1、-. z. - - s-PCB封裝設(shè)計(jì)規(guī)*文件編號(hào):受控標(biāo)識(shí):版本狀態(tài):發(fā)放序號(hào): 日期： 日期： 日期：目 錄TOC o 1-3 h z uHYPERLINK l _Toc2552199701、目的 PAGEREF _Toc255219970 h 3HYPERLINK l _Toc2552199712、適用*圍 PAGEREF _Toc255219971 h 4HYPERLINK l _Toc2552199723、職責(zé) PAGEREF _Toc255219972 h 4HYPERLINK l _Toc2552199734、術(shù)語定義 PAGEREF _Toc255219973 h 4HYPER

2、LINK l _Toc2552199745、引用標(biāo)準(zhǔn) PAGEREF _Toc255219974 h 4HYPERLINK l _Toc2552199756、PCB封裝設(shè)計(jì)過程框圖 PAGEREF _Toc255219975 h 4HYPERLINK l _Toc2552199767、SMC外表組裝元件封裝及命名簡介 PAGEREF _Toc255219976 h 5HYPERLINK l _Toc2552199778、SMD外表組裝器件封裝及命名簡介 PAGEREF _Toc255219977 h 6HYPERLINK l _Toc2552199789、設(shè)計(jì)規(guī)則 PAGEREF _Toc25

3、5219978 h 6HYPERLINK l _Toc25521997910、PCB封裝設(shè)計(jì)命名方式 PAGEREF _Toc255219979 h 7HYPERLINK l _Toc25521998011、PCB封裝放置入庫方式 PAGEREF _Toc255219980 h 7HYPERLINK l _Toc25521998112、封裝設(shè)計(jì)分類 PAGEREF _Toc255219981 h 7HYPERLINK l _Toc25521998212.1、矩形元件標(biāo)準(zhǔn)類 PAGEREF _Toc255219982 h 7HYPERLINK l _Toc25521998312.2、圓形元件標(biāo)準(zhǔn)

4、類 PAGEREF _Toc255219983 h 16HYPERLINK l _Toc25521998412.3、小外形晶體管SOT及二極管SOD標(biāo)準(zhǔn)類 PAGEREF _Toc255219984 h18HYPERLINK l _Toc25521998512.4、集成電路IC標(biāo)準(zhǔn)類 PAGEREF _Toc255219985 h 24HYPERLINK l _Toc25521998612.5、微波器件非標(biāo)準(zhǔn)類 PAGEREF _Toc255219986 h 34HYPERLINK l _Toc25521998712.6、接插件非標(biāo)準(zhǔn)類 PAGEREF _Toc255219987 h 361、

5、目的本規(guī)*是為電子元器件的外表屬性提供模版信息，即為外表器件焊盤圖形設(shè)計(jì)提供模版尺寸，外形以及公差，以便檢查和測(cè)試，確保外表裝配產(chǎn)品的可靠性，從而規(guī)*電子元器件的PCB封裝設(shè)計(jì)2、適用*圍本規(guī)*適用于研發(fā)中心PCB部所有PCB封裝的設(shè)計(jì)。3、職 責(zé)PCB封裝庫評(píng)審由PCB部門經(jīng)理與工藝部門經(jīng)理共同評(píng)審?fù)瓿?，特殊封裝除外。PCB部門專職PCB封裝設(shè)計(jì)人員負(fù)責(zé)PCB封裝庫的設(shè)計(jì)、評(píng)審和更新。4、術(shù)語定義PCBPrint circuit Board)：印刷電路板Footprint：封裝ICintegrated circuits：集成電路SMCSurface Mounted ponents：外表組裝元

6、件SMDSurface Mounted Devices：外表組裝器件5、引用標(biāo)準(zhǔn)以下標(biāo)準(zhǔn)包含的條文，通過在本規(guī)*中引用而構(gòu)本錢規(guī)*的條文。在規(guī)*歸檔時(shí)，所示版本均為有效。所有規(guī)*都會(huì)被修訂，使用本規(guī)*的各方應(yīng)探討，使用以下標(biāo)準(zhǔn)最新版本的可能性。IPC Batch Footprint Generator ReferenceIPC-7351 Generic Requirements forSurface Mount Design andLand Pattern StandardIPC-SM-782ASurface Mount Design andLand Pattern Standard外表組裝技

