QC&FMEA中英文翻譯整理,,,,,QC&FMEA中英文翻譯整理,

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1,影響電性及外觀,Affectuponelectricalperformanceorappearance,,1,故障,failure\breakdown

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2,過(guò)度的,Excessively,,2,夾頭,gripholder

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3,異常,Abnormal,,3,解析度\解像度,resolution

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4,規(guī)格不符,specificationisbelowstandard,,4,可靠度,reliability

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5,品質(zhì)異常,qualityisbelowstandard,,5,孔位錯(cuò)誤(孔偏),misholelocation

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6,嚴(yán)格按照QC規(guī)定,StrictlyaccordingtoQCregulation,,6,孔徑\鉆孔直徑錯(cuò)誤,HoleDiametererror

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7,定期研磨,Tomakeregularlyre-sharpen,,7,離子污染度試驗(yàn),ioniccontaminationtesting

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8,設(shè)備,device(另義:主動(dòng)零件)\machine\equipment,,8,線距,linespace

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9,參數(shù)設(shè)置錯(cuò)誤,parameterssettingerror,,9,線寬,linewidth\tracewidth

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10,依保養(yǎng)計(jì)劃,Accordingtothemaintainingplan,,10,感光油墨,liquidphotoimageablesolderresistink

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11,壓力過(guò)小,lackofpressure,,11,批,batch\lot

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12,曝光不全\過(guò)度,exposure-energyinsufficient\excessive,,12,裂痕\白斑\(yùn)白點(diǎn)\白邊,crazing\mealing(白點(diǎn))\Haloing(白邊)

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13,間距不足,spacingnonenough,,13,對(duì)位不準(zhǔn),misregistration

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14,線細(xì),widthreduce,,14,釘頭,nailheading

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15,光強(qiáng)度,LightIntensity,,15,數(shù)位鉆孔機(jī),NCdrill

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16,缺口,nick\chipping,,16,原稿底片,originalartwork(A/W)

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17,氣泡,Bubble\blister\airinclusion,,17,鉆針重疊,overlap

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18,異物,foreignparticle\foreignmaterial（壓合異物）\dust(灰塵),,18,氧化,oxidation

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19,被污染,contaminated,,19,剝離\抗撕強(qiáng)度,peelstrength

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20,干膜附著力不足,Pooradhesionofdryfilm,,20,感光起始劑,photoinitiator

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21,固定點(diǎn)開(kāi)路,fixedpositionopen,,21,凹陷,dent

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22,固定點(diǎn)短路,fixedpositionshort,,22,塞孔,plughole\stuffing

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23,線路針孔,tracepin-hole,,23,補(bǔ)線不良,poortouch-up

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24,孔破,voidinPTHhole\BarrelCrack,,24,循環(huán)周期,Periodicallycycle

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25,斷脖子,Opennearpad,,25,初始資料,protocal

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26,靜置時(shí)間,Holdingtime,,26,噴砂,pumicescrub

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27,識(shí)別方法,identifymethod,,27,對(duì)位孔,registrationhole

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28,膜屑反粘,Contrarytoadhereofscum,,28,文字印刷,silkscreenprinting\printingoflegend

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29,"碎屑,殘材",Debris,,29,膠渣,resinsmear

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30,顯影不潔,Developinguncleanness,,30,孔壁粗糙度,roughtness

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31,外觀不良,Appearacedefective,,31,防焊文字,S/L

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32,傳動(dòng)\傳送速度,conveyspeed,,32,毛邊,serratededges

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33,偏離,deviation\shifted,,33,跳印,skipprinting

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34,單軸,singleaxis,,34,漂錫,solderfloat

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35,底片漲縮,A/Wexpandorcontract,,35,噴涂,spraycoating

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36,漏失率,LossRate,,36,刮刀,Squeegee

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37,補(bǔ)償,compensation\balancing,,37,孔規(guī),tapedholegauge

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38,零件孔\面,componenthole\side,,38,薄基板\內(nèi)層板,thincore

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39,"覆銅箔層壓板\

銅箔基板",coppercladlaminates(CCL),,39,"工作片

工作母片","workinggerber

workingmastergerber"

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40,線路露銅,copperexposure,,40,粗化,abrade

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41,織紋顯露,weaveexposure,,41,電流密度,CurrentDensity

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42,光學(xué)點(diǎn)\基準(zhǔn)標(biāo)記,fiducialmark,,42,風(fēng)刀,AirKnife

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43,環(huán)氧樹(shù)脂,epoxy,,43,獲取資格的,Qualify/qualified+n.or+to

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44,蝕刻速率,etchrate,,44,現(xiàn)場(chǎng),locality(PD)

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45,網(wǎng)布,fabric,,45,濃度偏低,Conc.Lower

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46,助焊劑不均勻,fluxcoatinguneven,,46,濃度偏高,Conc.Higher

