/常見(jiàn)封裝形式簡(jiǎn)介DIP=DualInlinePackage=雙列直插封裝HDIP=DualInlinePackagewithHeatSink=帶散熱片的雙列直插封裝SDIP=ShrinkDualInlinePackage=緊縮型雙列直插封裝SIP=SingleInlinePackage=單列直插封裝HSIP=SingleInlinePackagewithHeatSink=帶散熱片的單列直插封裝SOP=SmallOutlinePackage=小外形封裝HSOP=SmallOutlinePackagewithHeatSink=帶散熱片的小外形封裝eSOP=SmallOutlinePackagewithexposedthermalpad=載體外露于塑封體的小外形封裝SSOP=ShrinkSmallOutlinePackage=緊縮型小外形封裝TSSOP=ThinShrinkSmallOutlinePackage=薄體緊縮型小外形封裝TQPF=ThinProfileQuadFlatPackage=薄型四邊引腳扁平封裝PQFP=PlasticQuadFlatPackage=方形扁平封裝LQPF=LowProPackage=薄型方形扁平封裝eLQPF=LowProfileQuadFlatPackagewithexposedthermalpad=載體外露于塑封體的薄型方形扁平封裝DFN=DualFlatNon-leadedPackage=雙面無(wú)引腳扁平封裝QFN=QuadFlatNon-leadedPackage=雙面無(wú)引腳扁平封裝TO=Transistorpackage=晶體管封裝SOT=SmallOutlineofTransistor=小外形晶體管BGA=BallGridArray=球柵陣列封裝BQFP=QuadFlatPackageWithBumper=帶緩沖墊的四邊引腳扁平封裝CAD=ComputerAidedDesign=計(jì)算機(jī)輔助設(shè)計(jì)CBGA=CeramicBallGridArray=陶瓷焊球陣列

CCGA=CeramicColumnGridArray=陶瓷焊柱陣列CSP=ChipSizePackage=芯片尺寸封裝

DFP=DualFlatPackage=雙側(cè)引腳扁平封裝

DSO=DualSmallOutline=雙側(cè)引腳小外形封裝

3D=Three-Dimensional=三維

2D=Two-Dimensional=二維FCB=FlipChipBonding=倒裝焊IC=IntegratedCircuit=集成電路I/O=Input/Output=輸入/輸出LSI=LargeScaleIntegratedCircuit=大規(guī)模集成電路MBGA=MetalBGA=金屬基板BGAMCM=MultichipModule=多芯片組件MCP=MultichipPackage=多芯片封裝MEMS=MicroelectroMechanicalSystem=微電子機(jī)械系統(tǒng)MFP=MiniFlatPackage=微型扁平封裝MSI=MediumScaleIntegration=中規(guī)模集成電路

OLB=OuterLeadBonding=外引腳焊接PBGA=PlasticBGA=塑封BGA

PC=PersonalComputer=個(gè)人計(jì)算機(jī)