7、術(shù)根底與可制造性設(shè)計(jì)6、PCB封裝設(shè)計(jì)過程框圖器件部SCH封裝庫設(shè)計(jì)完成后，把DATASHEET輸入給PCB部封裝設(shè)計(jì)人員設(shè)計(jì)PCB器件封裝評(píng)審載入PCB封裝庫更新上傳封裝設(shè)計(jì)人員把PCB封裝定義名稱返回給器件部SCH封裝設(shè)計(jì)人員與之統(tǒng)一通過不通過 圖 6.1 PCB封裝設(shè)計(jì)過程框圖7、SMC外表組裝元件封裝及命名簡介SMC主要是指無源元件的機(jī)電元件，包括各種電阻器、陶瓷電容器、鋁電解電容器、電感器、磁珠、陶瓷振子、濾波器、電阻網(wǎng)絡(luò)、電容網(wǎng)絡(luò)、微調(diào)電容器、電位器、各種開關(guān)、繼電器、連接器等，封裝形狀有矩形、圓柱形、復(fù)合形和異形。SMC的封裝是以元件的外形尺寸來命名的，其標(biāo)稱以3位或4位數(shù)字來表

8、示，SMC的封裝命名及標(biāo)稱已經(jīng)標(biāo)準(zhǔn)化。SMC常用外形尺寸長度和寬度命名，來標(biāo)志其外形大小，通常有公制mm和英制inch兩種表示方法。公制mm/英制inch轉(zhuǎn)換式如下：25.4mm英制inch尺寸=公制mm尺寸例如：08050.08inch0.05inch英制轉(zhuǎn)換為公制元件長度=25.4mm0.08=2.0322.0mm元件寬度=25.4mm0.05=1.271.25mm0805的公制表示法為21252.0mm1.25mm8、SMD外表組裝器件封裝及命名簡介SMD主要是指有源器件，包括半導(dǎo)體分立器件二極管、三極管和半導(dǎo)體特殊器件、集成電路。SMD是貼在PCB外表的，而不是插在PCB通孔中；SMD

9、的體積小、重量輕、速度快；SMD可以兩面貼裝，焊接質(zhì)量好、可靠性高。SMD封裝命名是以器件的外形命名的。SMD的引出腳有羽翼形GULL、J形、球形、和無引線引線框架形。SMD的封裝形式有：SOP(Small Outline Packages)羽翼形小外形塑料封裝，其中包括SOICSmall Outline Integrated Circuits小外形集成電路，SSOICShrink Small Outline Integrated Circuits縮小型小外形集成電路，TSOPThin Small Outline Package薄型小外形封裝；SOJ(Small Outline Integra

10、ted Circuits)，J形小外形塑料封裝；PLCC(Plastic Leaded Chip Carriers)塑封J形引腳芯片載體；BGA(Ball Grid Array/Chip Scale Package)球形柵格陣列，根據(jù)材料和尺寸可分為六個(gè)類型：PBGAPlastic Ball Grid Array塑料封裝BGA，CBGACeramic Ball Grid Array陶瓷封裝BGA，CCGACeramic Column BGA陶瓷柱狀封裝BGA，TBGATape Ball Grid Array載帶BGA，BGA微型BGA芯片級(jí)封裝，F(xiàn)C-PBGAFlip Chip Plastic

11、 Ball Grid Array倒裝芯片塑料封裝BGA；CSP(Chip Scale Package)又稱BGA；QFN(Quad Flat No-lead)四方形扁平無引線引線框架封裝。9、設(shè)計(jì)規(guī)則由RF或控制人員預(yù)先給出需要設(shè)計(jì)PCB封裝器件的DATASHEET至PCB封裝設(shè)計(jì)人員，同時(shí)轉(zhuǎn)給原理圖封裝設(shè)計(jì)人員同步設(shè)計(jì)原理圖封裝，同步設(shè)計(jì)完成后需統(tǒng)一其命名方式，即PCB封裝的命名與原理圖封裝載入PCB設(shè)計(jì)時(shí)的封裝命名一致，否則無法導(dǎo)入PCB設(shè)計(jì)。設(shè)計(jì)PCB時(shí)，必須使用我司標(biāo)準(zhǔn)的PCB封裝庫，不得自己創(chuàng)立PCB封裝庫。PCB封裝庫在不同的工程設(shè)計(jì)里同種類型器件必須使用同種類型的PCB封裝庫，保

