LCDLiquidCrystalDisplay液晶顯示LCMLiquidCrystalModule液晶模塊TNTwistedNematic扭曲向列。液晶分子的扭曲取向偏轉(zhuǎn)90度STNSuperTwistedNematic超級扭曲向列。約180?270度扭曲向列FSTNFormulatedSuperTwistedNematic格式化超級扭曲向列。一層光程補償偏甲于STN,用于單色顯示TFTThinFilmTransistor薄膜晶體管Backlight-背光Inverter-逆變器OSDOnScreenDisplay在屏上顯示DVIDigitalVisualInterface(VGA)數(shù)字接口TMDSTransitionMinimizedDifferentialSingnalingLVDSLowVoltageDifferentialSignaling低壓差分信號Panelink-ICIntegrateCircuit集成電路TCPTapeCarrierPackage柔性線路板COBChipOnBoard通過綁定將IC裸偏固定于印刷線路板上COFChipOnFPC將IC固定于柔性線路板上COGChipOnGlass將芯偏固定于玻璃上Duty-占空比，高出點亮的閥值電壓的部分在一個周期中所占的比率LEDLightEmittingDiode發(fā)光二極管ELElextroLuminescence電致發(fā)光。EL層由高分子量薄片構(gòu)成CCFL(CCFT)ColdCathodeFluorescentLight/Tude冷陰極熒光燈PDPPlasmaDisplayPanel等離子顯示屏CRTCathodeRadialTude陰極射線管VGAVideoGraphicAnay視頻圖形陳列PCBPrintedCircuitBoard印刷電路板Compositevideo-復合視頻componentvideo-分量視頻S-video-S端子，與復合視頻信號比，將對比和顏色分離傳輸NTSCNationalTelevisionSystemsCommitteeNTSC制式。全國電視系統(tǒng)委員會制式PhaseAlrernatingLinePAL制式(逐行倒相制式)SEquentialCouleurAvecMemoireSECAM制式(順序與存儲彩色電視系統(tǒng))半導體詞匯3AVideoOnDemand視頻點播DPIDotPerInch點每英寸A.M.U原子質(zhì)量數(shù)ADIAfterdevelopinspection顯影后檢視AEI蝕科后檢查Alignment排成一直線，對平

0.B4.15.C8.29.D2.Alloy融合：電壓與電流成線性關(guān)系，降低接觸的阻值A(chǔ)RC：anti-reflectcoating防反射層ASHER:一種干法刻蝕方式ASI光阻去除后檢查Backside晶片背面BacksideEtch背面蝕刻Beam-Current電子束電流BPSG:含有硼磷的硅玻璃Break中斷，stepper機臺內(nèi)中途停止鍵Cassette裝晶片的晶舟CD：criticaldimension關(guān)鍵性尺寸Chamber反應室Chart圖表Childlot子批Chip（die）晶粒CMP化學機械研磨Coater光阻覆蓋（機臺）Coating涂布，光阻覆蓋ContactHole接觸窗ControlWafer控片Criticallayer重要層CVD化學氣相淀積Cycletime生產(chǎn)周期Defect缺陷DEP:deposit淀積Descum預處理Developer顯影液；顯影（機臺）Development顯影DG:dualgate雙門DIwater去離子水Diffusion擴散Doping摻雜Dose劑量Downgrade降級DRC:designrulecheck設(shè)計規(guī)則檢查DryClean干洗

Duedate交期Dummywafer擋片EE/R:etchrate蝕刻速率EE設(shè)備工程師EndPoint蝕刻終點ESD:electrostaticdischarge/electrostaticdamage靜電離子損傷ET:etch蝕刻Exhaust排氣（將管路中的空氣排除）Exposure曝光FFAB工廠FIB:focusedionbeam聚焦離子束FieldOxide場氧化層Flatness平坦度Focus焦距Foundry代工FSG:含有氟的硅玻璃Furnace爐管GGOI:gateoxideintegrity門氧化層完整性HH.M.D.SHexamethyldisilazane,經(jīng)去水烘烤的晶片，將涂上一層增加光阻與晶片表面附著力的化合物，稱H.M.D.SHCI:hotcarrierinjection熱載流子注入HDP：highdensityplasma高密度等離子體High-Voltage高壓Hotbake烘烤IID辨認，鑒定Implant植入LLayer層次LDD:lightlydopeddrain輕摻雜漏Localdefocus局部失焦因機臺或晶片造成之臟污LOCOS:localoxidationofsilicon局部氧化Loop巡路Lot批MMask(reticle)光罩Merge合并MetalVia金屬接觸窗MFG制造部Mid-Current中電流Module部門NNIT:Si3N4氮化硅Non-critical非重要NP:n-dopedplus(N+)N型重摻雜NW:n-dopedwellN阱OOD:oxidedefinition定義氧化層OM:opticmicroscope光學顯微鏡OOC超出控制界線OOS超出規(guī)格界線OverEtch過蝕刻Overflow溢出Overlay測量前層與本層之間曝光的準確度OX:SiO2二氧化硅PP.R.Photoresisit光阻P1:poly多晶硅PA;passivation鈍化層Parentlot母批Particle含塵量/微塵粒子PE:1.processengineer;2.plasmaenhance1、工藝工程師2、等離子體增強98.PH:photo黃光或微影99.Pilot實驗的100.Plasma電漿101.Pod裝晶舟與晶片的盒子