PGA=PinGridArray=針柵陣列

SIP=SystemInaPackage=系統(tǒng)級(jí)封裝SOIC=SmallOutlineIntegratedCircuit=小外形封裝集成電路

SOJ=SmallOutlineJ-LeadPackage=小外形J形引腳封裝

SOP=SmallOutlinePackage=小外形封裝

SOP=SystemOnaPackage=系統(tǒng)級(jí)封裝WB=WireBonding=引線健合

WLP=WaferLevelPackage=晶圓片級(jí)封裝常用文件、表單、報(bào)表中英文名稱清除通知單Purgenotice工程變更申請(qǐng)ECR(EngineeringChangeRequest)持續(xù)改善計(jì)劃CIP(continuousimprovementplan)戴爾專案DellProject收據(jù)Receipt數(shù)據(jù)表Datasheet核對(duì)表Checklist文件清單Documentationchecklist設(shè)備清單Equipmentchecklist調(diào)查表，問(wèn)卷Questionnaire報(bào)名表Entryform追蹤記錄表Trackinglog日?qǐng)?bào)表Dailyreport周報(bào)表Weeklyreport月報(bào)表Monthlyreport年報(bào)表Yearlyreport年度報(bào)表Annualreport財(cái)務(wù)報(bào)表Financialreport品質(zhì)報(bào)表Qualityreport生產(chǎn)報(bào)表Productionreport不良分析報(bào)表FAR(Failureanalysisreport)首件檢查報(bào)告Firstarticleinspectionreport初步報(bào)告（或預(yù)備報(bào)告）Preliminaryreport一份更新報(bào)告Anundatedreport一份總結(jié)報(bào)告Afinalreport糾正及改善措施報(bào)告(異常報(bào)告單)CAR(CorrectiveActionReport)出貨檢驗(yàn)報(bào)告OutgoingInspectionReport符合性報(bào)告（材質(zhì)一致性證明）COC(CertificateofCompliance)稽核報(bào)告Auditreport品質(zhì)稽核報(bào)告Qualityauditreport制程稽核報(bào)告Processauditreport5S稽核報(bào)告5Sauditreport客戶稽核報(bào)告Customerauditreport供應(yīng)商稽核報(bào)告Supplierauditreport年度稽核報(bào)告Annualauditreport內(nèi)部稽核報(bào)告Internalauditreport外部稽核報(bào)告ExternalauditreportSPC報(bào)表(統(tǒng)計(jì)制程管制)Statisticalprocesscontrol工序能力指數(shù)(Cpk)Processcapabilityindex（規(guī)格)上限Upperlimit（規(guī)格）下限Lowerlimit規(guī)格上限UpperSpecificationLimit(USL)規(guī)格下限LowerSpecificationLimit(LSL)上控制限（或管制上限）UpperControlLimit(UCL)下控制限（或管制下限）LowerControlLimit(LCL)最大值Maximumvalue平均值A(chǔ)veragevalue最小值Minimumvalue臨界值Thresholdvalue/criticalvalueMRB單(生產(chǎn)異常通知報(bào)告)MaterialReviewBoardReport工藝流程圖ProcessFlowDiagram物料清單（產(chǎn)品結(jié)構(gòu)表/用料結(jié)構(gòu)表）BOM(BillofMaterials)合格供應(yīng)商名錄AVL(ApprovedVendorList)異常報(bào)告單CAR工程規(guī)范報(bào)告通知單（工程變更通知）ECNTECN自主點(diǎn)檢表SelfCheckList隨件單（流程卡）TravelingCard(RunCard)壓焊圖Bondingdiagram晶圓管制卡Waferinspectioncard晶圓進(jìn)料品質(zhì)異常反饋單FeedbackReportforWaferIncomingQualityProblems訂購(gòu)單PO(PurchaseOrder)出貨通知單AdvancedShipNotice送貨單/交貨單DO(DeliveryOrder)詢價(jià)單RFQ(Requestforquotation)可靠性實(shí)驗(yàn)報(bào)告ReliabilityMonitorReport產(chǎn)品報(bào)廢單PSB特采控制表CRB返工單PRB異常處理行動(dòng)措施OCAP減?。篧afer

[‘weif?]

n.威化餅干、電子晶片（晶圓薄片）Grind

[ɡraind]

vt.&vi.磨碎;嚼碎n.磨,碾Crack

[kr?k]

vt.&vi.

(使…)開(kāi)裂,破裂n.

裂縫,縫隙Ink

[i?k]

n.

墨水,油墨Die[dai]

vt.&vi.

死亡（芯片）Dot

[d?t]

n.

點(diǎn),小圓點(diǎn)Mounting

[‘maunti?]

n.

裝備,襯托紙Tape

[teip]

n.

帶子；錄音磁帶;錄像帶Size

[saiz]

n.

大小,尺寸，尺碼Thick

[θik]

adj.厚的，厚重的Thickness

[‘θiknis]

n.

厚(度),深(度)寬(度)Position

[p?‘zi??n]

n.

方位，位置Rough

[r?f]

adj.

粗糙的;不平的Fine

[fain]

adj.

美好的,優(yōu)秀的,優(yōu)良的,杰出的Speed[spi:d]

n.

速度,速率Spark[spɑ:k]

n.

火花;火星Out

[aut]

adv.離開(kāi)某地,不在里面；(火或燈)熄滅Grindstone

[‘ɡraindst?un]

n.

磨石、砂輪Mount[maunt]

vt.&vi.

裝上、配有Mounter

裝配工;安裝工;鑲嵌工Mounting

[‘maunti?]

n.

裝備,襯托紙Magazine

[,m?ɡ?‘zi:n]

n.

雜志,期刊，彈藥庫(kù)（傳遞料盒）Cassette

[k?‘set]n.盒式錄音帶；盒式錄像帶Inspect

[in‘spekt]

vt.檢查，檢驗(yàn)，視察Inspection

[in‘spek??n]

n.

檢查，視察Card

[kɑ:d]

n.

卡,卡片,名片劃片：Saw

[s?:]

n.

鋸vt.&vi.

鋸，往復(fù)運(yùn)動(dòng)Sawing

['s?:i?]

n.

鋸,鋸切,鋸開(kāi)Film

[film]

n.

影片,電影（薄膜，藍(lán)膜）Frame[freim]

n.

框架，骨架，構(gòu)架Clean

[kli:n]

adj.

清潔的,干凈的；純凈的Cleaner

[‘kli:n?]

n.

作清潔工作的人或物Oven

[‘?v?n]

n.

烤箱,爐Cassette

[k?‘set]n.