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47,過(guò)濾,filtration,,47,人員疏忽,Operatorcareless

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48,電測(cè)治具,fixture,,48,經(jīng)緯向錯(cuò)誤,longitudeandlatitudecontrary

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49,鉆尖分離,gap,,49,上件不良,failedcomponmtmounting

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50,標(biāo)準(zhǔn)板,goldenboard,,50,防呆孔,Poka-Yokehole\mistakeproofinghole

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1,影響上件及外觀,affectuponmountingorappearance,,1,假性露銅,unrealcopperexposure

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2,銅厚測(cè)量?jī)x,CopperthicknessMeasuringInstrument,,2,積墨,inkaccumulation

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3,佐證,evidence,,3,印偏,inkprintingdeviated

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4,微蝕量,microetchingquantity,,4,遵照現(xiàn)場(chǎng)作業(yè)規(guī)範(fàn),complywiththehandlingstandardization

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5,濕度,humidity,,5,放置時(shí)間,Holdingtime

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6,內(nèi)部校正周期(校驗(yàn)矯正),internalproofreadcycle\calibrationsystemcycle,,6,烘乾溫度不足,Insufficientindrytemperature

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7,板面刮傷,SurfaceScratch,,7,設(shè)備故障,breakdownofmachine

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8,制定handling標(biāo)準(zhǔn),Definestandardofhandling,,8,壓膜滾輪,D/Flaminatedroller

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9,目視檢查\目檢,visualinspection,,9,sth.受損或污染,Damagedorcontaminated

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10,規(guī)定頻率,definedfrequency,,10,粘塵壓力,stickypressure

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11,壓力計(jì)\表,pressuregauge,,11,曝光燈管,exposurefluorescenttube

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12,工程程式,designedprogram,,12,光階,lightstepcondition

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13,超規(guī)格,outofthetolerance,,13,曝偏,Exposuremisregistration

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14,毛頭\去毛頭,burr\deburring,,14,層間對(duì)準(zhǔn)度,alignmentregistration

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15,影響下工序製作,difficulttoproductinthefollowingprocess,,15,吸氣不良,vacuumtreatmentabnormal

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16,化學(xué)銅,electrolessplating,,16,曝光藏點(diǎn),Exposureshelter

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17,除膠速率,desmearingrate,,17,人員動(dòng)作不當(dāng),improperhandling

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18,電流,current,,18,顯影,Developing

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19,分層,delamination\bulge,,19,蝕刻,Etching

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20,濕潤(rùn),Damped,,20,去膜,stripping

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21,預(yù)浸,Pre-dipped,,21,Mylar未撕,Mylarnontearingoff

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22,活化液,activator,,22,教育訓(xùn)練,instructionandtrainning

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23,速化,accelerator,,23,進(jìn)行顯破點(diǎn)測(cè)試,conductdevelopingpointbrokentest

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24,漂錫,solderfloat,,24,噴壓,Sprayingpressure

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25,熱應(yīng)力測(cè)試,thermalstresstest,,25,蝕刻不潔,Etchingincompletely\underetch

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26,孔環(huán)(焊墊),Liftedland\annularring,,26,蝕刻液,Etchants

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27,熱水洗,Hotwaterrinsing,,27,首件確認(rèn),Firstarticleconfirm

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28,震動(dòng)馬達(dá),vibratingmotor,,28,電性不良,Electricalperformancedefective

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29,銅渣,copperresidue(coppersplash)\cosmeticsisland獨(dú)立銅渣,,29,去膜不凈,Filmstrippinguncleanness

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30,清潔濾網(wǎng),purifyingfilters,,30,幾臺(tái)漏測(cè),Equipmenttestleaking

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31,定期換水,replacewaterregularly,,31,領(lǐng)班,Foreman

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32,回收槽,recoverytank,,32,主管,Chief

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33,加強(qiáng)管控,tostrengthenthecontrolofsth.,,33,穩(wěn)定性,Stability

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34,酸洗\鹼洗,acid\alkalirinse,,34,誤判,Misjudgement

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35,定期分析濃度,AnalyzeConc.regularly,,35,混料,Mixture

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36,金屬雜質(zhì)污染,Contaminationofmetalimpurities,,36,鋁粉濃度(火山灰),Aluminumpercentage

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37,碳化物,carbide,,37,超音波測(cè)試(錫箔紙),Tinfoilperforatingtest

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38,碳處理,carbontreatment,,38,水破測(cè)試,waterbrokentest

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39,整流器(電流矯正),Currentrectifier,,39,油墨黏度,inkviscosity

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40,銅厚測(cè)量?jī)x,CopperThicknessMeasuringInstrument,,40,黏度計(jì),viscosimeter

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41,刷磨速度,BrushSpeed,,41,數(shù)孔機(jī),holecounter

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42,速度控制器,velocitycontroller,,42,振動(dòng)馬達(dá),vibrationmotor

