ZonalArchitecture

POWERINGTHENEXT

GENERATIONE/EARCHITECTURE

INAUTOMOTIVE

ZoneZone

Vehicle

Computer

ZoneZone

RENESAS

POWERSYSTEMMARKETINGANDARCHITECTURESEPTEMBER,2025

MARCBRACKEN

MARC.BRACKEN.JX@RENESAS.COM

?2025RenesasElectronicsCorporation.Allrightsreserved.

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AGENDA(WEBINAR)

PowerProducts

Brochure

RenesasOverview

E/EArchitecture

SystemOverview&Considerations

ZonalBlockDiagrams

High-PowerComputeBlockDiagrams

FunctionalSafety

MarketTrends&Outlook

RenesasSolutions

Page3

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RENESASOVERVIEW

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SOLUTIONOFFERINGS

Ourmissionistodevelopasafer,healthier,greener,andsmarterworldbyprovidingintelligencetoourfourfocusgrowthsegments:Automotive,Industrial,Infrastructure,andIoTthatareallvitaltoourdailylives,meaningourproductsand

solutionsareembeddedeverywhere.

Automotive

Industrial

Infrastructure

IoT

Highlyreliablevehiclecontrol,

safeandsecure

autonomousdriving,

Eco-friendlyelectricvehicles

Lean,flexibleandsmartindustry

Robustinfrastructure,enabling

safetyandefficiency

Comfortable,safeand

healthylifestyles

throughIoT

GLOBALMANUFACTURINGNETWORK

13manufacturingfacilitiesinJapan,China,SoutheastAsia,andtheUS

GlobalpartnerssuchasTSMCandGLOBALFOUNDRIES

YonezawaNaka

US:

PalmBay

China:BeijingSuzhou

Takasaki

SaijoKofuOita

Kawashiri

Nishiki(Kumamoto)

Malaysia: PenangKualaLumpur

Japan

Manufacturingsites(Front-end:6)

Manufacturingsites(Back-end:7)

●ManufacturingandEngineeringServicesCompanies

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E/EArchitecture

Powertrain

xEV

Chassis/Body

Infotainment

PRODUCTPORTFOLIOOVERVIEW

ADAS

PowerMOSFET&GaNHEMT

IntelligentPowerDevices(IPD:HSS&eFuse)

DiscretePowerManagement

POWER

PowerManagementIC

BatteryMgmt.IC

USB-CPD

GateDrivers

TimingController

OptoCoupler

ANALOG&

CONNECTIVITY

BluetoothLE

AHLICVSPIC

HapticsController

BluetoothLE

SensorSignalConditioningICInductivePositionSensor

GreenPAK(CMIC)

DIGITAL

R-CarV3x/V4x

R-CarHx/Mx/ExR-CarS4/RH850/U2xRH850/U2B

RL78(16B)–Gen2RL78–Gen2

RH850/U2A

RL78–Gen2

RH850/U2A/C

RL78–Gen2

Page7

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E/EARCHITECTURE

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SYSTEMSOVERVIEW&

CONSIDERATIONS

E/EARCHITECTURE

CENTRALUNITPERFORMANCEGROWTH

FUTURE

Beyond2030CY

DOMAINARCHITECTUREMIGRATIONTOWARDSZONEARCHITECTURE

MANYPARTIALECUINTEGRATIONS

ZonalArchitecture

Zone

Vehicle

Computer

ZoneZone

Zone

Migrating

2025CYto2030CY

PAST

Distributed/Domain

Central

GW

DCUDCU

HybridArchitecture

Zone

ZoneCo-GW

DCU

——DCU

DCU

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AUTOSTRATEGY/ROADMAP

ARCHITECTURETYPE–TENDENCY

I/Ocontrolfunction

.Sensor(s)Actuator(s)

GbECAN/LIN

100MbE

FunctioncentralizationmakeseitherzonalECUtobesimplifiedortohelpCentralECUbyhigherperformanceHybrid(Domain+Zone)Zone

