IPC-9151D

2012-May

ProcessCapability,Quality,andRelativeReliability(PCQR2)BenchmarkTestStandardandDatabase

SupersedesIPC-9151C

May2010

AstandarddevelopedbyIPC

AssociationConnectingElectronicsIndustries

?

ThePrinciplesofStandardization

InMay1995theIPC’sTechnicalActivitiesExecutiveCommittee(TAEC)adoptedPrinciplesofStandardizationasaguidingprincipleofIPC’sstandardizationefforts.

StandardsShould:

ShowrelationshiptoDesignforManufacturability(DFM)andDesignfortheEnvironment(DFE)

Minimizetimetomarket

Containsimple(simplified)language

Justincludespecinformation

Focusonendproductperformance

Includeafeedbacksystemonuseandproblemsforfutureimprovement

StandardsShouldNot:

Inhibitinnovation

Increasetime-to-market

Keeppeopleout

Increasecycletime

Tellyouhowtomakesomething

Containanythingthatcannotbedefendedwithdata

Notice IPCStandardsandPublicationsaredesignedtoservethepublicinterestthrougheliminatingmis-understandingsbetweenmanufacturersandpurchasers,facilitatinginterchangeabilityandimprove-mentofproducts,andassistingthepurchaserinselectingandobtainingwithminimumdelaytheproperproductforhisparticularneed.ExistenceofsuchStandardsandPublicationsshallnotinanyrespectprecludeanymemberornonmemberofIPCfrommanufacturingorsellingproductsnotconformingtosuchStandardsandPublication,norshalltheexistenceofsuchStandardsandPublicationsprecludetheirvoluntaryusebythoseotherthanIPCmembers,whetherthestandardistobeusedeitherdomesticallyorinternationally.

RecommendedStandardsandPublicationsareadoptedbyIPCwithoutregardtowhethertheiradop-tionmayinvolvepatentsonarticles,materials,orprocesses.Bysuchaction,IPCdoesnotassumeanyliabilitytoanypatentowner,nordotheyassumeanyobligationwhatevertopartiesadoptingtheRecommendedStandardorPublication.Usersarealsowhollyresponsibleforprotectingthem-selvesagainstallclaimsofliabilitiesforpatentinfringement.

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ItisthepositionofIPC’sTechnicalActivitiesExecutiveCommitteethattheuseandimplementationofIPCpublicationsisvoluntaryandispartofarelationshipenteredintobycustomerandsupplier.WhenanIPCpublicationisupdatedandanewrevisionispublished,itistheopinionoftheTAECthattheuseofthenewrevisionaspartofanexistingrelationshipisnotautomaticunlessrequiredbythecontract.TheTAECrecommendstheuseofthelatestrevision. AdoptedOctober6,1998

Whyisthereachargefor

thisdocument?

Yourpurchaseofthisdocumentcontributestotheongoingdevelopmentofnewandupdatedindus-trystandardsandpublications.Standardsallowmanufacturers,customers,andsupplierstounder-standoneanotherbetter.Standardsallowmanufacturersgreaterefficiencieswhentheycanset

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IPCspendshundredsofthousandsofdollarsannuallytosupportIPC’svolunteersinthestandardsandpublicationsdevelopmentprocess.Therearemanyroundsofdraftssentoutforreviewandthecommitteesspendhundredsofhoursinreviewanddevelopment.IPC’sstaffattendsandpar-ticipatesincommitteeactivities,typesetsandcirculatesdocumentdrafts,andfollowsallnecessaryprocedurestoqualifyforANSIapproval.

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?

IPC-9151D

PrintedBoardProcessCapability,Quality,andRelativeReliability(PCQR2)BenchmarkTestStandardandDatabase

DevelopedbythePCQR2Subcommittee(D-36)oftheRigidPrintedBoardCommittee(D-30)ofIPC

Supersedes:

IPC-9151C-May2010

IPC-9151B-February2007IPC-9151A-May2003

IPC-9151-June2002

Usersofthispublicationareencouragedtoparticipateinthedevelopmentoffuturerevisions.

Contact:

IPC

3000LakesideDrive,Suite309SBannockburn,Illinois

60015-1249

Tel847615.7100

Fax847615.7105

ThisPageIntentionallyLeftBlank

May2012 IPC-9151D

Acknowledgment

Anydocumentinvolvingacomplextechnologydrawsmaterialfromavastnumberofsources.WhiletheprincipalmembersoftheIPCPCQR2Subcommittee(D-36)oftheRigidPrintedBoardCommittee(D-30)areshownbelow,itisnotpossibletoincludeallofthosewhoassistedintheevolutionofthisstandard.Toeachofthem,themembersoftheIPCextendtheirgratitude.