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43,電流控制器,currentcontroller,,43,網(wǎng)版調(diào)偏,netscreenmisregistration

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44,吸水滾輪破舊,water-absorptiverollerworn-out,,44,試印膜,trialprintingfilm

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45,新水補(bǔ)充不足,Insufficientforwaterreplenishment,,45,機(jī)臺(tái)未清潔,worktableuncleaness

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46,濾芯,Filterelement,,46,萬(wàn)用塞孔墊板,universalpluggingback-up

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47,化學(xué)藥液,chemicalsliquid,,47,預(yù)烤,Precure

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48,孔塞(孔內(nèi)異物),dirtyhole,,48,上錫\焊錫性不良,poorsolderability

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49,多與\少與1mil厚度,Less\Morethan1milThickness,,49,溫度均勻性,Temp.uniformability

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50,色差,colorvariation,,50,10倍放大鏡,10Xmagnifier

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1,板面粘油墨屑(顯影段),stickyinkdebris,,1,捲尺,measuringtape

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2,擋水滾輪,waterapartroller,,2,千分尺,micrometer

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3,網(wǎng)板高度,Screenheight,,3,剝離強(qiáng)度,Peelingstrength

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4,網(wǎng)板張力不足,Screentensioninsufficient,,4,尺寸安定性,Dimensionalstability

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5,刮刀行程,Squeegeedistance,,5,有害物質(zhì),Hazardoussubstance

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6,刮刀刃鈍化,Squeegeeedgeblunt,,6,元素分析儀,elementanalyzinginstrument

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7,油墨黏度過(guò)大,viscosityofinktoothick,,7,顯微鏡,microscope

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8,張力應(yīng)力,tensilestress,,8,遊標(biāo)卡尺,verniercaliper

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9,后烤,Postcure,,9,膜厚測(cè)量?jī)x,membranethicknessmeasuringintrument

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10,印C面,PrintingTop(COMP)Side,,10,銑刀,millingcutter\routingbit

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11,印S面,Printing(SOLD)BottomSide,,11,鉆針,drillbit

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12,靜電噴涂,SprayCoating,,12,化學(xué)元素,chemicalelements

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13,印可剝膠,PeelableSolderMask,,13,化學(xué)藥水,chemicalliquid

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14,風(fēng)刀,airknife,,14,裁切刀具,cuttingtool

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15,隔離環(huán),clearance,,15,控制面板,controlpanel

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16,燒焦,burning,,16,日點(diǎn)檢表,dailychecklist

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17,化鎳金,immersionnickelandgold,,17,光面油墨,glossygreenink\resist(阻焊劑防染劑)

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18,銅鎳層接著不良,Poorcombinationthecopperandnickel,,18,公差\誤差,tolerance\variance\bias(偏差)

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19,刷磨滾輪,brushroller,,19,量產(chǎn),massproduction

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20,刷幅測(cè)試,brushbreadth\widthtest,,20,白色文字,whiteident

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21,脫脂溫度,DefattingTemp.,,21,成型外型,routedoutline

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22,流量計(jì),flowmeter,,22,連片尺寸,PNLdrawingdimension

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23,執(zhí)行\(zhòng)導(dǎo)電,Conduct,,23,折斷邊,break-awaytabs

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24,助焊劑\熔合液,rosin(天然松香)\flux\fusingfluids,,24,檢查表,inspectionsheet

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25,錫粗,Tinroughness,,25,記錄表,datasheet\recordchart

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26,焊料中銅離子含量過(guò)高,Thecu2+contentoutofupperinsolder,,26,報(bào)表,reportforms

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27,機(jī)臺(tái)異常,machine-motionerror,,27,點(diǎn)檢表,Checklist

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28,缺點(diǎn)標(biāo)示卡,nominalcardofdefects,,28,磨邊機(jī),Grind-edgingmachine\Edger

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29,程序\程式錯(cuò)誤,Programbug,,29,打磨機(jī),polisher

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30,人員疏忽,operator'scarelessness,,30,板面光滑,Boardsurfacesmooth

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31,日保養(yǎng),dailymaintainance,,31,滴定法分析,Titrationanalysis

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32,人員技能不熟練,Operatorisnotskilled,,32,溫度計(jì),Temp.meter\Thermograph

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33,口頭考核,examineorally,,33,壓力計(jì),Pressuremeter

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34,阻抗異常,ImpedanceAbnormal,,34,能量格測(cè)試,Energy-steptablettest

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35,阻抗測(cè)量?jī)x,impedancemeasuringinstrument,,35,黏紙,viscositypaper

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36,漏氣,puncture,,36,六點(diǎn)測(cè)溫儀,SixpointsTemp.uniformabilitytestInstrument

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37,受潮,moistureabsorption,,37,催化劑,catalyst

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38,膜面污染,filmsurfacecontaminated,,38,穩(wěn)定劑\安定劑,stabilizer