12、證PCB封裝庫的唯一性與統(tǒng)一性，從而提高設(shè)計(jì)的正確率。非標(biāo)準(zhǔn)且無明顯方向性的PCB封裝有輸入輸出要求的必須在相應(yīng)管腳增加輸入IN輸出(OUT)標(biāo)識(shí)，有極性的器件PCB封裝必須增加極性標(biāo)識(shí)；標(biāo)準(zhǔn)且有方向性的PCB封裝必須給出1Pin標(biāo)識(shí)。有引腳序號(hào)標(biāo)識(shí)的器件按DATASHEET標(biāo)明PCB封裝焊盤的引腳順號(hào)，DATASHEET引腳序號(hào)標(biāo)識(shí)模糊不清或根本沒有標(biāo)識(shí)引腳序號(hào)的按IC管腳焊盤序號(hào)來標(biāo)識(shí)，即逆時(shí)針順序標(biāo)識(shí)。同一個(gè)PCB封裝里不能有一樣的引腳序號(hào)出現(xiàn)。PCB封裝保存時(shí)封裝信息包含PCB封裝“命名，該封裝“高度等，如有其他的可增加“描述等。屬IPC標(biāo)準(zhǔn)封裝的參考IPC標(biāo)準(zhǔn)封裝來設(shè)計(jì)PCB封裝庫；

13、除IPC標(biāo)準(zhǔn)封裝以外，DATASHEET有推薦封裝的采用推薦封裝設(shè)計(jì)PCB封裝，特殊情況除外；非標(biāo)準(zhǔn)封裝采用我司規(guī)定的標(biāo)準(zhǔn)來設(shè)計(jì)PCB封裝。所有封裝均用PAD設(shè)計(jì)焊盤；用PAD或keepout層設(shè)計(jì)定位孔；絲印與PADS的距離10mil。設(shè)計(jì)PCB封裝外形絲印要求其自身的最大尺寸，IC除外。設(shè)計(jì)IC PCB封裝自動(dòng)生成的PAD上有過孔VIA時(shí)，其過孔的內(nèi)徑為0.25mm，外徑為1520mil。10、PCB封裝設(shè)計(jì)命名方式屬于規(guī)則封裝命名方式的統(tǒng)一用IPC的封裝命名。屬于不規(guī)則的單一的命名統(tǒng)一用其型號(hào)的全稱命名。設(shè)計(jì)人員完成PCB封裝設(shè)計(jì)后，要及時(shí)與原理圖封裝設(shè)計(jì)同步。11、PCB封裝放置入庫方

14、式目前我司PCB封裝庫分類有：標(biāo)識(shí).lib，SMA .lib，電位器.lib，電感.lib，電容.lib，晶體管.lib，電源.lib，開關(guān).lib，插件.lib，微波.lib，功放管.lib，芯片.lib，時(shí)鐘.lib等等，設(shè)計(jì)人員根據(jù)DATASHEET所屬類型自行判斷放置入庫，如分類不夠或不全可適當(dāng)增減種類，其中設(shè)計(jì)人員可設(shè)計(jì)一個(gè)“新器件.lib類別以放置待評(píng)審類型或有疑問的PCB封裝。PCB封裝放置入庫時(shí)以它封裝本身的1pin中心或器件本身中心點(diǎn)為原點(diǎn)放置。12、封裝設(shè)計(jì)分類電阻電容，晶體管，集成電路IC，功放管，隔離器與環(huán)形器，耦合器，接插件等，分為標(biāo)準(zhǔn)類與非標(biāo)準(zhǔn)類。12.1、矩形元件

15、標(biāo)準(zhǔn)類貼片電阻封裝實(shí)際尺寸：圖12.1 貼片電阻封裝實(shí)際尺寸表12.1貼片電阻封裝實(shí)際尺寸mm(in)ponentidentifierLSWTHminma*minma*minma*minma*ma*100504021.001.100.400.700.480.600.100.300.40160806031.501.700.701.110.700.950.150.400.60201208051.852.150.551.321.101.400.150.650.65321612063.053.351.552.321.451.750.250.750.71322512103.053.351.552.322

16、.342.640.250.750.71502520104.855.153.153.922.352.650.350.850.71633225126.156.454.455.223.053.350.350.850.71貼片電阻封裝推薦尺寸：圖12.2貼片電阻封裝推薦尺寸表12.2貼片電阻封裝推薦尺寸RLP No.ponent Identifiermm(in)Z(mm)G(mm)*(mm)Y(mm)C(mm)Placementgridrefref100A100504022.200.400.700.901.302*6101A160806032.800.601.001.101.704*6102A2012