RigidPrintedBoardCommittee

Chair

VickaWhiteHoneywellInc.-

AirTransportSystems

Vice-ChairDeboraObitz

TraceLaboratories-East

IPCPCQR2

Subcommittee

ChairGaryLong

IntelCorporation

Vice-ChairMichaelP.MillerNSWCCrane

TechnicalLiaisonoftheIPCBoardofDirectors

DongkaiShangguanFlextronicsInternational

ShaneWhitesideTTMTechnologies

IPCPCQR2Subcommittee

GregAlexander,Ascentech,LLCMarkAnselmi,GorillaCircuits,Inc.LanceAuer,RaytheonMissile

Systems

WendiBoger,DDiCorp.

ScottA.Bowles,L-3FuzingandOrdnanceSystems

CasimirBudzinski,SafariCircuitsInc.

MarkBuechner,BAESystemsMikeBusby,KCAElectronics

DeniseChevalier,AmphenolPrintedCircuits,Inc.

ChristineCoapman,DelphiElectronicsandSafety

TomCoghlan,BareBoardGroupDavidJ.Corbett,DefenseSupply

CenterColumbus

RobertDavidsonBareBoardGroupWilliamC.Dieffenbacher,BAE

SystemsPlatformSolutionsBrettDobens,GorillaCircuits,Inc.

C.DonDupriest,LockheedMartinMissiles&FireControl

PatriciaS.Dupuis,RaytheonCompany

TimothyA.Estes,ConductorAnalysisTechnologies,Inc.

GaryM.Ferrari,FTGCircuitsLionelFullwood,WKKDistribution

Ltd.

MahendraS.Gandhi,NorthropGrummanAerospaceSystems

StephenE.Garrett,SandiaNationalLabsAlbuquerque

RezaGhaffarian,JetPropulsionLaboratory

TyGragg,UnicircuitInc.

HueGreen,LockheedMartinSpaceSystemsCompany

MichaelR.Green,LockheedMartinSpaceSystemsCompany

AlishaA.Groop,LockheedMartinSpaceSystemsCompany

PhilipHenault,RaytheonCompanyMikeHill,DDiCorp.

GregHurst,BAESystemsRajeshC.Kumar,DDiCorp.

MarkLecuyer,RaytheonSystemsCompany

BeckyLewis,SpaceExplorationTechnologies

JeffLewis,HoladayCircuitsInc.CliffordR.Maddox,Boeing

Company

BrianD.Madsen,ContinentalAutomotiveSystems

KennethManning,RaytheonCompany

TimMcKliget,HoladayCircuitsInc.PeterMenuez,L-3Communications-

CincinnatiElectronics

PeterNavarro,BAESystems

RobertNeves,MicrotekLaboratoriesStevenM.Nolan,LockheedMartin

MaritimeSystems&Sensors

MarkR.Northrup,IECElectronicsCorp.

GerardO’Brien,SolderabilityTesting&Solutions,Inc.

PatrickO’Keefe,HoladayCircuitsInc.

AlOnderick,NationalInstrumentsMarkW.Osborn,ColonialCircuits

Inc.

MichaelPaddack,BoeingCompanyGregPapandrew,BareBoardGroupStephenG.Pierce,SGPVentures,

Inc.

FrankPorter,CoastalTechnicalServices

JohnM.Radman,TraceLaboratories

-Denver

RandyR.Reed,ViasystemsGroup,Inc.

PaulReid,PWBInterconnectSolutionsInc.

RonaldRhodes,ConductorAnalysisTechnologies,Inc.

JoseRios,EndicottInterconnectTechnologiesInc

NefRios,Cosmotronic

iii

IPC-9151D May2012

EdwardSandor,TaconicAdvancedDielectricDivision

KarlSauter,OracleAmerica,Inc.JosephSchmidt,RaytheonMissile

Systems

JeffSeekatz,RaytheonCompanyGilbertShelby,RaytheonSystems

Company

RobertSheldon,PioneerCircuitsInc.

RussellS.Shepherd,MicrotekLaboratories

LowellSherman,DefenseSupplyCenterColumbus

JeffShubrooks,RaytheonCompanyValerieA.St.Cyr,TeradyneInc.