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39,漏檢,Leakinginspection,,39,硫酸銅回收機(jī),CuSO4retrieveequipment

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40,二次元,2D(biaxial)dimension-measuringinstrument,,40,秒錶,stopwatch

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41,工單,runcard\workorder,,41,預(yù)熱,preheat

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42,飛針,FlyingProbe,,42,計(jì)時(shí)器,chronograph\timepiece

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43,目檢,VisualInspection,,43,能量計(jì),energymeter

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44,專用治具測(cè)試,DedicatedTester,,44,靶孔機(jī),targetholeequipment

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45,特殊特性,CriticalFeature,,45,銅含量,ThecontentsofCu

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46,重要特性,ImportantFeature,,46,液體比重計(jì),hydrometer

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47,銅箔厚度,CopperfoilThickness,,47,比重測(cè)定法,stereometry

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48,板彎翹,BowandTwist(warp),,48,殺菌劑,sterilant

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49,尺寸(含對(duì)角),Size(Diagonal)\dimensions(成型),,49,蝕刻因子,Etchingfactor\value\element

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50,拉力計(jì)\張力計(jì),tensilemeter,,50,自動(dòng)光學(xué)檢測(cè),Automaticalopticalinspection(AOI)

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1,棕化\黑化,Brow\blackoxide,,1,精度,Precision

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2,循環(huán)水洗,circulatingwaterrinsing,,2,棧板,pallet

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3,PP膠片,Prepreg,,3,電動(dòng)拖車(chē)\叉車(chē),electrictrailer\forklifter

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4,物理性質(zhì)\化學(xué)性質(zhì),physical\chemicalcharacter,,4,針盤(pán),bitholder

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5,暫存時(shí)間,Temporarystoretime,,5,放置架,placementrack

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6,鉚釘組合,Eyelet,,6,靜止消泡時(shí)間,static\restdefoamingtime

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7,疊板結(jié)構(gòu),stacking(layup)structure,,7,轉(zhuǎn)板,Transferplate

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8,鉚釘,rivet,,8,水性筆,Markpen

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9,熱熔機(jī),heat-meltingmachine,,9,尼龍\不織布\陶瓷,nylon\non-wovenfabric\ceramic

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10,有用壽命,usefullife,,10,比色計(jì),chromometer

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11,印製電路板,PrintedCircuitBoard(PCB),,11,濕度卡,HumidityIndicatorCards

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12,根本原因\真因,RootCause,,12,測(cè)溫儀,Thermoscope

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13,圍堵措施,ContainmentPlan,,13,龍門(mén)吊,gantrycrane

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14,現(xiàn)狀,CurrentStatus,,14,搖擺\擺動(dòng),swing

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15,原因分析,GapAnalysis,,15,PIN孔重合,pinholesuperposing

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16,內(nèi)部稽核\外部稽核,Internal\outsideAudit,,16,首躺,firstcycle

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17,修改\變更,Modify,,17,中和洗,neutralizationcleaning

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18,無(wú)鹵素,HalogenFree,,18,流量,flowamount

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19,更新\修訂,Update/Revise,,19,除膠速率,desmearrate

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20,改進(jìn)措施,urePlan,,20,濕潤(rùn)(電鍍),moisten

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21,長(zhǎng)期異常,Chronic,,21,獲準(zhǔn)供應(yīng)商,supplierwarrant

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22,突發(fā)異常,Excursion,,22,供應(yīng)商批準(zhǔn)程序書(shū),SupplierPartApprovalProcess(SPAP)

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23,陶爾(壓力單位),Torr,,23,V-cut殘厚,RemainthicknessofV-cut

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24,靶孔距,Spacebetweentargetholes,,24,冷媒油,refrigerantoil

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25,層偏,misalignment,,25,壓力腳,pressurefoot

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26,組合線,Combinedproducingline,,26,塊規(guī),blockgauge

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27,鋼板\隔板,steelplate\caulplate\separator,,27,高度規(guī),vernierheightgage

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28,板厚測(cè)量?jī)x,Board-thicknessmeasuringinstrument,,28,金剛砂,carborundum\Emery

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29,鋼印機(jī),steelsealmachine,,29,火山灰,volcanicash

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30,品質(zhì)檢驗(yàn),qualityexamination,,30,高阻計(jì),highresistancemeter

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31,介質(zhì)厚度,dielectricthickness,,31,模具圖,molddraw

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32,吸水性,moistureabsorbability,,32,支架,Chassis

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33,耐磨性,wearresistance,,33,治具,fixture

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34,剝離強(qiáng)度,strippingstrength,,34,超音波浸洗,ultrasonicdip

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35,焊錫耐熱性,heat-resistantofsolder,,35,酸浸,aciddipping

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36,抗麻斑測(cè)試,spot-resistanttest,,36,電流強(qiáng)度,currentamperage

