,Nippon,SUMITOMO,TANAKA….

)GoldWireData(WireDiameter,Type,EL,TS)6/20/202594

ASMPacificTechnologyLtd.?2009PropertiesofVariousWireTypesPropertyCuAuAlAgElectricConductivity(%IACS)103.173.464.5108.4ThermalConductivity(W/mK)398.0317.9243.0428.0ThermalExpansionCoeff(mm/mK)16.514.223.619.0TensileElasticModulus(GPa)1157862716/20/202595

ASMPacificTechnologyLtd.?2009GoldWire(ApplicationofWireType)6/20/202596

ASMPacificTechnologyLtd.?2009GoldWire(FreeAirBall)Thediameterofthefree-airballrangesfor1.5times(forsmallballultra-finepitchapplication)to2.5times(forlargeballnon-finepitchapplication)ofwirediameter(WD).

6/20/202597

ASMPacificTechnologyLtd.?2009GoldWire(HeatAffectedZone)Sourcefrom:MKElectron6/20/202598

ASMPacificTechnologyLtd.?2009GoldWire(ElectricalResistance)Sourcefrom:MKElectron6/20/202599

ASMPacificTechnologyLtd.?2009WindowClamp&TopPlate6/20/2025100

ASMPacificTechnologyLtd.?2009WindowClampDimension(1)6/20/2025101

ASMPacificTechnologyLtd.?2009WindowClampDimension(2)6/20/2025102

ASMPacificTechnologyLtd.?2009TopPlateDimension(1)6/20/2025103

ASMPacificTechnologyLtd.?2009TopPlateDimension(2)6/20/2025104

ASMPacificTechnologyLtd.?2009NexttoBondQuality6/20/2025105

ASMPacificTechnologyLtd.?2009BondQualityBasicRequirementforSuccessfulWireBondingBasicMeasurementWirePull&BallShearTestBondFailure6/20/2025106

ASMPacificTechnologyLtd.?2009BasicRequirementforSuccessfulWireBondingCleaningProperTemperatureSettingProperForceSettingProperPowerSettingProperClampingProperTooling6/20/2025107

ASMPacificTechnologyLtd.?2009CleaningMethodsThemetallizationmustbefreeoforganicandinorganiccontamination.Forexample,fingerprintoilonthebondingareareducesthereliabilityoftheinterconnection.Plasmacleaningiseffectiveforremovingepoxybleed-out,whichiscausedbyoutgassing.Gasestypicallyusedinplasmascanincludecombinationsofargon,nitrogen,hydrogen,oxygen,andotherlesscommongases

UVozonecleaningemitssignificantamountsofradiation(wavelengths1848Aand2537A)toremoveorganiccontaminants.6/20/2025108

ASMPacificTechnologyLtd.?2009ProperTemperatureSettingThermosonicbonding–100

C~150

C.Ultrasonicbonding–25

Corambienttemperature.Thermocompressionbonding–300

C~500

C.6/20/2025109

ASMPacificTechnologyLtd.?2009ProperPowerSettingToensurequalitybonds,increasethepowersettingwithoutexertingorover-stressingthewire.Youwillknowover-stressingistakingplacewhenthepulltestingdeviceindicatesalowbreak.6/20/2025110

ASMPacificTechnologyLtd.?2009ProperClampingMakesuretheunitisproperlyclampedintheworkholder,asitiscriticalthatnomovementtakesplace.Youcanverifythisbynudgingtheobjectwithtweezers.Ifmovementtakesplace,theunitmustbesecuredduringhighspeedbonding.6/20/2025111

ASMPacificTechnologyLtd.?2009ProperToolingMakesurethetool(thecapillary)isinfunctionalcondition.Thepropertoolselectionisessentialforconsistentwirebonding.6/20/2025112

ASMPacificTechnologyLtd.?2009BasicMeasurementProcessstabilityismeasuredaccordingtothefollowingperformancespecifications:FreeAirBalldiameter(min,max,std,Cpk)Balldiameter&height(min,max,std,Cpk)Loopheight&shape(min,max,std,Cpk)Ballshearforce&Strength(min,Cpk)Wirepullforce(min,Cpk)Ballplacementaccuracy(min,Cpk)Confirmationrun(stability,numberofassists,visualinspection,UPH)Capillarydimensionstolerances(SPECs,effectonprocess,lifetime)Overallprocessfeasibility(cost,demand,timetomarket)6/20/2025113

ASMPacificTechnologyLtd.?2009BondPadOpen&BondPadPitchUnit:umorMilBPO:

InternaldimensionofthepadinXandYaxisBPP:

DistanceofthepadcentertotheothernearbypadcenterBondPadPitchBondPadOpenBondPadOpen6/20/2025114

ASMPacificTechnologyLtd.?2009BallSizeBallThicknessBallSizeBallSize&BallThicknessUnit:um,Mil

MeasureMagnification:50XBallThicknessCalculateFormula:

60umBPP:WD=50%

60umBPP:WD=40%~50%BallSize=PadSize–6umBondPadPitchWireDiameter6/20/2025115

ASMPacificTechnologyLtd.?2009LoopHeightUnit:um,Mil

MeasureMagnification:20XLoopHeight線長6/20/2025116

ASMPacificTechnologyLtd.?2009WirePullTestNeckPull WirePull StitchPullDieLead1/3ofwirelengthGoldwire6/20/2025117

ASMPacificTechnologyLtd.?2009WirePullTestFactorsaffectingtheF:WirediameterWirelengthLoopheightPadtoleadplanegapProcessHooklocationTestercalibration,accuracyandvacuum6/20/2025118