17、08053.200.601.501.301.904*8103A321612064.401.201.801.602.804*10104A322512104.401.202.701.602.806*10105A502520106.202.602.701.804.406*14106A633225127.403.803.201.805.608*16貼片電容封裝實(shí)際尺寸：圖12.3 貼片電容封裝實(shí)際尺寸表12.3 貼片電容封裝實(shí)際尺寸ponent Identifiermm(in)LSWTHminma*minma*minma*minma*ma*100504020.901.100.300.650.400.6

18、00.100.300.60131005041.021.320.260.720.771.270.130.381.02160806031.451.750.450.970.650.950.200.500.85201208051.802.200.301.111.051.450.250.751.10321612063.003.401.502.311.401.800.250.751.35322512103.003.401.502.312.302.700.250.751.35453218124.204.802.303.463.003.400.250.951.35456418254.204.802.303.4

19、66.006.800.250.951.10貼片電容封裝推薦尺寸：圖12.4 貼片電容封裝實(shí)際尺寸表12.4 貼片電容封裝實(shí)際尺寸RLP No.ponent Identifiermm(in)Z(mm)G(mm)*(mm)Y(mm)C(mm)Placementgridrefref130A1005(0402)2.200.400.700.901.302*6131A1310(0504)2.400.401.301.001.404*6132A1608(0603)2.800.601.001.101.704*6133A2012(0805)3.200.601.501.301.904*8134A3216(1206)

20、4.401.201.801.602.804*10135A3225(1210)4.401.202.701.602.806*10136A4532(1812)5.802.003.401.903.908*12137A4564(1825)5.802.006.801.903.9014*12貼片電感封裝實(shí)際尺寸：圖12.5 貼片電感封裝實(shí)際尺寸表12.5 貼片電感封裝實(shí)際尺寸ponentIdentifier(mm)L(mm)S(mm)W1(mm)W2(mm)T(mm)H1(mm)H2(mm)minma*minma*minma*minma*minma*ma*ma*2012 chip1.702.301.101.

21、760.601.200.100.301.203216 chip2.903.501.902.631.301.900.200.501.904516 chip4.204.802.603.530.601.200.300.801.902825 prec.w/w2.202.800.901.621.952.112.102.540.370.652.290.073225 prec.w/w2.903.500.901.831.401.800.501.002.000.504532 prec.w/w4.204.802.203.133.003.400.501.002.800.505038 prec.w/w4.354.95

22、2.813.512.462.623.413.810.510.773.800.763225/3230 molded3.003.401.602.181.802.002.302.700.400.702.400.514035 molded3.814.320.811.601.201.502.923.181.201.502.671.274532 molded4.204.802.303.152.002.203.003.400.650.953.400.505650 molded5.305.503.304.323.804.204.705.300.501.005.801.008530 molded8.258.76

23、5.256.041.201.502.923.181.201.502.671.27貼片電感封裝推薦尺寸：圖12.6 貼片電感封裝推薦尺寸表12.6貼片電感封裝推薦尺寸RLP No.ponentIdentifier(mm)Z(mm)G(mm)*(mm)C(mm)Y(mm)Placementgridrefrfe1602012 chip3.001.001.002.001.004*81613216 chip4.201.801.603.001.206*101624516 chip5.802.601.004.201.604*121632825 Prec3.801.002.402.401.406*101643

24、225 Prec4.601.002.002.801.806*101654532 Prec5.802.203.604.001.808*141665038 Prec5.803.002.804.401.408*141673225/3230 Molded4.401.202.202.801.606*101684035 Molded5.401.001.403.202.208*121694532 Molded5.801.802.403.802.008*141705650 Molded6.803.204.005.001.8012*161718530 Molded9.805.001.407.402.408*22

25、鉭電容封裝實(shí)際尺寸：圖12.7 鉭電容封裝實(shí)際尺寸圖12.7 鉭電容封裝實(shí)際尺寸ponentIdentifier(mm)L(mm)S(mm)W1(mm)W2(mm)T(mm)H1(mm)H2(mm)minma*minma*minma*minma*minma*minma*32163.003.400.801.741.171.211.401.800.501.100.701.8035283.303.701.102.042.192.212.603.000.501.100.702.1060325.706.302.503.542.192.212.903.501.001.601.002.8073437.007