GregVorhis,CoastalTechnicalServices

MatthewWalsh,NSWCCraneVickaWhite,HoneywellInc.Air

TransportSystems

DeweyWhittaker,HoneywellInc.AirTransportSystems

DavidL.Wolf,ConductorAnalysisTechnologies,Inc.

iv

May2012 IPC-9151D

TableofContents

SCOPE 1

Purpose 1

DocumentationHierarchy 1

DefinitionofTerms 1

ApplicableDocuments 2

PROCESSSUMMARY 2

Introduction 2

ProcessSteps 2

PROCESSCAPABILITYPANELDESIGNS 2

DesignLibrary 2

PanelLayouts 2

TestModulesandCoupons 2

ManufacturingRequirements 2

TESTANDANALYSIS 3

TestingandDataAnalysis 3

ViaReliabilityandConductiveAnodic

FilamentTesting 3

AssemblySimulation 3

ViaReliabilityTesting 3

ConductiveAnodicFilamentTesting 3

DATABASE 4

Data 4

DatabaseAccess 4

UPDATESANDREVISIONS 4

Tables

Table3-1 TestModuleStatisticalAttributes 3

Table4-1 Measurements 3

Table4-2 HATSCycle 3

Table4-3 ConductiveAnodicFilamentTestConditions 3

v

IPC-9151D May2012

ThisPageIntentionallyLeftBlank

vi

May2012 IPC-9151D

ProcessCapability,Quality,andRelativeReliability(PCQR2)BenchmarkTestStandardandDatabase

SCOPE

PurposeThepurposeofthisdocumentistodefinetheProcessCapability,Quality,andRelativeReliability(PCQR2)BenchmarkTestStandardandDatabaseProgramusedfortheevaluationofprintedboardmanufacturingprocesses.ThisisinaccordancewithTheNationalTechnologyRoadmapforElectronicInterconnections2000/2001publishedbyIPC,whichstatesthat‘‘Foracompanytoefficientlymanageitssupplychainitmustidentifythecapabilityofitssuppliersandmakecertainthattheircapabilityformanufacturingaproductisconsistentwiththeneedsofthecustomer.’’

DocumentationHierarchyAllotherIPCdocumentstakeprecedenceoverthisdocument.Thisdocumentwasdevel-opedbytheIPCD-36SubcommitteeoftheRigidPrintedBoardCommittee(D-30)ofIPC,anddescribestheprocesstoevaluatethemanufacturingprocesscapabilityofprintedboardfabricatorsforcertainkeyfeatures.

DefinitionofTermsThedefinitionofalltermsusedhereinshallbeasspecifiedinIPC-T-50andasdefinedbelow.

AnalysisReportDetailedstatisticaldataoneachfabricator’sdatabasesubmission.

ComparisonReportComparativestatisticaldataofeachfabricatorparticipatinginthedatabase.

ConductorAnalysisTechnologies,Inc.(CAT)Thecompanyprovidingandcontrollingtheintellectualpropertyassociatedwiththeprocesscapabilitypaneldesigns,testmethods,dataanalysistechniques,andthedatabase.

DatabaseSubmissionAsetofprocesscapabilitypanelssubmittedbyafabricatorfortesting,dataanalysis,andinclusioninthedatabase.

DatabaseSubscriberAcompanyoranorganization,ordivision(s)thereof,associatedwiththeelectronicsindustrythatobtainsaccesstothedatabasethroughanannualsubscriptionfromIPC.

DatabaseSupplierAfabricatorwhosubmitsasetofprocesscapabilitypanelsfortesting,dataanalysis,andinclusioninthedatabase.

DesignRequirementsFileThefileusedtodetailthespecificationsandmanufacturingrequirementsofeachprocesscapa-bilitypaneldesign.

DesignLibraryThefamilyofprocesscapabilitypaneldesignsdevelopedbytheIPCD-36Subcommittee.

FabricatorAspecificcompany’sororganization’sfacilitythatmanufacturesprintedboards.

PCQR2DatabaseTheelectronicstoragemediumforthedataandreportsgeneratedfromthetestingofprocesscapabilitypanels.

PeerReportComparativedatashowingparticipatingfabricatorperformancewithrespecttopeers.

ProcessCapabilityDataThedatageneratedfromthetestingofprocesscapabilitypanels.

ProcessCapabilityPanelAparametrictestpanelthatiscomprisedoftestmodulesdesignedtoevaluatespecificfeaturesofprintedboards.

SubmissionFormTheinformationprovidedbyfabricatorsuponsubmittingasetofprocesscapabilitypanelstothedata-base.

SubscriptionLicenseAgreementThemethodusedbysubscriberstogainaccesstothedatabasewhichisavailableat

.

TestModuleTheindividualelementofaprocesscapabilitypanel.

1

IPC-9151D May2012

ApplicableDocumentsThefollowingspecificationsoftherevisionineffectatthetimeoforderformapartofthisdocumenttotheextentspecifiedherein.