盒式錄音帶；盒式錄像帶Handler[‘h?ndl?]n.(物品、商品)的操作者Scribe

[skraib]

n.抄寫員,抄書吏Street

n.

大街,街道Blade

[bleid]

n.

刀口,刀刃,刀片Cut

[k?t]

vt.&vi.

切,剪,割,削Speed[spi:d]n.

速度,速率Spindle

[‘spindl]

n.

主軸，(機(jī)器的)軸Size

[saiz]

n.

大小,尺寸

,尺碼Cooling

['ku:li?]adj.

冷卻(的)Kerf

[k?:f]

n.

鋸痕,截口,切口Width

[widθ]

n.

寬度,闊度,廣度Chip

[t?ip]

n.

碎片、缺口Chipping[‘t?ipi?]n.

碎屑,破片Crack[kr?k]vt.(使…)開(kāi)裂,破裂n.裂縫,縫隙Missing

[‘misi?]adj.失掉的,失蹤的,找不到的Die[dai]

vt.&vi.

死亡（芯片）Saw

[s?:]

n.

鋸vt.&vi.

鋸，往復(fù)運(yùn)動(dòng)Street

[stri:t]n.

大街,街道Film

[film]

n.

影片,電影（薄膜，藍(lán)膜）Frame[freim]

n.

框架，骨架，構(gòu)架Tape

[teip]

n.

帶子；錄音磁帶;錄像帶Bubble

['b?bl]n.

泡,水泡,氣泡mount貼wafer晶圓

frame框架blade刀片tape膜cassette盒子completion完成loader上料un-loader出料initial初始化open打開(kāi)air空氣pressure壓力failure失敗vacuum真空alignment校準(zhǔn)ink黑點(diǎn)die芯片error錯(cuò)誤limit限制cover蓋子device產(chǎn)品data數(shù)據(jù)saw切割water水elevator升降機(jī)spindle主軸sensor感應(yīng)器wheel輪子setup測(cè)高rotary旋轉(zhuǎn)check檢查feed進(jìn)給

cutter切割speed速度height高度new新shift輪班pause暫停clean清洗

center中心chip崩邊

change變換enter確認(rèn)Offcenter偏離中心broken破的alarm報(bào)警上芯：Attach

[?‘t?t?]

vt.&vi.

貼上;系;附上Bond

[b?nd]

n.

連接,接合,結(jié)合vt.

使粘結(jié),使結(jié)合Bonder

[‘b?nd?]

n.聯(lián)接器,接合器,粘合器Dieattachmaterialepoxy粘片膠Epoxy

[e‘p?ksi]

n.環(huán)氧樹(shù)脂（導(dǎo)電膠）Material

[m?‘ti?ri?l]

n.

材料,原料Non-conductiveepoxy絕緣膠Conductive

[k?n‘d?ktiv]

adj.傳導(dǎo)的Dispenser

[dis‘pens?]

n.

配藥師,藥劑師Nozzle

[‘n?zl]

n.

管嘴,噴嘴Rubber

[‘r?b?]

n.

(合成)橡膠，橡皮Tip

[tip]

n.

尖端,末端Diepick-uptool吸嘴Tool

[tu:l]

n.

工具,用具Collect

[k?‘lekt]

vt.

收集,采集（吸嘴）Ejector

[i‘d?ekt?]

n.

驅(qū)逐者,放出器,排出器Pin

[pin]

n.針,大頭針,別針LeadFrame引線框架Lead

[li:d]

vt.&vi.

帶路,領(lǐng)路,指引Frame[freim]

n.

框架，骨架，構(gòu)架Magazine

[,m?ɡ?‘zi:n]

n.雜志,期刊（料盒）Curing

[‘kju?ri?]

n.

塑化,固化,硫化,硬化Oven

[‘?v?n]n.

烤箱,爐Scrap

[skr?p]

n.

小片,碎片,碎屑Dent

[dent]

n.

凹痕,凹坑DieLift-off晶粒脫落（芯片脫落，掉芯）Skew

[skju:]

adj.

歪,偏,斜Misorientation

[mis,?:rien‘tei??n]

n.

定向誤差,取向誤差Presqueezedel寫膠前氣壓延時(shí)Postsqueezedel寫膠后氣壓延時(shí)Squeeze

[skwi:z]

vt.榨取,擠出n.

擠,榨,捏Eject

[i‘d?ekt]

vt.&vi.

彈出,噴出,排出Delay

[di'lei]

n.

延遲Height

[hait]

n.

高度,身高Level

[‘levl]

n.

水平線,水平面;水平高度Head

[hed]

n.

頭部，領(lǐng)導(dǎo),首腦Ejectupdelay頂針延遲Ejectupheight頂針高度Bondlevel粘片高度PickLevel撿拾芯片高度Headpickdelay粘接頭拾取延遲Headbonddelay粘接頭粘接延時(shí)Pickdelay撿拾芯片延時(shí)Bonddelay粘接芯片延時(shí)Index

[‘indeks]

n.