26、.603.804.842.392.414.004.601.001.601.003.10鉭電容封裝推薦尺寸：圖12.8鉭電容封裝推薦尺寸表12.8鉭電容封裝推薦尺寸RLP No.ponentIdentifier(mm)Z(mm)G(mm)*(mm)Y(mm)C(mm)Placementgridrefref180A32164.800.801.202.002.806*12181A35285.001.002.202.003.008*12182A60327.602.402.202.605.008*18183A73439.003.802.402.606.4010*2012.2、圓形元件標(biāo)準(zhǔn)類貼片二極管封裝

27、實(shí)際尺寸：圖12.9 貼片二極管封裝實(shí)際尺寸表12.9 貼片二極管封裝實(shí)際尺寸ponentIdentifierMm(in)L(mm)S(mm)W(mm)T(mm)ponenttypeminma*minma*minma*minma*SOD-80/MLL343.303.702.202.651.601.700.410.55DiodeSOD-87/MLL414.805.203.804.252.442.540.360.50Diode2012(0805)1.902.101.161.441.351.450.230.370.10mw resistor3216(1206)3.003.401.862.311.75

28、1.850.430.570.25mw resistor3516(1406)3.303.702.162.611.551.650.430.570.12w resistor5923(2309)5.706.104.364.812.402.500.530.670.25w resistor貼片二極管封裝推薦尺寸：圖12.10 貼片二極管封裝推薦尺寸表12.10 貼片二極管封裝推薦尺寸RLP No.ponentIdentifierMm(in)Z(mm)G(mm)*(mm)Y(mm)C(mm)ABPlacementgridrefref200ASOD-80/MLL344.802.001.801.403.400.

29、500.506*12201ASOD-87/MLL416.303.402.601.454.850.500.506*14202A2012(0805)3.200.601.601.301.900.500.354*8203A3216(1206)4.401.202.001.602.800.500.556*10204A3516(1406)4.802.001.801.403.400.500.556*12205A5923(2309)7.204.202.601.505.700.500.656*1812.3、小外形晶體管SOT及二極管SOD標(biāo)準(zhǔn)類SOT23封裝實(shí)際尺寸：圖12.11 SOT23封裝實(shí)際尺寸表12.1

30、1 SOT23封裝實(shí)際尺寸ponentIdentifierL(mm)S(mm)W(mm)T(mm)H(mm)P(mm)minma*minma*minma*minma*ma*nomSOT232.302.601.101.470.360.460.450.601.100.95SOT23封裝推薦尺寸：圖12.12 SOT23封裝推薦尺寸表12.12 SOT23封裝推薦尺寸RLP No.ponentidentifierZ(mm)G(mm)*(mm)Y(mm)C(mm)E(mm)PlacementGirdrefrefref210SOT233.600.801.001.402.200.958*8SOT89封裝實(shí)

31、際尺寸：圖12.13 SOT89封裝實(shí)際尺寸表12.13 SOT89封裝實(shí)際尺寸ponentIdentifierL(mm)T(mm)W1(mm)W2(mm)W3(mm)K(mm)H(mm)P(mm)minma*minma*minma*minma*minma*minma*ma*nomSOT893.944.250.891.200.360.480.440.561.621.832.602.851.601.50SOT89封裝推薦尺寸：圖12.14 SOT89封裝推薦尺寸表12.14 SOT89封裝推薦尺寸RLP No.ponentIdentifierZ(mm)Y1(mm)*1(mm)*2(mm)*3(m

32、m)Y2(mm)Y3(mm)E(mm)Placementgridminma*minma*refrefnom215SOT895.401.400.800.801.001.802.002.404.601.5012*10SOD123封裝實(shí)際尺寸：圖12.15 SOD123封裝實(shí)際尺寸表12.15 SOD123封裝實(shí)際尺寸ponentIdentifierL(mm)S(mm)W1(mm)W2(mm)T(mm)Hminma*minma*minma*minma*minma*ma*SOD1233.553.852.352.930.450.651.401.700.250.601.35SMB5.215.592.173

33、.311.962.213.303.940.761.522.41SOD123封裝推薦尺寸：圖12.16 SOD123封裝推薦尺寸表12.16 SOD123封裝推薦尺寸RLP No.ponentIdentifierZ(mm)G(mm)*(mm)Y(mm)C(mm)Placementgridrefref220ASOD1235.001.800.801.603.404*12221ASMB6.802.002.402.404.408*16SOT143封裝實(shí)際尺寸：圖12.17 SOT143封裝實(shí)際尺寸表12.17 SOT143封裝實(shí)際尺寸ponentIdentifierL(mm)S(mm)W1(mm)W2(