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37,信賴性測(cè)試,reliabilitytest,,37,化驗(yàn)分析表,Assayanalysisreportforms

,,,,,,,

38,介電常數(shù)測(cè)量?jī)x,dielectricconstantmeasuringdevice,,38,加壓水洗,Pressurizedwaterrinsing

,,,,,,,

39,包裝標(biāo)籤,packingtag,,39,酸洗,acidrinsing

,,,,,,,

40,電子天平,electricalbalances,,40,溢流水洗,cascadewaterrinsing\overflow

,,,,,,,

41,焊錫爐,solderfurnace,,41,沉淀缸,sedimenttank

,,,,,,,

42,孔徑規(guī),callipergauge,,42,沖污水,wastewaterrinsing

,,,,,,,

43,比色計(jì),colorcomparingmeter,,43,水柱式?jīng)_洗,Jetcleaning

,,,,,,,

44,密度計(jì),densitymeter,,44,高壓水柱式?jīng)_洗,Highpressurerotatingjetrinse

,,,,,,,

45,蝕刻均勻性,Etchinguniformability,,45,清水洗,Freshwaterrinsing

,,,,,,,

46,化驗(yàn)單,laboratorylist,,46,干板組合,Dryingmodule

,,,,,,,

47,出貨單,manifest,,47,抗腐蝕測(cè)試,acceleratedcorrosiontest

,,,,,,,

48,雙面板\多層板,ReversibleBoard\Multilayerboard,,48,速化反應(yīng),acceleration

,,,,,,,

49,定位孔,LocationHole,,49,實(shí)際在製品,activeworkinprocess

,,,,,,,

50,疊板數(shù),stackboardscount,,50,總量,amount

,,,,,,,

1,硝基戊烷,amylnitrite,,1,高性能(電子)工業(yè)級(jí),highperformanceindustrial

,,,,,,,

2,陽(yáng)極泥,anodeslime(sludge),,2,高延展性銅箔,hightemperatureelongationcopper(HTEC)

,,,,,,,

3,液態(tài)光阻,aqueousphotoresist,,3,高溫樹(shù)脂,hightemperatureepoxy(HTE)

,,,,,,,

4,縱橫比,aspectratio,,4,孔數(shù),holenumber

,,,,,,,

5,預(yù)留在製品,bankedworkinprocess,,5,哈氏槽,hullcell

,,,,,,,

6,貝他射線照射法,betabackscattering,,6,水解,hydrolysis

,,,,,,,

7,斜邊,beveling,,7,改善方案,implementation

,,,,,,,

8,吹孔,blowhole,,8,努普(硬度單位),Knoop(Hardness)

,,,,,,,

9,黏結(jié)層,bondingplies,,9,牛皮紙,kraftpaper

,,,,,,,

10,焊橋,solderbridge,,10,壓膜機(jī),laminator

,,,,,,,

11,接單生產(chǎn),BuildToOrder(BTO),,11,刃角磨損,layback

,,,,,,,

12,金手指斜邊\倒角,chamfering,,12,牽引\定位螺絲,leadscrew

,,,,,,,

13,網(wǎng)框,chase,,13,平整劑,levellingadditive

,,,,,,,

14,螯合劑,chelator,,14,線性可變差動(dòng)轉(zhuǎn)換器,linearvariabledifferentialtransformer(LVDL)

,,,,,,,

15,化學(xué)鍵,chemicalbond,,15,刷磨清潔法,machinescrub

,,,,,,,

16,熱膨脹,ThermalExpansion,,16,鉆頭刃帶,margin

,,,,,,,

17,同心圓,concentriccircle,,17,主圖\機(jī)構(gòu)圖,masterdrawing

,,,,,,,

18,密貼性,conformance,,18,基材利用率,materialusefactor

,,,,,,,

19,消費(fèi)類產(chǎn)品,consumerproducts,,19,濕度與絕緣電阻測(cè)試,moistureandinsulationresistancetest

