5G分布式小基站設(shè)備生產(chǎn)BOM5G主機(jī)BOM清單結(jié)構(gòu)套件BOM序號(hào)中文名稱描述用量單位1箱體-1套2箱蓋-1件3掛耳-2件4CPU散熱器-1塊5小散熱器1-1套6小散熱器2-1套7風(fēng)扇模組-2套8加速卡支架-1套9掛墻掛耳-2件8加速卡面板-2件數(shù)字板BOM序號(hào)中文名稱描述用量單位1BMCIC,BMCCONTROLLER,AST2500A2-GP,TFBGA-456-P,19MMX19MM,SMT1顆2處理器IC,CPU,1.9-3.2GHZ,16Core,105W,SKYLAKE_D,FCBGA25181顆3電池BAT,3V,LI/MNO2,0.225AH,COIN,CR2032顆4SATASSD硬盤DD,SSD,SATA,M.22280,512G1條5內(nèi)存條MM,288PIN,32GB,DDR4,3200MHZ,ECC,RDIMM1條6電源模塊TEM,PSU,800W,ACIN,12V/12VSBOUT,185MM*73.5MM*40MM,FSP1條724M晶振OSC,24.000M,20ppm,15pF,-10~70C,3.3V,5x3.2mm1顆825M晶振OSC,TCXO,25MHZ,CMOS,+/-20PPB,5.0MMX3.2MMX1.5MM,SMD1顆9RJ45+USB3.1CON,GBERJ45+USB3.1,WBI-COLOURLED,WMAG,WSURGEPROTECTION,TH1顆10NICIC,SPRINGVILLEGBECTRL,QFN,64P,SMT1顆11以太網(wǎng)phy芯片IC,CS4223,QUAD15GBPSPHYWITH8-PORTCDR,FCBGA1211顆12CPLDIC,CPLD,LCMXO3LF-2400C-5BG256C,2.5V/3.3V,HALOGEN-FREECABGA1顆13VRchipIC,SN1701021,DUAL-CHANNEL(6-PHASE+1-PHASE)D-CAP+TMSTEP-DOWNMULTIPHASECONTROLLER,VQFN483顆包裝BOM序號(hào)中文名稱描述用量單位1包裝箱-1個(gè)2內(nèi)紙盒-1個(gè)3側(cè)墊塊A-1件4側(cè)墊塊B-1件5防靜電膠袋-1個(gè)擴(kuò)展單元BOM清單結(jié)構(gòu)套件BOM序號(hào)中文名稱描述用量單位1箱體-1件2箱蓋-1件3擋風(fēng)板-1件4FAN支架-1件5導(dǎo)風(fēng)板-1件6底座-1件724X14X4硅膠墊-1件數(shù)字板BOM序號(hào)中文名稱描述用量單位1FPGA芯片10AX115H3F34I2SG1顆2CPLD芯片5M2270ZF256I5N1顆3微處理器AM3358BZCZA601顆4時(shí)鐘管理芯片SI5348A-E-GM1顆5NANDFlash芯片MX30LF4GE8AB-TI1顆6SDRAM存儲(chǔ)芯片MT47H128M16NF-5EIT:M1顆7磚式電源48S12EBC75T41顆8線性穩(wěn)壓器TPS73701DRV2顆9電壓轉(zhuǎn)換芯片MPQ8633BGLE-Z2顆10開關(guān)穩(wěn)壓電源芯片MP7273-3IR3顆11可延時(shí)編程監(jiān)控電路芯片TPS3808G01DBVR1顆12監(jiān)控電路芯片TPL5010DDCR1顆13開關(guān)穩(wěn)壓器MPQ8633BGLE-Z2顆14百兆以太網(wǎng)PHY芯片DP83848NRTAR2顆15POE電源管理芯片TPS328802顆16光電耦合器LTV-816S-TA1-D1顆17串行FRAMMB85RC64-G1顆18RS232驅(qū)動(dòng)芯片ZT3232LEEY,1顆19電平轉(zhuǎn)換芯片TXS0104EPWR1顆20石英晶體振蕩器OSCSMD7050,50MHz1顆21貼片晶振D3SX54E000006E1顆包裝BOM序號(hào)中文名稱描述用量單位1標(biāo)準(zhǔn)包裝箱-1個(gè)2下墊塊-1件3上墊塊-1件4黃綠色,地線BVV2.5,2m1條5膨脹螺栓M6×604個(gè)61U掛耳SW2200-A02-58192個(gè)7三芯電源線RVV1.0/3C300/500V2M+10A1根8鳳凰插頭2EDGK-5.08-02P-14-00AH8個(gè)遠(yuǎn)端單元BOM清單結(jié)構(gòu)套件BOM序號(hào)中文名稱描述用量單位1底座-1件2上蓋-1件3安裝架一-1件4小蓋板-1件5大蓋板-1件6掛釘-1件720X20X4.5硅膠-1件8導(dǎo)熱硅泥(導(dǎo)熱系數(shù)5.0)GN5000.005kg925×25×1,導(dǎo)熱硅膠墊SPC-10-G12件數(shù)字板BOM序號(hào)中文名稱描述用量單位1開關(guān)穩(wěn)壓電源芯片RT6235Q4個(gè)2DC電源芯片RT6279A1個(gè)3電壓轉(zhuǎn)換芯片TPS65251RHAR1個(gè)4LDO線性穩(wěn)壓芯片TPS7A7001DDA1個(gè)5電平轉(zhuǎn)換芯片TXS0104EPWR6個(gè)6功率放大器QPA99072個(gè)7N溝道場(chǎng)效應(yīng)管BSS138LT1G8個(gè)8低噪聲放大管BGU80534個(gè)9N型場(chǎng)效應(yīng)管CSD16301Q22個(gè)10低噪聲放大管GRF40022個(gè)11P溝道場(chǎng)效應(yīng)管NTR4101PT1G4個(gè)12單刀雙擲射頻開關(guān)PE4251MLI2個(gè)13插座mhf2792個(gè)14射頻開關(guān)RFSW8000TR72個(gè)15Flash存儲(chǔ)芯片MX25L25645EMI-10G1個(gè)16TVS管UDD32C05L017個(gè)17開關(guān)三極管(NPN)MMBT3904LT1G11個(gè)18處理器AM3358BZCZA601個(gè)19電平隔離轉(zhuǎn)換芯片Pai131U311個(gè)20FPGA芯片10CX115YF672I5G1個(gè)21信號(hào)收發(fā)器AD9379BBCZ1個(gè)22N溝道晶體管Si4490DY-T1-E31個(gè)23P溝道晶體管FQT3P20TF1個(gè)24巴侖HHM1711E16個(gè)25SFP+光模塊座子1888247-11個(gè)26貼片晶振D3SX54E000006E1個(gè)27陶瓷濾波器QF2595A1個(gè)288.000000MHz無(wú)源晶振SMD50321個(gè)29自恢復(fù)保險(xiǎn)絲FSMD020-60-R1個(gè)30正向環(huán)形器JCM2570T2655PM10-CB1個(gè)31反向環(huán)形器JCM2570T2655PM10C-CB1個(gè)32光電耦合器LTV-816S-TA1-D1個(gè)336針RJ11插座10217266F0011個(gè)34光模塊保護(hù)罩10730211W005,1×1SFP281個(gè)352芯電源插針MC1.5/2-GF-3.51個(gè)36磚式電源48S12EBC75T41個(gè)37時(shí)鐘管理