34、mm)T(mm)P1(mm)P2(mm)H(mm)minma*minma*minma*minma*minma*nomnomma*SOT1432.102.641.001.690.370.460.760.890.250.551.921.721.20SOT143封裝推薦尺寸：圖12.18 SOT143封裝推薦尺寸表12.18 SOT143封裝推薦尺寸RLP NO.ponentIdentifierZ(mm)G(mm)*1(mm)*2(mm)CE1E2YPlacementgridminma*refnomnomref225SOT1433.600.801.001.001.202.201.901.701.40

35、8*8SOT223封裝實(shí)際尺寸：圖12.19 SOT223封裝實(shí)際尺寸表12.19 SOT223封裝實(shí)際尺寸ponentIdentifierL(mm)S(mm)W1(mm)W2(mm)T(mm)H(mm)P1(mm)P2(mm)minma*minma*minma*minma*minma*ma*nomnomSOT2236.707.304.104.920.600.882.903.180.901.301.802.304.60SOT223封裝推薦尺寸：圖12. 20 SOT223封裝推薦尺寸表12. 20 SOT223封裝推薦尺寸RLP No.ponentIdentifierZ(mm)G(mm)*1(

36、mm)*2(mm)Y(mm)C(mm)E1(mm)E2(mm)Placementgridminma*refrefnomnom230SOT2238.404.001.203.403.602.206.202.304.6018*14特殊晶體管DPAK：圖12.21 特殊晶體管DPAK-1表12.21 特殊晶體管DPAK-1ponentIdentifierLW1W2T1T2P1P2Hminma*minma*minma*minma*minma*basicbasicMa*TS-003*9.3210.410.640.914.355.350.510.804.005.502.284.572.38TS-005*14

37、.6015.880.510.916.226.862.292.798.009.002.545.084.83TO36818.7019.101.151.4513.3013.602.402.7012.4012.705.4510.905.10圖12.22 特殊晶體管DPAK-2表12.22 特殊晶體管DPAK-2RLP No.ponentIdentifierZ(mm)Y1Y2*1*2CPlacementGridref235ATS-003*11.201.606.201.005.407.3024*16236TS-005*16.603.409.601.006.8010.1036*24237TO26819.80

38、3.4013.401.4013.6011.4042*3412.4、集成電路IC標(biāo)準(zhǔn)類所有對(duì)稱IC都需增加1pin標(biāo)識(shí)。SOIC系列封裝實(shí)際尺寸：圖12.23 SOIC系列封裝實(shí)際尺寸表12.23 SOIC系列封裝實(shí)際尺寸ponentIdentifierJEDECL(mm)S(mm)W(mm)T(mm)A(mm)B(mm)H(mm)Pminma*minma*minma*minma*minma*minma*minma*nomSO8MS-012AA5.806.203.264.550.330.510.401.273.804.004.805.001.351.751.27SO8W10.0010.657.4

39、68.850.330.510.401.277.407.605.055.452.352.651.27SO14MS-012AB5.806.203.264.550.330.510.401.273.804.008.558.751.351.751.27SO14W10.0010.657.468.850.330.510.401.277.407.608.809.202.352.65SO16MS-012AC5.806.203.264.550.330.510.401.273.804.009.8010.001.351.751.27SO16WMS-013AA10.0010.657.468.850.330.510.40

40、1.277.407.6010.1010.502.352.651.27SO20WMS-013AC10.0010.657.468.850.330.510.401.277.407.6012.6013.002.352.651.27SO24WMO-119AA10.2910.648.219.010.360.510.531.047.407.6015.5415.852.342.641.27SO24*MO-120AA11.8112.179.7310.540.360.510.531.048.769.0215.5415.852.342.641.27SO28WMO-119AB10.2910.648.219.010.3

41、60.510.531.047.407.6018.0818.392.342.641.27SO28*MO-120AB11.8112.179.7310.540.360.510.531.048.769.0218.0818.392.342.641.27SO32WMO-119AC10.2910.648.219.010.360.510.531.047.407.6020.6220.932.342.641.27SO32*MO-120AC11.8112.179.7310.540.360.510.531.048.769.0220.6220.932.342.641.27SO36WMO-119AD10.2910.648