索引;標(biāo)志,象征;量度Clamp

[kl?mp]

vt.&vi.

夾緊;夾住n.

夾具Indexclampdelay步進(jìn)夾轉(zhuǎn)換延時(shí)Indexdelay框架步進(jìn)延時(shí)Shear

[?i?]

vt.

剪羊毛,剪n.

大剪刀Test

[test]

n.

測(cè)驗(yàn),化驗(yàn),試驗(yàn),檢驗(yàn)Diesheartest推晶試驗(yàn)Thickness

['θiknis]

n.

厚(度),粗Coverage

[‘k?v?rid?]

n.

覆蓋范圍Epoxythickness&coverage導(dǎo)電膠厚度和覆蓋率Orientation[,?:rien‘tei??n]

n.

方向,目標(biāo)DieOrientation芯片方向Void

[v?id]adj.

空的,空虛的n.

太空,宇宙空間;空隙,空處;

空虛感,失落感Epoxyvoid導(dǎo)電膠空洞Chip

[t?ip]

n.

碎片Damage[‘d?mid?]

vt.&vi.

損害,毀壞,加害于n.損失,損害,損毀Chipdamage芯片損傷Backside

[‘b?ksaid]

n.

臀部,屁股，背面Chipbacksidedamage芯片背面損傷Tilt

[tilt]

vt.&vi.

(使)傾斜Tilteddie芯片歪斜Epoxyondie芯片粘膠Crack

[kr?k]

vt.&vi.

(使…)開(kāi)裂,破裂n.

裂縫,縫隙Crackdie芯片裂縫/芯片裂痕Lift

[lift]

vt.&vi.

舉起,抬起n.

抬,舉Lifteddie翹芯片Misplace

[,mis‘pleis]

vt.

把…放錯(cuò)位置Misplaceddie設(shè)置芯片NOdieonL/F空粘Insufficient

[,?ns?‘fi??nt]

adj.

不足的,不夠的Insufficientepoxy導(dǎo)電膠不足Epoxycrack導(dǎo)電膠多膠Epoxycuring銀漿烘烤Edge

[ed?]

n.

邊,棱,邊緣Partial

[‘pɑ:??l]

adj.

部分的,不完全的Mirror

[‘mir?]

n.

鏡子Missing

[‘misi?]adj.

失掉的,失蹤的,找不到的Edgedie/partialdie邊緣片/邊沿芯片Mirrordie光片/鏡子芯片Missingdie掉芯/漏芯/掉片Splash[spl??]vt.使(液體)濺起vi.(液體)濺落Splatter

[‘spl?t?]vt.&vi.

(使某物)濺潑Diagram[‘dai?ɡr?m]

n.

圖解,簡(jiǎn)圖,圖表Inksplash/inksplatter墨濺Diebondingdiagram上芯圖Dieshesrtest推片實(shí)驗(yàn)/推晶試驗(yàn)Diesheartester推片試驗(yàn)機(jī)Dieshesrtool推片頭Metalcorrosion晶粒腐蝕/芯片腐蝕Wafermappingsystem芯片分級(jí)系統(tǒng)System

['sist?m]

n.

系統(tǒng);體系wafer晶圓

die芯片attach粘貼glue銀膠substrate基板

magazine盒子inspection檢查parameter參數(shù)manual操作手冊(cè)reset重設(shè)enter確定error錯(cuò)誤input輸入speed速度stop停止pressure壓力vacuum真空sensor傳感器backside背面pin針statistics統(tǒng)計(jì)calibration校正bond貼片conversion改機(jī)thickness厚度tilt傾斜度shape形狀adjust調(diào)整contact接觸cover覆蓋device產(chǎn)品chip崩邊pause暫停elevator升降機(jī)initial初始化alignment校準(zhǔn)cassette盒子tape膜frame框架ring鐵圈temperature溫度rubbertip吸嘴frametype框架型號(hào)nozzle點(diǎn)膠頭writer劃膠頭壓焊：Wire

[‘wai?]

n.

金屬絲,金屬線;電線,導(dǎo)線Bond

[b?nd]

n.

接合,結(jié)合vt.

使粘結(jié),使結(jié)合Wirebond/Wiringbonding壓焊/焊絲/球焊Goldwire金絲Pad

[p?d]

vt.

給…裝襯墊,加墊子n.墊,護(hù)墊Bondpad焊點(diǎn)、鋁墊1stbond第一焊點(diǎn)Padsize焊點(diǎn)尺寸/鋁墊尺寸Capillary

[k?‘pil?ri]

n.毛細(xì)管;毛細(xì)血管（劈刀）Pitch

[pit?]