IPC-TM-650TestMethodsManual1

2.6.27 ThermalStress,ConvectionReflowAssemblySimulation

IPC-T-50TermsandDefinitionsforInterconnectingandPackagingElectronicCircuits

PROCESSSUMMARY

IntroductionManyprintedboardusershavedevelopedinternalprocessestoevaluatethecapabilitiesoftheirprintedboardfabricators.Asaresult,fabricatorsoftenreceiverequestsfrommultiplecustomerstomanufacturetestpanelsaspartofqualificationprocedures.ThePCQR2databaseprogramprovidesanindustrystandardforthedesignofthesetestpanels.Theresultingdataprovidessubscriberswiththeabilitytoreviewdetailedresultsfromindividualfabricators,tocomparethecapabilitiesofmultiplefabricators,andtoeliminatemultipleorredundantrequeststofabricators.

ProcessSteps

Attherequestofadatabasesubscriber(s)orontheirownbehalf,fabricatorsshalldownloadtheappropriateprocesscapabilitypaneldesigns,associatedrequirementsfiles,andsubmissionformsfromthedesignlibraryatwww.pcbquali-.

ThefabricatormanufacturestheprocesscapabilitypanelsusingtheirstandardprocessesperthespecificationsandrequirementsoutlinedinthedesignrequirementsfileandAABUS.

Thefabricatorcompletesthesubmissionformasinstructedintherequirementsfile,andshipsallpanelsatonetime.Testingwillnotbeginuntilallpanelsandthesubmissionformhavebeenreceived.

CATorathirdpartyfacilitylicensedbyIPCperformstherequiredtestingoftheprocesscapabilitypanels.AlldataanalysisandreportgenerationshallbeperformedbyCAT.

Reportsandsummaryinformationarepostedtothedatabaseat

.

Currentsubscribersareinformedofthepostingandofthefabricator’sidentitywithinthedatabase.

Thefabricatorisprovidedwithacopyoftheiranalysisreportandanapplicable‘‘peerreport’’fortheirsubmission.

TheprocesscapabilitypanelsarenotthepropertyofCATorIPC,andifrequestedwillbereturnedtotheownerwhenthetestinganddataanalysishasbeencompleted.Thepanelswillbestoredforaperiodoftwomonthsfromthepostingofthedata,afterwhichtimeCATmaydisposeofthepanels.UnclaimedpanelsmaybeusedbyCATand/orIPCforothercommittee-approvedactivities.

PROCESSCAPABILITYPANELDESIGNS

DesignLibraryThePCQR2processcapabilitypaneldesignsareprovidedunderlicensetoIPCbyCATforusebyitsmembersandtheprintedboardcommunity.ThedesignsaretobeusedexclusivelyforthesupportofthePCQR2databaseandrelatedactivities.Themostcurrentprocesscapabilitypaneldesignsarepostedat

.

PanelLayoutsTheprocesscapabilitypanelsconsistofanarrayof25.4x25.4mm[1.0x1.0in]testmodules,sev-eraltestcouponswithinthisarray,anda25.4mm[1.0in]borderthatincludesnomenclatureandalignmentfeatures.Anindividualdesignlayoutmapisincludedineachsetofdesignfilespostedat

.

Thetestmodulesandcoupontypesincludeconductor/space,viaregistration,viaformation,viareliability,soldermaskregistration,controlledimpedance,conductiveanodicfilamentandcross-section.

TestModulesandCouponsThetestmodules/couponsaredesignedtoallowevaluationofdetailedinformationonarangeoffeaturetypesandsizes.Table3-1detailstheinformationthatisobtainedfromeachofthemodules/coupons.

ManufacturingRequirementsEachofthedesignshasanaccompanyingrequirementsfilethatdescribesitsspecificfeaturesandmanufacturingrequirements.

1.CurrentandrevisedIPCTestMethodsareavailableontheIPCWebsite

(/html/testmethods.htm)

2

May2012 IPC-9151D

Table3-1TestModuleStatisticalAttributes

Module/Coupon

Capability

Quality

Reliability

Conductor/Space

Conductorandspaceyield

Conductorwidthandheightcontrol

–

ViaRegistration

Probabilityofbreakout

–

ViaFormation

Viayield

Resistancecontrol

ViaReliability

Cyclestofailure

SolderMaskRegistration

Probabilityofencroachment

–

ControlledImpedance

Impedancecontrol

–

ConductiveAnodicFilament

–

–

Timetofailure

TESTANDANALYSIS

TestingandDataAnalysisThepanelsshallbetestedbyCATorbyathird-partylicensedbyCATandapprovedbytheIPCD-36Subcommittee.Alldataanalysis,reportgeneration,andpostingtothedatabaseshallbeperformedbyCAT.ThetypeofmeasurementperformedoneachmoduleisdetailedinTable4-1.