ASMPacificTechnologyLtd.?2009WirePullTestGradeBrokenatReasonQuality1BallLiftBadprocessPoor2BallNeckH.A.Z.Good3WireDependsonconditionVerygood4WeldWelddeformationGood5StitchLiftBadprocessPoor6/20/2025119

ASMPacificTechnologyLtd.?2009WirePullTestGoodwedgesizecangiveoutstrong2ndbondAfterstitchpull,thewedgestillremainonlead(2ndbond)6/20/2025120

ASMPacificTechnologyLtd.?2009BallShearTestUnit:gramorg/mil2Inter-metallic(Coverageshouldhavemorethan75%,ShearStrength＞6.0g/mil2)SHEARSTRENGTH＝BallShear/Area(g/mil2)BallShear=x;BallSize=y;Area=π(y/2)2x/π(y/2)2=zg/mil26/20/2025121

ASMPacificTechnologyLtd.?2009Inter-metallicatGoldBallPoorcoverage(34%)Goodcoverage(>75%)6/20/2025122

ASMPacificTechnologyLtd.?2009Inter-metallicLayerThicknessX=Kt1/2WhereXistheinter-metalliclayerthickness,tisthetimeandKistherateconstantwhichiscalculatedbyfollowing:

K=Ce-E/KT

WhereCistherateconstant,eistheactivationenergy,KistheBoltzmanconstant,andTisthetemperatureinabsolutescale.6/20/2025123

ASMPacificTechnologyLtd.?2009CBallbondTestspecimenSpecimenclampShearing

ramWireBondshoulderInterfacialcontact

ballbondweldareaBondingpadh(A)UnshearedCLCBallbondCLTestspecimenSpecimenclampBondingpadFullballattachedtowire-exceptforregions

ofintermetallicvoidingBallseparatedatbondingpad-Ballinterface-residualintermetallic(andsometimesportionofunalloyedballandmetal)onpadinbondinteractionarea(D)Ballbond-bondingpadinterfaceseparation(typicalAutoAl)CTestspecimenSpecimenclampShearingramWireMinorfragmentofball

attachedtowireBondingpadCLBallshearedtoohigh

(offline,etc.)onlya

portionofshoulderand

balltopremovedInterfacialcontact

ballbondweldarea(B)Wire(balltopand/orside)shearCBallbondCLTestspecimenSpecimenclampShearing

ramBondingpadMajorportionofballattachedtowireInterfacialcontact-

ballbondweldareaintact(C)Belowcenterlineshear,ballshearedthrough(typicallyAutoAu)CBallbondCLTestspecimenSpecimenclampBondingpadPadmetallizationseparatesfrom

underlyingsurfaceResidualpadonballball-padinterface

remainsintact(E)BondpadliftsTestspecimenSpecimenclampCBallbondCLBondingpadBondingpadlifts,takingportionofunderlyingsubstratematerialwithit(F)CrateringResidualpadandsubstrateattached

toball,ball-padinterfaceremains

intactShearFailureModes6/20/2025124

ASMPacificTechnologyLtd.?2009NormalCondition6/20/2025125

ASMPacificTechnologyLtd.?2009MaterialProblem6/20/2025126

ASMPacificTechnologyLtd.?2009WithBallWirePadSizeMissingBallWireBrokenBondingBallInspectionBallDetection6/20/2025127

ASMPacificTechnologyLtd.?2009BallSizePadCenterBallCenterBallPlacement(X,Y)BallOffPadBondingBallInspection(cont.)BallMeasurement6/20/2025128

ASMPacificTechnologyLtd.?2009

Peeling1stBondFail(1)PossibleCauses:PowertoomuchBaseForcenotenoughAlpadnotfullycuredorcontaminationbetweenAlandoxidelayer6/20/2025129

ASMPacificTechnologyLtd.?2009

BallLift1stBondFail(2)BallLiftBallLiftWithPadPeelingPossibleCauses:BasePowernotenoughMaterialproblem6/20/2025130

ASMPacificTechnologyLtd.?20091stBondFail(3)NeckCrackPossibleCauses:RDtoohighRHtoolowWrong/overusedcapillaryWireClampgaptoosmallWireproblemEFOCurrenttoolarge6/20/2025131

ASMPacificTechnologyLtd.?2009OffCenterBallPossibleCauses:TailLengthtoolongWireorWirePathcontaminationEFOBoxorcableconnectionproblemAirTensionerflowtoolow1stBondFail(4)OffCenterBall(GolfBall)6/20/2025132

ASMPacificTechnologyLtd.?20091stBondFail(5)SmashBallPossibleCauses:TailLengthtooshortWireorE-torchcontaminationTipoftaillengthswingawayfromE-torchSmashBall6/20/2025133

ASMPacificTechnologyLtd.?20091stBondFail(6)MissingBallPossibleCauses:TailLengthtooshortFireLeveltoolowortoohighE-torchtipdirty2ndBondPower/Force/SearchSpeedtoohigh6/20/2025134

ASMPacificTechnologyLtd.?2009WithWeldWireCapillaryMarkMissingWeldBrokenWedgeLeadSufficientWedgeWidth&LengthSecureToolImpressionNoFishTailNoDamage/BrokenWedgeBondingWeldInspectionWeldDetection6/20/2025135

ASMPacificTechnologyLtd.?2009BrokenWedgePossibleCauses:2ndBondPower/ForcetoohighLeadclampingnotenough2ndBondFail(1)BrokenWedge6/20/2025136

ASMPacificTechnologyLtd.?2009