程度;強(qiáng)度;高度Padpitch鋁墊間距/焊點(diǎn)間距Elongation

[i:l??‘ɡei??n]n.延長(zhǎng);延長(zhǎng)線;延伸率Breaking

[‘breiki?]

n.

破壞,阻斷Load[l?ud]

n.

負(fù)荷;負(fù)擔(dān);工作量,負(fù)荷量BreakingLoad破斷力Pull

[pul]

vt.&vi.拉,扯,拔Shear

[?i?]

vt.

剪羊毛,剪n.

大剪刀Wirepull/ballpull（焊絲）拉力Wireshear/ballshear（焊絲）推力Ultrasonic

[,?ltr?‘s?nik]

adj.

(聲波)超聲的Power

[‘pau?]

n.

功力,動(dòng)力,功率Force

[f?:s]

n.

力;力量;力氣Ultrasonicpower超聲功率Bondingforce壓力Bondingtime時(shí)間Temperature

[‘temp?rit??]

n.

溫度,氣溫Bondingtemperature溫度Ultrasonicwirebonding超聲波壓焊EFO打火燒球loop

[lu:p]

n.

圈,環(huán),環(huán)狀物L(fēng)oopheight孤高Wirepulltest拉力試驗(yàn)Ballsheartest金球推力試驗(yàn)PIN1第一腳Ballheight球高Balldiameter球徑Cratering

[‘kreit?ri?]

n.

縮孔;陷穴（彈坑）KOHetchingtestKOH腐蝕試驗(yàn)BondCrateringtest壓焊腐蝕試驗(yàn)(彈坑試驗(yàn))Thermal

[‘θ?:m?l]

adj.熱的，熱量的Compression

[k?m‘pre??n]

n.

擠壓,壓縮TCB（ThermalCompressionBond）熱壓焊BondingDiagram壓焊圖/布線圖WrongBonding布線錯(cuò)誤Incomplete[,?nk?m‘pli:t]adj.不完全的,未完成的Incompletebond焊不牢Nobonding無(wú)焊N2BOX氮?dú)夤馬TPC實(shí)時(shí)過(guò)程監(jiān)控Tray

[trei]

n.

盤子,托盤HandingTray產(chǎn)品盤FBI壓焊后目檢FBIinsp-M/C壓焊檢驗(yàn)機(jī)Microscope

[‘maikr?sk?up]

n.

顯微鏡LowPowerMicroscope低倍顯微鏡Flux

[fl?ks]

n.

熔劑、焊劑；助熔劑，助焊劑Hook

[huk]

vt.&vi.

鉤住,吊住,掛住Wirepullhook線鉤（測(cè)拉力）Ballsheartool推球頭（測(cè)推力）Metal

[‘metl]

n.

金屬Discolor

[dis‘k?l?]

v.使脫色;(使)變色,(使)褪色Oxide

[‘?ksaid]n.

氧化物MetalDiscolor鋁條變色BondPadDiscolor鋁墊變色BondPadOxide鋁墊氧化Stick

[stik]

vt.&vi.

粘貼,張貼Peeling

[‘pi:li?]n.剝皮,剝下的皮Cratering

[‘kreit?ri?]n.

縮孔;陷穴（彈坑）Nonstickbondonpad鋁墊不粘Bondpadpeeling鋁墊脫落Bondpadcratering鋁墊彈坑Limit

[‘limit]

vt.

限制;限定Scratch

[skr?t?]

vt.&vi.

抓,搔，

刮傷Overreworklimit超過(guò)返工數(shù)Bondremove/scratch剔球劃傷Ballbondnon-stick金球脫落Balltolarge（small）金球過(guò)大（?。〣allbondshort金球短路Non-stickonlead引腳脫落（魚尾脫落）misplace

[,mis‘pleis]

vt.

把…放錯(cuò)位置connection

[k?‘nek??n]

n.連接,聯(lián)結(jié)MisplacedbondonLD壓焊打偏Wirebroken斷線Missingwire漏打Wrongconnection錯(cuò)打defective

[di‘fektiv]

adj.

有缺陷的，欠缺的Defectivelooping弧度不良Sagging

[‘s?ɡi?]

n.

下垂[沉,陷],松垂,垂度Loopsagging弧度下陷Lowloop弧度太低Highloop弧度太高Loopshort弧度短路Overhang

[,?uv?‘h??]vt.伸出;懸掛于…之上Residue

[‘rezidju:]

n.剩余,余渣Distortion

[dis‘t?:??n]

n.歪曲,曲解WireoverhangonLD跨越引線框架Wireresidue殘絲LFdistortion引線框架變形Quantity

[‘kw?ntiti]

n.

數(shù)目,數(shù)量Mismatch

[‘mis’m?t?]

vt.使配錯(cuò),使配合不當(dāng)Scrap

[skr?p]

n.