42、.219.010.360.510.531.047.407.6023.1623.472.342.641.27SO36*MO-120AD11.8112.179.7310.540.360.510.531.048.769.0223.1623.472.342.641.27SOIC系列封裝推薦尺寸：圖12.24 SOIC系列封裝推薦尺寸表12.24 SOIC系列封裝推薦尺寸RLP No.ponentidentifierZ(mm)G(mm)*(mm)Y(mm)C(mm)D(mm)E(mm)PlacementgridrefRefrefref300ASO87.403.000.602.205.203.811.27

43、16*12301ASO8W11.407.000.602.209.203.811.2724*12302ASO147.403.000.602.205.207.621.2716*20303ASO14W11.407.000.602.209.207.621.2724*20304ASO167.403.000.602.205.208.891.2716*22305ASO16W11.407.000.602.209.208.891.2724*22306ASO20W11.407.000.602.209.2011.431.2724*28307ASO24W11.407.000.602.209.2013.971.2724

44、*32308ASO24*13.008.600.602.2010.8013.971.2728*32309ASO28W11.407.000.602.209.2016.511.2724*38310ASO28*13.008.600.602.2010.8016.511.2728*38311ASO32W11.407.000.602.209.2019.051.2724*44312ASO32*13.008.600.602.2010.8019.051.2728*44313ASO36W11.407.000.602.209.2021.591.2724*48314ASO36*13.008.600.602.2010.8

45、021.591.2728*48SOPIC系列封裝實(shí)際尺寸：圖12.25 SOPIC系列封裝實(shí)際尺寸表12.25 SOPIC系列封裝實(shí)際尺寸ponentidentifiertypeL(mm)S(mm)W(mm)T(mm)A(mm)B(mm)H(mm)P(mm)minma*minma*minma*minma*minma*ma*ma*nomSOP6I5.726.993.725.110.350.510.601.003.924.726.351.501.27SOP8I5.726.993.725.110.350.510.601.003.924.726.351.501.27SOP10I5.726.993.72

46、5.110.350.510.601.003.924.728.891.501.27SOP12I5.726.993.725.110.350.510.601.003.924.728.891.501.27SOP14I5.726.993.725.110.350.510.601.003.924.7211.431.501.27SOP16II7.628.895.627.010.350.510.601.005.026.2211.432.001.27SOP18II7.628.895.627.010.350.510.601.005.026.2213.972.001.27SOP20II7.628.895.627.01

47、0.350.510.601.005.026.2213.972.001.27SOP22III9.5310.807.538.920.350.510.601.006.338.1316.512.501.27SOP24III9.5310.807.538.920.350.510.601.006.338.1316.512.501.27SOP28IV11.4312.709.4310.820.350.510.601.008.2310.0319.053.001.27SOP30IV11.4312.709.4310.820.350.510.601.008.2310.0321.593.001.27SOP32V13.34

48、14.6111.3412.730.350.510.601.0010.1411.9421.593.501.27SOP36V13.3414.6111.3412.730.350.510.601.0010.1411.9424.133.501.27SOP40VI15.2416.5113.2414.630.350.510.601.0012.0413.8427.944.001.27SOP42VI15.2416.5113.2414.630.350.510.601.0012.0413.8427.944.001.27SOPIC系列封裝推薦尺寸：圖12.27 SOPIC系列封裝推薦尺寸表12.27 SOPIC系列封

49、裝推薦尺寸RLP No.ponentidentifierZ(mm)G(mm)*(mm)Y(mm)C(mm)D(mm)E(mm)PlacementGridrefrefrefnom360ASOP67.403.000.602.205.202.541.2716*14361ASOP87.403.000.602.205.203.811.2716*14362ASOP107.403.000.602.205.205.081.2716*18363ASOP127.403.000.602.205.206.351.2716*18364ASOP147.403.000.602.205.207.621.2716*24365A

50、SOP169.405.000.602.207.208.891.2720*24366ASOP189.405.000.602.207.2010.161.2720*28367ASOP209.405.000.602.207.2011.431.2720*28368ASOP2211.206.800.602.209.0013.971.2724*34369ASOP2411.206.800.602.209.0013.971.2724*34370ASOP2813.208.800.602.2011.0016.511.2728*40371ASOP3013.208.800.602.2011.0017.781.2728*

51、44372ASOP3215.0010.600.602.2012.8019.051.2732*44373ASOP3615.0010.600.602.2012.8021.591.2732*50374ASOP4017.0012.600.602.2014.8024.131.2736*56375ASOP4217.0012.600.602.2014.8025.401.2736*56TSOP系列封裝實(shí)際尺寸：圖12. 28 TSOP系列封裝實(shí)際尺寸表12. 28 TSOP系列封裝實(shí)際尺寸ponentIdentifierPinCountL(mm)S(mm)W(mm)T(mm)A(mm)B(mm)H(mm)P(