,,,,,,,

20,庫(kù)倫定理,coulombslaw,,20,鋸齒\蝕刻缺口,mousebite

,,,,,,,

21,喇叭孔,countersink,,21,負(fù)片,negativefilm

,,,,,,,

22,試樣,coupon\sample,,22,結(jié)瘤\銅瘤,nodule

,,,,,,,

23,覆蓋力,coveringpower,,23,流膠量百分比,resinflowpercentage

,,,,,,,

24,挖空,cut-outs,,24,膠含量,resincontent

,,,,,,,

25,交期縮短,cycle-timereduction,,25,報(bào)廢因素,obsolescencefactor

,,,,,,,

26,專用型,dedicated,,26,一銅,panelplating

,,,,,,,

27,縮錫,dewetting,,27,二銅,patternplating

,,,,,,,

28,介質(zhì)常數(shù),dielectricconstant,,28,透電率\介電常熟,permittivity

,,,,,,,

29,孔黑\孔灰,discolorhole,,29,極性吸引力,polar-polarinteraction

,,,,,,,

30,停機(jī)\稼動(dòng)時(shí)間,downtime\uptime,,30,聚酯類,polyester

,,,,,,,

31,鉆針切削面,drillfacet,,31,孔變形,poordrill

,,,,,,,

32,鉆針研磨機(jī),drillpointer,,32,預(yù)聚合物,prepolymer

,,,,,,,

33,裸板(未鍍銅),blankboard,,33,原始資料,protocal

,,,,,,,

34,延展性,ductility\Elongation,,34,噴砂清潔法,pumicescrub

,,,,,,,

35,留邊寬度,edgespacing,,35,掛架,rack

,,,,,,,

36,金手指,edge-boardcontact(goldfinger)\tab,,36,折光率,refraction

,,,,,,,

37,電化學(xué)反應(yīng)器,electrochemicalreactor,,37,對(duì)位元用標(biāo)記,registermark(對(duì)位點(diǎn))

,,,,,,,

38,脆性,embrittlement,,38,孔內(nèi)沾文字,S/Lonhole

,,,,,,,

39,植PIN法\外部插梢法,externalpinmethod,,39,孔內(nèi)防焊,S/Monhole

,,,,,,,

40,織維突出,fiberprotrusion,,40,干膜屑\透明殘膜,scum

,,,,,,,

41,成品,finalboard,,41,漏印\跳印,skipprinting

,,,,,,,

42,固著,fixing,,42,表面附著元件,SMD(surfacemountdevice)

,,,,,,,

43,燃燒等級(jí),flammabilityrating,,43,表面附著技術(shù),SMT(surfacemounttechnology)

,,,,,,,

44,抗菌性\抗酶性,fungusresistance,,44,錫突,solderbump

,,,,,,,

45,膠化時(shí)間,geltime,,45,漂錫,solderfloat

,,,,,,,

46,一般阻焊油墨,generalresistink,,46,油墨附著力,soldermaskadhesion

,,,,,,,

47,玻璃態(tài)轉(zhuǎn)換溫度,glasstransitiontemperature(Tg),,47,金手指上錫,solderonG/F

,,,,,,,

48,多孔\少孔,Extra/MissingHole,,48,線路沾錫,solderontrace

,,,,,,,

49,硬化劑,hardener,,49,錫塞,solderplug

,,,,,,,

50,空氣濾清器\過(guò)濾器,hepafilter,,50,統(tǒng)計(jì)制程管控,SPC(StatisticalProcessControl)

,,,,,,,

1,規(guī)範(fàn),specification\standard,,1,自檢,Self-examine

,,,,,,,

2,銑靶,spotface,,2,檸檬酸濃度,Citricacidconc.

,,,,,,,

3,衝壓\鋼印,stamping,,3,液位,LiquidLevel

,,,,,,,

4,標(biāo)準(zhǔn)液壓法,standardhydrauliclamination,,4,析出物,educt

,,,,,,,

5,缺膠,starvation,,5,垂直的,perpendicular

,,,,,,,

6,應(yīng)力\應(yīng)度,strain,,6,噴砂能力,pumicecapability

,,,,,,,

7,應(yīng)力計(jì),stressmeter,,7,閥門(mén),Valve

,,,,,,,

8,板面突起,surfaceconvex\swelling,,8,外包加工,contract-production

,,,,,,,

9,板面檢查,surfaceexamination,,9,退貨拒收,REJ(reject)