廢料vt.

廢棄,丟棄Scratch

[skr?t?]vt.刮傷QuantityMismatch數(shù)量不符EmptyM.notscrap空粘未報(bào)廢GoldWireScratch金絲受損Parameter參數(shù)Statistics統(tǒng)計(jì)Utility應(yīng)用Teach教習(xí)Bondtipoffset—焊線點(diǎn)糾偏Contactsearch接觸測(cè)高Zoomoffcenter放大倍數(shù)偏心校準(zhǔn)Calibration校準(zhǔn)BQM焊接質(zhì)量控制PR—patterrecognition—圖像識(shí)別Alignmenttolerance—對(duì)點(diǎn)偏差PRindexing—圖像控制下的步進(jìn)Capillary焊線劈刀Wirespool—送線卷軸Windowclamp—窗口夾板Transducer—功率換能器FTN功能鍵Wirethreading—送線器EFO電子打火Linearpower線性馬達(dá)Vacuumsensor真空感應(yīng)器Stepdriver—步進(jìn)驅(qū)動(dòng)Postbondinspection—焊接后檢查Wirepull—拉線Ballshape—推球Ballsize—焊球大小Ballthickness—焊球高度Loopheight—線弧高度Loopshape—線弧形狀Neckcrack—線頸折損Fineadjust–精確調(diào)整Conversion–換產(chǎn)品1stbondnonstick—第一點(diǎn)不粘2ndbondnonstick—第二點(diǎn)不粘peeling拔鋁墊（扯皮）Bondoff脫焊Balldeformation—焊球變形servomotor—伺服電機(jī)weldoff管腳脫焊crater裂縫goldwire金線missingball球未燒好weakbond虛焊塑封：Mold

[m?uld]

n.

模子,鑄型vt.

澆鑄,塑造Molding

[‘m?uldi?]

n.

成型（塑封）Compound

[‘k?mpaund]

n.

復(fù)合物,化合物MoidingM/C；MoldPress塑封機(jī)Press

[pres]

n.

印刷機(jī)Heater

[‘hi:t?]

n.

加熱器;爐子Pre-heater預(yù)熱機(jī)Chase

[t?eis]

n.

追捕,追獵Molddie/Moldchase塑封模具M(jìn)GPmoldMGP多缸模具Automold自動(dòng)包封機(jī)load

[l?ud]vt.&vi.

1

把…裝上車[船]2

裝…loader

['l?ud?]

n.

裝貨的人,裝貨設(shè)備,裝彈機(jī)AutoL/Floader自動(dòng)排片機(jī)handler

[‘h?ndl?]

n.

(動(dòng)物)馴化者（抓手）temperature

[‘temp?rit??]

n.

溫度,氣溫Pre-heatTemperature料餅預(yù)熱溫度MoldTemperature模具溫度Clamp

[kl?mp]vt.&vi.

夾緊;夾住n.

夾具Pressure[‘pre??]n.壓(力),壓強(qiáng)ClampPressure合模壓強(qiáng)Transferpressure注塑壓強(qiáng)Transfer[tr?ns‘f?:]vt.&vi.轉(zhuǎn)移;遷移n.

轉(zhuǎn)移Curing[‘kju?ri?]

n.

塑化,固化,硫化,硬化Curingtime固化時(shí)間Curingtemperature固化溫度Pre-heatTime（料餅）預(yù)熱時(shí)間Transferspeed注塑速度Transfertime注塑時(shí)間PMCtime(PostMoldCureTime)后固化時(shí)間Load/unload上料/下料Sweep

[swi:p]

vt.&vi.

掃,打掃,拂去WireSweep沖絲Open開(kāi)路Short短路Fill

[fil]vt.&vi.

(使)充滿,(使)裝滿,填滿Underfill

['?nd?fil]

n.

(孔型)未充滿Bodyunderfilled膠體未灌滿Incomplete[,?nk?m‘pli:t]adj.不完全的,未完成的Incompletemold未封滿Chip

[t?ip]

n.

碎片，缺口Chippackage/bodychip-out崩角Porosity[p?:‘r?siti]

n.

多孔性,有孔性PorosityBody膠體麻點(diǎn)Bubble[‘b?bl]

n.

泡,水泡,氣泡Blister

[‘blist?]

n.

氣泡vt.&vi.

(使)起水泡Smear[smi?]

vt.

弄臟,弄污n.

污跡,污斑Surface

[‘s?:fis]

n.

面,表面Rooughsurface不均勻（表面）Delaminate[di:‘l?m?neit]

v.

將…分層,分成細(xì)層Delaminating分層Void[v?id]adj.

空的,空虛的PKGVoid膠體空洞Deep[di:p]

adj.