52、mm)minma*minma*minma*minma*minma*minma*ma*nomTSOP6*141613.8014.2012.4012.980.200.400.400.705.806.2012.2012.601.270.65TSOP6*162415.8016.2014.4014.980.100.300.400.705.806.2014.2014.601.270.50TSOP6*182817.8018.2016.4016.780.050.220.400.705.806.2016.2016.601.270.40TSOP6*203619.8020.2018.4018.980.050.150

53、.400.705.806.2018.2018.601.270.30TSOP8*142413.8014.2012.4012.980.200.400.400.707.808.2012.2012.601.270.65TSOP8*163215.8016.2014.4014.980.100.300.400.707.808.2014.2014.601.270.50TSOP8*184017.8018.2016.4016.780.050.220.400.707.808.2016.2016.601.270.40TSOP8*205219.8020.2018.4018.980.050.150.400.707.808

54、.2018.2018.601.270.30TSOP10*142813.8014.2012.4012.980.200.400.400.709.8010.2012.2012.601.270.65TSOP10*164015.8016.2014.4014.980.100.300.400.709.8010.2014.2014.601.270.50TSOP10*184817.8018.2016.4016.780.050.220.400.709.8010.2016.2016.601.270.40TSOP10*206419.8020.2018.4018.980.050.150.400.709.8010.201

55、8.2018.601.270.30TSOP12*143613.8014.2012.4012.980.200.400.400.7011.8012.2012.2012.601.270.65TSOP12*164815.8016.2014.4014.980.100.300.400.7011.8012.2014.2014.601.270.50TSOP12*186017.8018.2016.4016.780.050.220.400.7011.8012.2016.2016.601.270.40TSOP12*207619.8020.2018.4018.980.050.150.400.7011.8012.201

56、8.2018.601.270.30TSOP系列封裝推薦尺寸：圖12.29 TSOP系列封裝推薦尺寸表12.29 TSOP系列封裝推薦尺寸RLP No.ponentIdentifierZ(mm)G(mm)*(mm)Y(mm)C(mm)D(mm)E(mm)PinCountPlacementGridrefrefrefnom390ATSOP6*1414.8011.600.401.6013.204.550.651614*32391ATSOP6*1616.8013.600.301.6015.205.500.502414*36392ATSOP6*1818.8015.600.251.6017.205.200.

57、402814*40393ATSOP6*2020.8017.600.171.6019.205.100.303614*44394ATSOP8*1414.8011.600.401.6013.207.150.652418*32395ATSOP8*1616.8013.600.301.6015.207.500.503218*36396ATSOP8*1818.8015.600.251.6017.207.600.404018*40397ATSOP8*2020.8017.600.171.6019.207.500.305218*44398ATSOP10*1414.8011.600.401.6013.208.450

58、.652822*32399ATSOP10*1616.8013.600.301.6015.209.500.504022*36400ATSOP10*1818.8015.600.251.6017.209.200.404822*40401ATSOP10*2020.8017.600.171.6019.209.300.306422*44402ATSOP12*1414.8011.600.401.6013.2011.050.653626*32403ATSOP12*1616.8013.600.301.6015.2011.500.504826*36404ATSOP12*1818.8015.600.251.6017

59、.2011.600.406026*40405ATSOP12*2020.8017.600.171.6019.2011.100.307626*44SOJ系列A封裝實(shí)際尺寸：圖12.30 SOJ系列A封裝實(shí)際尺寸表12.30 SOJ系列A封裝實(shí)際尺寸ponentIdentifierL(mm)S(mm)W(mm)T(mm)B(mm)H(mm)P(mm)minma*minma*minma*minma*minma*ma*nomSOJ14/3008.388.764.385.060.380.511.602.009.659.963.751.27SOJ16/3008.388.764.385.060.380.511

60、.602.0010.9211.233.751.27SOJ18/3008.388.764.385.060.380.511.602.0012.1912.503.751.27SOJ20/3008.388.764.385.060.380.511.602.0013.4613.773.751.27SOJ22/3008.388.764.385.060.380.511.602.0014.7315.043.751.27SOJ24/3008.388.764.385.060.380.511.602.0016.0016.313.751.27SOJ26/3008.388.764.385.060.380.511.602.