Table4-1Measurements

Module/Coupon

MeasurementType

Conductor/Space

Precisionresistance

ViaRegistration

Resistance

ViaFormation

Precisionresistance

ViaReliability

Precisionresistance

SoldermaskRegistration

Resistance

ControlledImpedance

TimeDomainReflectometry(TDR)

ConductiveAnodicFilament

Voltage

ViaReliabilityandConductiveAnodicFilamentTesting

AssemblySimulationAfterinitialcapabilityandqualitytesting,representativereliabilityandconductiveanodicfilamentcouponsshallbesubjectedtosixcyclesofaconvectionsolderreflowprofile.TheconditioningandreflowprofilesshallbeinaccordancewithIPC-TM-650,Method2.6.27.ThereflowprofileusedwillbeAABUS.

ViaReliabilityTestingTheviareliabilitycouponsthataresubjectedtotheassemblysimulationprocessshallbethermal-cycledusingtheHighlyAcceleratedThermalShock(HATS)reliabilitytestmethodology,whichwasdevelopedfortheIPC-PCQR2program.ThetemperatureextremesandthenumberofcyclesaredetailedinTable4-2.

Table4-2HATSCycle

LowerTemperature

UpperTemperature

NumberofCycles

-40°C

+145°C

500oruntilopen

ConductiveAnodicFilamentTestingTheconductiveanodicfilamentcouponsthataresubjectedtotheassemblysimulationprocessshallbesubjectedtotemperature,humidityandbiasconditionsasdetailedinTable4-3.

Table4-3ConductiveAnodicFilamentTestConditions

Temperature

Humidity

Bias

Time

75°C

85%RH

48volts

500hoursoruntilfailure

3

IPC-9151D May2012

DATABASE

DataThedatacollectedfromeachsubmissioniscompiledintothedatabasethatdetailstheprocesscapability,qual-ity,andreliabilitydemonstratedbyfabricators.Thedatashallremainactiveforaperiodofthirty-sixmonthsfromthepost-ingdateafterwhichtimeitwillberemovedandarchived.

DatabaseAccessAccesstothedatabaseisprovidedonlythroughanannualsubscriptionfromIPC,andisbasedonthesubscribers’annualelectronicsrevenues.Subscribersareallowedaccesstoalldatabasereports,summaryinformationandfabricatoridentitiesduringthetermoftheirsubscription.

UPDATESANDREVISIONS

ThedesignlibraryanddatabasewillbereviewedandupdatedperiodicallybytheIPCD-36Subcommittee.Additions,dele-tions,andmodificationswillbemadetothedesignlibraryanddatabasetoreflecttheneedsofsubscribersandfabricators.Theserevisionsmustbeapprovedbytheactivesubscribers.Inallcases,themostcurrentrevisionsshallbeusedandarethecontrollingdocuments.Requeststosupportarchiveddesignsmorethanthreemonthsoldshallnotbeaccepted.

4

ANSI/IPC-T-50TermsandDefinitionsforInterconnectingandPackagingElectronicCircuitsDefinitionSubmission/ApprovalSheet

Thepurposeofthisformistokeepcurrentwithtermsroutinelyusedintheindustryandtheirdefinitions.

Individualsorcompaniesareinvitedtocomment.Pleasecompletethisformandreturnto:

IPC

3000LakesideDrive,Suite309SBannockburn,IL60015-1249

Fax:847615.7105

SUBMITTORINFORMATION:

Name: Company: City: State/Zip: Telephone: Date:

?ThisisaNEWtermanddefinitionbeingsubmitted.

?ThisisanADDITIONtoanexistingtermanddefinition(s).

?ThisisaCHANGEtoanexistingdefinition.

Term

Definition

Ifspacenotadequate,usereversesideorattachadditionalsheet(s).

Artwork:?NotApplicable ?Required ?Tobesupplied

?Included:ElectronicFileName: Document(s)towhichthistermapplies:

Committeesaffectedbythisterm:

OfficeUse

IPCOffice Committee2-30

DateReceived: DateofInitialReview: CommentsCollated: CommentResolution: ReturnedforAction: CommitteeAction:?Accepted ?RejectedRevisionInclusion: ?AcceptModify

IECClassification

ClassificationCode?SerialNumber

TermsandDefinitionCommitteeFinalApprovalAuthorization:

Committee2-30hasapprovedtheabovetermforreleaseinthenextrevision.

Name: Committee: IPC2-30 Date:

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