Centralcompute

ADC

CDC

CentralECU*

Centralcompute

Centralcompute

VCintegratedtypeVCcentralizedtype

OR

performance

Zone+PT

Zone+CS

Zone

Zone

VCU

Zone

Zone

CS

Zone

Zone

I/O

I/O

I/O

I/O

PT

Zonerequiredperformancedependsonvehiclefunction(s)or

actuator(s)connectedtoZone

AllVCfunctionsareintegratedintocentralsothatapowerfulRTperformanceisrequired

I/Ohubhasonlysignalroutingfunctionandrequires

PT/CSisreusedfromlegacysothatrequiredperformanceisnotchanged

Zonerequiredperformancedependsonactuator(s)connectedtoZone

VCUmergedseveralvehiclecontrolfunctionsrequireshigher

performancethanlegacy

Zonerequiresperformancedependsonactuator(s)connectedtoZone

Service

application

RTcontrolfunction

minimumperformance

VCU:VehicleControlUnit(incl.DCU),PT:Powertrain(xEV),CS:ChassisandSafety,BD:Body(BCM),ADC:ADASDomainController,CDC:CockpitDomainController,HPC:HighPerformanceCompute

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ZONECONTROLLER

AnECUconsolidatingoneormorefunctionswhicharephysicallylocatedclosetoeachotherandconnectregionalsensors,actuatorsorendECUstotheCentralComputeUnit

I/OAggregator

withPower

Control

I/OAggregator

withCompute

Capabilities

I/OAggregatorwithPower

I/OAggregator

Controland

ComputeCapabilities

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HPCTRENDWITHSDV

TheevolutionforE/EarchitecturecancreatevariouspowermanagementsolutionsaroundtheSoCinSDV

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ZONALBLOCKDIAGRAMS

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12VZONALCONTROLLERHIGHVARIANTEXAMPLE

VBATT6V–18V

OtherECUs

Vout_1

Vout_X

RAA27108X

HVPMIC

4ChHSSVariousRDSon

WideVin,Multi

Rail,WDT,

FuSa(B/D)

2CheFuseVarious

RDSon

1CheFuseVarious

RDSon

SPI

GPIO

2ChHSSVariousRDSon

PowerSupplyICs

Legend

1ChHSSVariousRDSon

GPIO

Isense

High-SideLoadControl

MainMCU

32bit

(=100HSS&=75eFuse

SPI

Devices/Variants)

Other

LINTXCVR

(Single/

Dual/Quad)

GPIO

CANTXCVR(Single/Dual)

SPI

N-Ch

Power

SPIOorGPIO

1-CheFuseController

GPIOSPI

Other

OtherECUs

MOSFET

ENetPHYENetSwitch

High-SideLoadControlw/ExternalMOSFETs(40A+)

OtherECUs

ChLSS

MSDI

VariousRDSon

(=10Devices/Variants)

NFC

HBridge

Driverw/SPI

&Diag

(option)

LEDDriverICs

VBATT

Communications

AdditionalControl/Interface

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48VZONALCONTROLLERHIGHVARIANTEXAMPLE

VBATT

DCDCPre

Regulator

48VRated

32V–70+V

4ChHSSVariousRDSon

OtherECUs

Vout_1

Vout_X

RAA27108XPMIC

WideVin,MultiRail,WDT,

FuSa(B/D)

2CheFuseVarious

RDSon

1CheFuseVarious

RDSon

SPI

GPIO

2ChHSSVariousRDSon

1ChHSSVariousRDSon

PowerSupplyICs

Legend

GPIO

Isense

High-SideLoadControl

MainMCU

32bit

(=tbdHSS&=tbdeFuse

SPI

Devices/Variants)

Other

LINTXCVR

(Single/

Dual/Quad)

GPIO

CANTXCVR(Single/Dual)