深的Scratch[skr?t?]

vt.刮傷Bodydeepscratch膠體刮痕Dimension[di‘men??n]

n.

尺寸,度量MoldPKGdimension塑封體尺寸BTMwidth/length背面寬/長(zhǎng)Topwidth/length正面寬/長(zhǎng)PKGthick塑封體厚度Mismatch[‘mis’m?t?]vt.

使配錯(cuò),使配合不當(dāng)Moldmismatch/PKGmismatch包封偏差(膠體錯(cuò)位)Offset[‘?fset]vt.

抵消,補(bǔ)償Misalignment[‘mis?lainm?nt]

n.

未對(duì)準(zhǔn)Moldoffset/PKGmisalignment偏心PMC（postmoldcure）后固化Dummy[‘d?mi]

n.

人體模型Strip[strip]

vt.

剝?nèi)?

剝奪,奪走Dummymoldedstrip空封Moldflash廢膠Gate[ɡeit]

n.

門,柵欄門Moldgate注澆口、進(jìn)澆口Remain[ri‘mein]

n.

剩余物;殘余Gateremain小腳Compound

[‘k?mpaund]

n.

復(fù)合物,化合物Aging[‘eid?i?]

n.

老化,成熟的過(guò)程Compound

Aging料餅醒料（回溫過(guò)程）Locator[l?u‘keit?]

n.

表示位置之物,土地Block[bl?k]n.

大塊(木料、石料、金屬、冰等)LocatorBlock定位塊Ejector[i‘d?ekt?]

n.

驅(qū)逐者,放出器Pin[pin]n.

大頭針,別針，針Depth[depθ]

n.

深,深度EjectorPin頂針E-pinDepth頂針深度Storage[‘st?:rid?]

n.

儲(chǔ)藏處,倉(cāng)庫(kù)Coldroom/compoundstorage冷藏庫(kù)/料餅存放庫(kù)Air

[??]

n.

空氣

Gun[ɡ?n]

n.

槍,炮Coating[‘k?uti?]

n.

涂層,覆蓋層Material

[m?‘ti?ri?l]

n.

材料,原料,素材,資料AirGun氣槍DieCoating芯片涂膠AutodiecoatingM/C芯片涂膠機(jī)DieCoatingMaterial覆晶膠Cart[kɑ:t]

n.

手推車ASS’YBCart后站推車Tablet[‘t?blit]

n.

藥片、膠囊Loader[‘l?ud?]

n.

裝貨的人,裝貨設(shè)備,裝彈機(jī)Preheater[‘pri:’hi:t?]

n.預(yù)熱器Fixture[‘fikst??]n.(房屋等的)固定裝置AutoTabletLoader自動(dòng)排膠粒機(jī)CompoudPreheater高頻預(yù)熱機(jī)Load/UnloadFixture上料/下料架TabletMagazine膠粒盒CompoudTablets塑封料餅MoldingCleaningCompoud洗模餅misorientation

[mis,?:rien‘tei??n]