,,,,,,,

10,板面粗糙度,surfaceroughness,,10,植PIN深度,Depthofexternalpin

,,,,,,,

11,熱震蕩試驗(yàn),thermalshock,,11,上PIN,beatPIN

,,,,,,,

12,厚度不均,uneventhicknessdistribution,,12,精確度,Precision

,,,,,,,

13,抗污抗氧化劑,tarnishandoxideresist,,13,準(zhǔn)確度,accuracy

,,,,,,,

14,透光度,transmittance,,14,操作員技術(shù)不嫻熟,operatortechniqueunskilled

,,,,,,,

15,裁切線,trimline,,15,套環(huán)深度,depthofsleeve-ring

,,,,,,,

16,測(cè)試,undercut,,16,精修(成型),finelycouting

,,,,,,,

17,萬(wàn)用型,universal,,17,漏鉆\漏撈,Leakingdrilling\routing

,,,,,,,

18,有形庫(kù)存,visibleinventory,,18,多鉆\多撈,surplusdrilling\routing

,,,,,,,

19,倉(cāng)庫(kù),warehouse,,19,排屑,chipload

,,,,,,,

20,濕化學(xué)制程,wetchemistryprocess,,20,排屑槽,flute

,,,,,,,

21,燈芯\滲銅,wicking,,21,蜂鳴器,checkbeeper

,,,,,,,

22,縱橫比,width-to-thicknessratio,,22,建立檔案資料(建檔),Archivedatabuilding

,,,,,,,

23,良率,yield,,23,合格,qualified

,,,,,,,

24,點(diǎn)燈次數(shù),TimesofLightswitch,,24,電子稱,Electronicscale

,,,,,,,

25,真空延遲時(shí)間,Vacuumdelayedtime,,25,封口時(shí)間,sealingtime

,,,,,,,

26,+/-2周,Thefrontorreartwoweeks,,26,超出範(fàn)圍,outofscope

,,,,,,,

27,無(wú)塵室,cleanroom,,27,微蝕速率,Micro-etchingratio

,,,,,,,

28,上噴壓,Upperspraypressure,,28,變色\褪色,discolor

,,,,,,,

29,下噴壓,Lowerspraypressure,,29,破損,breakage

,,,,,,,

30,顯影劑,developer,,30,電導(dǎo)率,conductanceratio

,,,,,,,

31,主軸轉(zhuǎn)速(RPM),SpindleRevolutionSpeed\RevolutionPerMinuteRPM,,31,履歷表,biographicsketch

,,,,,,,

32,光電耦合器,(ChargeCoupleDevice)CCD,,32,公式,formula

,,,,,,,

33,90°孔切破,90degreebreakage,,33,擴(kuò)孔針,reamingdrillbit

,,,,,,,

34,缺點(diǎn)偵測(cè)\檢測(cè),defectdetection,,34,電木板,bakeliteboard

,,,,,,,

35,聚焦,focus,,35,允收水準(zhǔn),generalcriteria

,,,,,,,

36,光校正,calibration,,36,理想狀況,TargetCondition

,,,,,,,

37,極性,Polarity,,37,模板\模具,Template

,,,,,,,

38,正極\陽(yáng)極,Positive,,38,基準(zhǔn)孔,referenceholes

,,,,,,,

39,負(fù)極\陰極,Negative,,39,壓敏開(kāi)關(guān),Piezo-switch

,,,,,,,

40,下鉆點(diǎn)\下刀點(diǎn),entry,,40,指示燈,indicator

,,,,,,,

41,量杯,measuringcup,,41,直方圖,Histogram

,,,,,,,

42,微切片,Microsection,,42,并聯(lián)導(dǎo)體,parallelconductors

,,,,,,,

43,爆孔,holebreakout(鑽孔)\holeoverflow(防焊油墨),,43,導(dǎo)體連接處,areaofadjacentconductors

,,,,,,,

44,溫差,temperaturedifference,,44,金屬導(dǎo)體,Metalconductors

,,,,,,,

45,文字不清,marking(symbol)blurred,,45,防焊?jìng)?cè)露(焊墊\線路),Adjacentisolatedlandsorconductorsexposed

,,,,,,,

46,文字白點(diǎn),S/Lwhitepoint,,46,有害物質(zhì)公約,RestrictionofHazardousSubstances(RoHS)

,,,,,,,

47,補(bǔ)充顯影,additionaldeveloping,,47,預(yù)防措施,Precaution

,,,,,,,

48,烘烤,baking,,48,生物可降解,Biodegradability

,,,,,,,

49,確認(rèn)檢修系統(tǒng),VisualRepairSystem(VRS),,49,生態(tài)環(huán)境,ecology

,,,,,,,

50,圖表,Diagram,,50,(垃圾\廢棄物)處理,Disposal

,,,,,,,

1,腐蝕,Corrosive,,1,浸焊,ImmersionSoldering

,,,,,,,

2,致癌物,carcinogenic,,2,焊接點(diǎn),SolderJoint

,,,,,,,

3,有機(jī)體突變的,Mutagenic,,3,焊錫絲,SolderWire

,,,,,,,

4,染色體錯(cuò)位,chromosomeaberration,,4,待工溫度,IdleTemp.\+Time(空轉(zhuǎn)時(shí)間)

,,,,,,,

5,畸形,teratogenic,,5,靜電釋放,ElectrostaticDischarge(ESD)

,,,,,,,

6,有害氣體,poisonousgas,,6,靜電壓力,ElectrostaticOverstress(ESO)

,,,,,,,

7,易燃性,Inflammability,,7,電阻係數(shù),ElectricalResistivity

,,,,,,,

8,爆炸性,explosion,,8,內(nèi)應(yīng)力,InternalStress

,,,,,,,

9,吸入\吸入劑,inhalation,,9,導(dǎo)熱係數(shù),ThermalConductivity

,,,,,,,

10,護(hù)目鏡,goggle,,10,磷含量,Phosphorous

,,,,,,,

11,棉手套,Cottonglove,,11,顆粒大小,GrainSize(μm)

,,,,,,,

12,化學(xué)特性,Chemicalproperties,,12,X光測(cè)量,X-rayDiffraction

,,,,,,,

13,熔點(diǎn),Meltingpoint,,13,抗拉強(qiáng)度,TensilStrength(N/mm2)

,,,,,,,

14,抽樣檢查,spotcheck,,14,介面化合物,IntermstallicCompound(IMC)

,,,,,,,

15,沸水,boilingwater,,15,賈凡尼效應(yīng),GalvanicEffect(不同金屬電位差加速腐蝕)

,,,,,,,

16,沖模,Punching,,16,高頻信號(hào),HighFrequencySignal

,,,,,,,

17,氫溴化物,hydrochloride,,17,肌膚效應(yīng),SkinEffect(高頻線路沿道題表面?zhèn)鬏?

