TheEnglishnameoftheencapsulationprocess目錄contentsIntroductiontoGluingProcessAdaptivematerialGluewrappingprocessflowApplicationexamplesofencapsulationtechnologyThedevelopmenttrendofencapsulationtechnology01IntroductiontoGluingProcessPackagingprocessdefinitionThepackagingprocessreferstotheprocessofintegratingelectroniccomponents,circuitboards,sensors,etc.intoaclosedshelltoachievefunctionssuchasprotection,isolation,andaesthetics.PackagingmaterialsCommonlyusedpackagingmaterialsincludeceramics,metals,plastics,etc.Differentpackagingmaterialshavedifferentcharacteristics,suchashightemperatureresistance,lowcost,lightweight,etc.PackagingtypesCommonpackagingtypesincludeDIP,SMD,QFN,QFP,etc.Eachpackagingtypehasitsspecificapplicationscenariosandadvantages.Definitionofencapsulationprocess010203ElectronicsindustryPackagingtechnologyiswidelyusedintheelectronicsindustry,suchashomeappliances,communications,computers,medicalelectronics,andotherfields.TheautomotiveindustryWiththeincreasingdegreeofautomotiveelectronicization,packagingtechnologyisgraduallybeingappliedintheautomotiveindustry,suchasautomotivecontrol,safetysystems,andotherfields.AerospaceTheaerospaceindustryhasextremelyhighrequirementsforproductreliabilityandstability,andpackagingtechnologycanimproveproductqualityandreliability.ApplicationfieldsofencapsulationtechnologyAdvantagesPackagingtechnologycanprotectinternalcomponents,improveproductstabilityandreliability;Simultaneouslycapableofachievingminiaturizationandlightweightdesign,facilitatingproducttransportationandinstallation;Itcanalsoimprovetheaestheticsoftheproduct.要點一要點二DisadvantagesPackagingtechnologyhasahighcost,whichwillincreasethemanufacturingcostoftheproduct;Atthesametime,somepackagingmaterialsmayhaveenvironmentalissues,whichcanhaveacertainimpactontheenvironment.Advantagesandadvantagesofencapsulationtechnology02AdaptivematerialThermoplasticElastomers(TPEs)areatypeofElastomerthathasthermoplasticpropertiesTheyareoftenusedasanalternativetothermosetElastomersbecausetheyhavebetterprocessabilityandrecyclabilityTPEscanbeusedinencapsulationprocessesbecausetheyhavegoodadhesionpropertiesandcanbeformulatedtohaveawiderangeofshorehardnessvaluesTheyareoftenusedintheproductionofmoldedpartsandextrudedprofilesThermoplasticElastomersSilicagelisatypeofadsorbentmaterialthatisoftenusedinencapsulationprocessesItisahighpopulationmaterialthatcanabsorblargeamountsofmoistureandothergasesSilicagelisoftenusedintheproductionofelectroniccomponentsandotherdevicesthatrequireprotectionfromenvironmentalfactorsItisalsousedintheproductionoffoodpackagingandotherconsumerproductsSilicagelVSRubberisatypeofElastomerthatiswidelyusedinencapsulationprocessesIthasgoodelasticity,abrasionresistance,andchemicalresistanceRubberisoftenusedintheproductionofmoldedparts,suchasgassealsandO-ringsItisalsousedintheproductionofextrudedprofilesandothertypesofrubberproductsRubberTPUstandsforthermoplasticpolyurethanes,whichisatypeofElastomerthathasgoodmechanicalproperties,abrasionresistance,andchemicalresistanceTPUisoftenusedintheproductionofmoldedpartsandextrudedprofilesItisalsousedintheproductionofshoesoles,clothing,andotherconsumerproductsTPU03GluewrappingprocessflowMaterialselectionSelectmaterialsthatarestrong,durable,andeasytocleanforthemoldToolingcostestimationEstimatethecostofmanufacturingthemoldbasedonmaterial,complexity,andotherfactorsMolddesignprinciplesEnsuretheencapsulation.Molddesignissuitablefortheproduct'sshape,size,andotherrequirementsDesignofencapsulationmoldSelectionofencapsulationmaterialsAdvisorpropertieslikevisibility,currenttime,andadhesionstrengthwhenselectingencapsulationmaterialsCompatibilityEnsuretheencapsulationmaterialiscompatiblewiththeproduct'ssurfacematerialanddoesnotcauseanychemicalreactionsCosteffectivenessSelectmaterialsthatprovidegoodperformanceatanaffordablecostMaterialpropertiesProcessingofencapsulationmaterialsControlthetemperatureofthematerialduringprocessingtoensureitremainswithintherecommendedtemperaturerangeTemperaturecontrolMixtheencapsulationmaterialsaccordingtothemanufacturer'sinstructionstoensureuniformityconsistencyMaterialmixingRemoveairbubblesfromtheencapsulationmaterialtopreventvoidsorairpocketsinthecurvedencapsulationMaterialdepletionApplicationmethodDeterminethebestmethodforapplyingtheencapsulationmaterial,suchaspooling,spraying,ordippingCuringprocessFollowtherecommendedcuttingprocesstoensuretheencapsulationmaterialfullycuredandreachesitspeakperformanceSurfacefinishingOncetheencapsulationmaterialiscurved,smoothanythroughareasoreffectsonthesurfaceusingappropriatetoolsorprocessesFormingofencapsulationmaterial04ApplicationexamplesofencapsulationtechnologyProtectingelectroniccomponentsThroughthepackagingprocess,electroniccomponentsaresealedinsideaprotectiveshelltopreventdamagefromexternalenvironmentssuchasmoisture,dust,mechanicaldamage,etc.ImprovingstabilityEncapsulatedelectroniccomponentscanbetteradapttovariousenvironmentalconditions,improvingtheirstabilityandreliability.EasytoinstallandmaintainEncapsulatedelectroniccomponentsareeasiertoinstallandmaintain,simplifyingproductionprocessesandreducingcosts.Electronicproductpackaging要點三WeatheringresistanceThepackagingadhesiveofautomotivecomponentshasgoodweatherresistanceandcanmaintainitsadhesionandsealingperformanceinvariousharshenvironments.要點一要點二HighviscosityThepackagingadhesiveforautomotivecomponentshashighviscosityandcantightlyadheretovariousmaterialsurfaces,ensuringsealingeffectiveness.HightemperatureresistanceThepackagingadhesiveforautomotivecomponentscanmaintainitsperformanceathightemperaturesandwillnotdeteriorateorloseitsstickinessduetotemperaturechanges.要點三AutomotivepartspackagingadaptiveSterilizationprotectionThepackagingofmedicalequipmentcanprotecttheequipmentfromdamageduringthesterilizationprocess,whileensuringthecleanlinessandsterilityoftheequipment.MoistureanddustpreventionThepackagingofmedicalequipmentcanpreventmoistureanddustfromenteringtheinterioroftheequipment,ensuringthenormaloperationandsafeuseoftheequipment.EasytransportationandstorageThepackagingofmedicalequipmentcanprotectthesafetyoftheequipmentduringtransportationandstorage,preventingdamageandloss.Medicaldevicepackaging05ThedevelopmenttrendofencapsulationtechnologyHighPerformanceSummary:Theencapsulationprocessisevolvingrewardsforhigherperformance,withimprovedencapsulationmaterialsandtechniquesDetailsAdvancedMaterials:Researchisongingtodevelopnewencapsulationmaterialswithimprovedbarrierproperties,durability,andflexibilityAdvancedTechnologies:Advancedmanufacturingtechnologies,suchas3Dprinting,arebeingusedtocreatemorecomplexandprecisionencapsulationsystemsImprovedPerformance:Thegoalistoachievebetterprotectionfortheenclosedmaterial,longershelflife,andmoreconsistentperformanceHighPerformanceSummary:EnvironmentalconcernsaredrivingthedevelopmentofgreenencapsulationprocessesandmaterialsEnvironmentalizationEnvironmentalizationDetailsBiodegradableMaterials:ResearchisfocusingonthedevelopmentofbiodegradableencapsulationmaterialsthatcanbedowngradedinacontrolledmanualReducedWaste:Encodingtheus