n.定向誤差,取向誤差PKGMisorientation膠體壓反Moldflashonlead塑封溢膠Moldcrack膠體裂痕Semiconductor半導(dǎo)體Molding–模封Onload上料Offload–出料Belt—皮帶Preheaterturntable–預(yù)熱轉(zhuǎn)盤Transfer傳送SafetyDoor安全門Pickandplace–機(jī)械手Motor馬達(dá)Station–模腔Cleaningbrush—清潔刷Cylinder氣缸Sensor傳感器Solenoid電磁閥Turnover–翻轉(zhuǎn)器Degate–切料口Bearing軸承Picker爪子Pusher–推動(dòng)器Cullbin–垃圾箱Pin針Vacuumpump—真空泵Mornitor–顯示器Cable–導(dǎo)線Pro溫度曲線Alarm報(bào)警Error錯(cuò)誤Driver驅(qū)動(dòng)Sensor–感應(yīng)器Inspection檢查Parameter參數(shù)Manual手動(dòng),手冊(cè)Reset復(fù)位Initialing初始化Guide–導(dǎo)軌Substrate基板Device產(chǎn)品種類LotTraveller隨工單Magazine盒子Cylinder–汽缸Bearing–軸承Stop停止EmergencyStop緊急停止Gripper--夾子Heat–加熱器Pipe–管子Temperature溫度Hopper–漏斗Compressair–壓縮空氣Overflow—反面漏膠Semiconductor半導(dǎo)體Molding–模封Operation–操作Flange–法蘭盤Pump–泵Chamber–腔體Vent–氣孔Value–值A(chǔ)larm報(bào)警Error錯(cuò)誤Inspection檢查Parameter參數(shù)Manual手動(dòng),手冊(cè)Reset復(fù)位Initialing初始化Incompletefill模封不全inching扭曲Overflow漏膠Misalignment模封錯(cuò)位Packagemismatch模封錯(cuò)位ResinHole/Void氣孔Foreignmaterials外來(lái)物Wiresweep線彎曲Roughsurface表面粗糙WrongOrientation模封方向反Eng.Sample工程師樣品Stain/Dirtyonpackage表面臟污Resinburr樹(shù)脂有毛刺Resinflashes毛刺DamageframeFRAME損壞Scratchonpackage樹(shù)脂表面劃傷Evaluation評(píng)估Crackpackage樹(shù)脂開(kāi)裂SPCsampleSPC樣品切筋Trim-Form1切筋TrimmingDambarcut2切筋模Trimdie3成形模Formdie4分離模singulate5沖廢De-junk6檢測(cè)Inspection外觀檢測(cè)7再成型機(jī)模具ReformDie8再成型機(jī)Reformsystem9料盤Plastictray10連筋Uncutdambar11毛刺burr14溢料Junk15裂紋Crack16離層（分層）Delaminating17管腳反翹Leadtipbend18筋未切Dam-baruncut19筋凸出Dam-barprotrusion20筋切入Dam-barcutin打印Marking1打印Marking2印章Markinglayout3激光打印Lasermarking4油墨打印Ink(UV)marking5正印Topsidemark6背印Backsidemark7鏡頭Lens8打印不良\模糊Illegiblemarking9漏打Nomarking10斷字Brokencharacter11缺字Missingcharacter12印字傾斜Slantmarking13印記錯(cuò)誤Wrongmarking14重印Remark15印字模糊（褪色）Fademark16印字粘污Smear19電流current21字體（字形）Font22定位針Locationpin23膠皮打印機(jī)Padprinter24激光打印機(jī)LaserMarkingM/C25后固化PMC(PostMoldCure)26后固化烤箱PMCOven27打印污斑M(jìn)arkingstain28印記移位Markingshift電鍍Plating1電鍍Plating2來(lái)料Incoming3沖廢Dejunk4熱煮軟化槽SockingTank7檢驗(yàn)Inspection外觀檢測(cè)8烘烤Curing/Baking150℃9出料Unload10高速線電鍍High-speedPlatingLine11統(tǒng)計(jì)過(guò)程控制SPC12搭錫Solderbridge13錫絲、錫須Solderflick/Whisker14鍍層不良Platingdefects15發(fā)黃Yellowish16發(fā)黑Blacken17變色Discolor18露底材（露銅）Exposecopper19粘污Smear20鍍層厚度Platingthickness7-20um21鍍層成分Platingcomposition電鍍成分,Sn22外觀Outgoing23易焊性Solderability24無(wú)鉛化Pb-free/leadfree25結(jié)合力Adhesiveforce26可靠性Reliability27電解Electrolyticdeflash28清洗（自來(lái)水）Citywater29高壓清洗Highpressurerinse30脫脂Descale31清洗（純水）DIwater32活化（合金）Activation33預(yù)鍍、預(yù)浸Pre-dip34電鍍Plating35吹風(fēng)Airblow36中和Neutralization37褪鍍Stripper38拖出Dragout39上料機(jī)Loader40下料機(jī)Unloader41純錫Tin42純水(去離子水)DIwater43水壓Waterpressure44理化分析Physicalandchemicalanalysis45測(cè)厚儀PlatingThicknessMeter/ElectroplatedCoatingThicknessTest46離子污染度測(cè)試儀IonContaminationTesterContaminoCT10047C含量測(cè)試儀CarbonTester51去氧化HSCUDescale52預(yù)浸Pre-dip53電鍍電流Current54鍍液溫度Temperature電鍍液platingsolution55電鍍槽platingtank56中和Neutralization59烘干Curing60錫球Solderball61錫厚度和成分Snthickness&composition62沖廢De-junk去膠渣63去溢料Degate沖塑，沖膠64去飛邊Deflash去膠(塑封工序)65錫鉛電鍍Tinleadplating66無(wú)鉛電鍍Leadfreeplating;Puretinplating67鍍層起泡Solderbump68鍍層剝落Solderpeeloff69鍍層偏厚或偏薄ThickorThinPlating70退錫Solderremove71電鍍報(bào)廢Platingscrap72錫渣Solderpeeling73電鍍錫塊Solderbump74電鍍橋接Platingbridge75電鍍變色SPDiscoloration76電鍍污染SPContamination77電鍍錫攀爬SPadhere78電解除油Electro-degreasing測(cè)試Testing1測(cè)試Testing2打印Lasermark3編帶機(jī)Tape&ReelMachine4編帶Reel5測(cè)試機(jī)Tester6分選機(jī)TrayTestHandler7Vision檢測(cè)Directionvision8劃傷Scratch9打錯(cuò)Wrongmark10斷字