,,,,,,,

18,醇\酒精,alcohol,,18,阻隔效應(yīng),BarrierEffect(合金層可有效減低離子遷移度)

,,,,,,,

19,持續(xù)改進(jìn),continualimprovement,,19,銀,Silver

,,,,,,,

20,糾正措施,correctiveaction,,20,硫酸,sulfuricacid

,,,,,,,

21,環(huán)境因素\影響\方針,environmentaspect\impact\policy,,21,儀器,Apparatus(測(cè)試用儀器)

,,,,,,,

22,環(huán)境管理體系,environmentmanagementsystem,,22,拋光,Polish

,,,,,,,

23,污染預(yù)防,preventionofpollution,,23,磨切片,grindmicrosection

,,,,,,,

24,品質(zhì)關(guān)鍵點(diǎn),criticaltoquality(CTQ),,24,文件保存期限,Documentationofage

,,,,,,,

25,客戶需求分析,CustomerNeedsMapping(CNM),,25,內(nèi)部管理政策,InternalPolicies

,,,,,,,

26,質(zhì)量功能分布,QualityFunctionDeployment(QFD),,26,工資支付,Salarypayments

,,,,,,,

27,失效模式及後果分析,FailureMode&EffectsAnalysis(FMEA),,27,責(zé)任書(shū),Responsibility

,,,,,,,

28,跨功能小組,Cross-functionalinvolvement,,28,法定最小年齡,Thelegalminimumage

,,,,,,,

29,傳感器,sensor,,29,熟練\技能,Facility

,,,,,,,

30,點(diǎn)陣圖,tallychart,,30,隱私權(quán),righttoprivacy

,,,,,,,

31,全面品質(zhì)管理,TotalQualityManagement(TQM)如QC七大手法,,31,貪污\腐敗,corruption

,,,,,,,

32,柏拉圖,ParetoChart,,32,有效日期,validperiod

,,,,,,,

33,因果圖\魚(yú)骨圖,CauseandEffectdiagrams,,33,溫度循環(huán)實(shí)驗(yàn),TemperatureCyclingTest(TCT)

,,,,,,,

34,腦力激蕩,Brainstorming,,34,熱衝擊實(shí)驗(yàn),ThermalShockTest(TST)

,,,,,,,

35,散布圖,Scatterdiagrams,,35,離子遷移試驗(yàn),ElectrochemicalMigrationTest(ECM)

,,,,,,,

36,全面設(shè)備保養(yǎng),TotalProductiveMaintenance(TPM),,36,絕緣電阻試驗(yàn),SurfaceInsulationResistance(SIR)

,,,,,,,

37,控製圖,ConttrolChart,,37,陽(yáng)極燈絲,ConductiveAnodeFilament(CAF)

,,,,,,,

38,測(cè)定系統(tǒng)分析,GageRepeatability&Reproducibility(GRR),,38,爆板,popcorn

,,,,,,,

39,印製電路板協(xié)會(huì),Instituteofprintedcircuit(IPC),,39,生產(chǎn)車(chē)間,FabricatingPlant

,,,,,,,

40,有機(jī)保焊膜,OrganicSolderabilityPreservative(OSP),,40,吊車(chē),crane

,,,,,,,

41,進(jìn)刀,Feed,,41,危險(xiǎn)物品,hazardoussubstance

,,,,,,,

42,金鹽,PotassiumGoldCyanide(金氰化鉀PGC),,42,文字脫落,symbolfading

,,,,,,,

43,輻射式紅外線焊接,Radiation(輻射)InfraredRays(IR)Reflow(焊接),,43,鋸齒,Worm-Eaten-Crack

,,,,,,,

44,錫膏熔焊,ReflowSoldering,,44,經(jīng)緯方向,GrainDirection

,,,,,,,

45,縮錫,Dewetting,,45,V-cut,Slit

,,,,,,,

46,錫爐浮渣,Dross,,46,幻燈片,slide

,,,,,,,

47,錫尖,SolderIcicle,,47,預(yù)算,budget

,,,,,,,

48,錫球,SolderBall,,48,運(yùn)輸工具,transport

,,,,,,,

49,電容器,capacitor,,