05.106.107.Q108.R18.S34.TPolymer聚合物PORProcessofrecordPP:p-dopedplus(P+)P型重摻雜PR:photoresist光阻PVDPW:物理氣相淀積p-dopedwellP阱Queuetime等待時間R/C:runcard運作卡Recipe程式Release放行Resistance電阻Reticle光罩RF射頻RM:remove.消除Rotation旋轉(zhuǎn)RTA:rapidthermalanneal迅速熱退火RTP:rapidthermalprocess迅速熱處理SA:salicide硅化金屬SAB:salicideblock硅化金屬阻止區(qū)SAC:sacrificelayer犧牲層Scratch刮傷Selectivity選擇比SEM：scanningelectronmicroscope掃描式電子顯微鏡Slot槽位Source-Head離子源SPC制程統(tǒng)計管制Spin旋轉(zhuǎn)SpinDry旋干Sputter濺射SRO:Sirichoxide富氧硅Stocker倉儲Stress內(nèi)應力STRIP:一種濕法刻蝕方式

TEOS-(CH3CH20)4Si四乙氧基硅烷/正硅酸四乙酯，常溫下液態(tài)。作LPCVD/PECVD生長SiO2的原料。又指用TEOS生長得到的SiO2層。Ti鈦TiN氮化鈦TM:topmetal頂層金屬層TORToolofrecordUUnderEtch蝕刻不足USG:undoped硅玻璃WW(Tungsten)鎢WEE周邊曝光其它mainframe主機cassette晶片盒amplifier放大器enclosure外殼wrench扳手swagelok接頭鎖緊螺母clamp夾子actuator激勵STIshallowtrenchisolantion淺溝道隔離層SAB硅鋁塊UBM球下金屬層鍍模工藝RDL金屬連線重排工藝RIEreactinvionetch反應離子etchICPinductivecoupleplasma感應等離子體TFTthinfilmtransistor薄模晶體管ALDatomiclayerdeposition原子層淀積BGAballgridarray高腳封裝AASatomicabsorptionsspectroscopy原子吸附光譜AFMatomicforcemicroscopy原子力顯微ASIC特定用途集成電路ATE自動檢測設(shè)備SIPself-ionizedplasma自電離電漿IGBT絕緣門雙極晶體管PMDpremetaldielectric電容TCUtemperaturecontrolunit溫度控制設(shè)備arcchamber起弧室vaporizer蒸發(fā)器filament燈絲repeller反射板ELSextendedlifesource高壽命離子源analyzermagnet磁分析器postaccel后加速器quadrupolelens磁聚焦透鏡disk/flagfaraday束流測量器e-shower中性化電子子發(fā)生器extrantionelectrode高壓吸極disk靶盤rotarydrive旋轉(zhuǎn)運動linerdrive直線往復運動gyrodrive兩方向偏轉(zhuǎn)flataligener平邊檢測器loadlockvalve靶盤腔裝片閥reservoir水槽stringfilter過濾器DIfilter離子交換器chiller制冷機heatexchange熱交換機BasicOperation基本工藝Process制程方法Options具體分類Layering增層Oxidation氧化Atmospheric常壓氧化法HighPressure高壓氧化法RapidThermalOxidation快速熱氧化ChemicalVaporDeposition化學汽相淀積AtmosphericPressure常壓化學汽相淀積LowPressure(LPCVD)低壓化學汽相淀積PlasmaEnhanced(PECVD)等離子增強化學汽相淀積VaporPhaseEpitaxy(VPE)汽相外延法MetaloranicCVD(MOCVD)金屬有機物CVDMoleculurBeamEpitaxy(MBE)分子束外延PhysicalVaporDeposition(PCD)物理汽相淀積VacuumEvaporation真空蒸發(fā)法Sputtering濺射法Patterning光刻Resist光刻膠Positive正膠工藝Negative負膠工藝ExposureSystems暴光系統(tǒng)Contact接觸式暴光Proximity接近式暴光ScanningProjection投影式暴光Stepper步進暴光機ExposureSources暴光源HighPressureMercury高壓汞X-raysX射線E-Beams電子束暴光ImagingProcesses成象工藝SingleLayerResist單層光刻膠MultilayerResist多層光刻膠AntireflectingLayers防反射層Off-AxisIllumination偏軸照明Planarization平坦化ContrastEnhancement對比度提高Etch刻蝕WetChemistry-Liqiud/vapor濕化學刻蝕Dry(Plasma)干法刻蝕Lift-Off剝脫IonMillling離子磨ReactionIonEtch(RIE)反應離子刻蝕法Doping摻雜Diffusion擴散OpenTube-Horizontal/Vertical(開放式爐管-水平/豎置)ClosedTube封閉爐管RapidThermalProcess(RTP)快速熱處理IonImplantationMedium/HighCurrent中/高電流離子注入Low/HighVoltage(energy)低能量/高能量離子注入Heating熱處理Thermal加熱HotPlates加熱盤Convection熱對流RTP快速加熱Radiation熱輻射Infrared(IR)紅外線加熱Yield良率Parameter參數(shù)PAC感光化合物ASIC特殊應用集成電路Solvent溶劑Carbide碳Refractive折射Expansion膨脹Strip濕式刻蝕法的一種TM:topmental頂層金屬層WEE周邊曝光PSG硼硅玻璃MFG制造部Runcard運作卡POD裝晶舟和晶片的盒子Scratch刮傷Reticle光罩Sputter濺射Spin旋轉(zhuǎn)Merge合并AA/D［軍］Analog.Digital,模擬/數(shù)字ACMagnitude交流幅度ACPhase交流相位Accuracy精度"ActivityModelActivityModel"活動模型AdditiveProcess加成工藝Adhesion附著力Aggressor干擾源AnalogSource模擬源AOI,AutomatedOpticalInspection自動光學檢查AssemblyVariant不同的裝配版本輸出Attributes屬性AXI,AutomatedX-rayInspection自動X光檢查BBIST,Built-inSelfTest內(nèi)建的自測試BusRoute總線布線CCircuit電路基準circuitdiagram電路圖Clementine專用共形開線設(shè)計ClusterPlacement簇布局CM合約制造商CommonImpedance共模阻抗Concurrent并行設(shè)計ConstantSource恒壓源CooperPour智能覆銅Crosstalk串擾CVT,ComponentVerificationandTracking元件確認與跟蹤DDCMagnitude直流幅度Delay延時Delays延時DesignforTesting可測試性設(shè)計Designator標識DFC,DesignforCost面向成本的設(shè)計DFM,DesignforManufacturing面向制造過程的設(shè)計DFR,DesignforReliability面向可靠性的設(shè)計DFT,DesignforTest面向測試的設(shè)計DFX,DesignforX面向產(chǎn)品的整個生命周期或某個環(huán)節(jié)的設(shè)計DSM,DynamicSetupManagement動態(tài)設(shè)定管理DynamicRoute動態(tài)布線EEDIF,TheElectronicDesignInterchangeFormat電子設(shè)計交互格式EIA,ElectronicIndustriesAssociation電子工業(yè)協(xié)會ElectroDynamicCheck動態(tài)電性能分析ElectromagneticDisturbance電磁干擾ElectromagneticNoise電磁噪聲EMC,ElctromagneticCompatibilt電磁兼容EMI,ElectromagneticInterference電磁干擾Emulation硬件仿真EngineeringChangeOrder原理圖與PCB版圖的自動對應修改Ensemble多層平面電磁場仿真ESD靜電釋放FFallTime下降時間FalseClocking假時鐘FEP氟化乙丙烯FFT,FastFourierTransform快速傅里葉變換FloatLicense網(wǎng)絡浮動FrequencyDomain頻域GGaussianDistribution高斯分布Globalflducial板基準GroundBounce地彈反射GUI,GraphicalUserInterface圖形用戶界面HHarmonica射頻微波電路仿真HFSS三維高頻結(jié)構(gòu)電磁場仿真IIBIS,Input/OutputBufferInformationSpecification模型ICAM,IntegratedComputerAidedManufacturing在ECCE項目里就是指制作PCBIEEE,TheInstituteofElectricalandElectronicEngineers國際電氣和電子工程師協(xié)會IGES,InitialGraphicsExchangeSpecification三維立體幾何模型和工程描述的標準ImageFiducial電路基準Impedance阻抗In-Circuit-Test在線測試InitialVoltage初始電壓InputRiseTime輸入躍升時間IPC,TheInstituteforPackagingandInterconnect封裝與互連協(xié)會IPO,InteractiveProcessOptimizaton交互過程優(yōu)化ISO,TheInternationalStandardsOrganization國際標準化組織JJumper跳線LLi