SPI

NCh

Power

MOSFET

SPIOorGPIO

1CheFuseController

GPIOSPI

Other

OtherECUs

ENetPHYENetSwitch

High-SideLoadControlw/ExternalMOSFETs(25A+)(=tbdDevices/Variants)

OtherECUs

ChLSS

MSDI

VariousRDSon

NFC

(option)

LEDDriverICs

HBridge

Driverw/SPI

&Diag

VBATT_48V

Communications

AdditionalControl/Interface

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HIGH-POWERCOMPUTEBLOCK

DIAGRAMS(POWERMANAGEMENT)

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CENTRALCOMPUTE–HIGHRANGE(PMICSASIL-DCAPABLE)

RAA271040

DualDCDC

SyncBuck

Controller

FETs

V_DDR_1

V_SCP_1

V_SYS1

V_SYS1

V_SYS1

FETs

VD3

V_SYS2

RAA271040

DualDCDC

SyncBuck

Controller

FETs

V_DDR_3

V_SCP_2

V_DDR_4

V_SPS

V_SCP_3

FETs

V_CIS

V_SPS

RAA14504R4D

SmartPowerStage

RAA271016

MultiPhase

SyncBuck

Controller

V1_SoC

V_SYS1

VCC1

RAA14504R4D

SmartPowerStage

VCC1

RAA14504R4D

SmartPowerStage

V_DDR_8

RAA14504R4D

SmartPowerStage

DDR5Memory

VBATT6V–18V

RAA271005LVPMIC

Buck1

Buck2

Buck3

Buck4

Buck5

LDO5

LDO6

RAA271005

Vrange

Imax

Vin

2.7Vto5.5V

Buck1

0.3Vto3.3V

12A

Buck2

0.3Vto3.3V

2.5A

Buck3

0.5Vto3.3V

2.5A

Buck4

0.5Vto3.3V

2.5A

Buck5

0.5Vto3.3V

2.5A

LDO1

1.8V/3.3V

75mA

LDO2

1.8V/3.3V

75mA

LDO3

1.8V/3.3V

75mA

LDO4

1.8V/3.3V

75mA

LDO5

0.6Vto3.3V

500mA

LDO6

0.6Vto3.3V

500mA

V_SYS1

VCC2

Communications

OtherECUs

PowerSupplyICs

Legend

SoC

RCARGen5

CENTRALCOMPUTE–LOWRANGE(PMICSASIL-DCAPABLE)

VBATT6V–18V

FETs

V_SYS1

FETs

V_SYS2

V_SYS1

RAA271040

DualDCDC

SyncBuck

Controller

RAA14504R4D

SmartPowerStage

V_SYS1

V1_SoC

V_SYS1

VCC1

RAA14504R4D

SmartPowerStage

RAA271016

MultiPhase

SyncBuck

Controller

V_SYS1

VCC1

PowerSupplyICs

Legend

V_DDR_1

V_DDR_2

V_DDR_3

V_SCP_1

V_SCP_2

V_SCP_3

V_DDR_4

VD_3

VCC1

DDR5Memory

RAA271005LVPMIC

Buck1

Buck2

Buck3

Buck4

Buck5

LDO5

LDO6

LDO1

RAA271005

Vrange

Imax

Vin

2.7Vto5.5V

Buck1

0.3Vto3.3V

12A

Buck2

0.3Vto3.3V

2.5A

Buck3

0.5Vto3.3V

2.5A

Buck4

0.5Vto3.3V

2.5A

Buck5

0.5Vto3.3V

2.5A

LDO1

1.8V/3.3V

75mA

LDO2

1.8V/3.3V

75mA

LDO3

1.8V/3.3V

75mA

LDO4

1.8V/3.3V

75mA

LDO5

0.6Vto3.3V

500mA

LDO6

0.6Vto3.3V

500mA

Communications

OtherECUs

SoC

RCARGen5

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FUNCTIONALSAFETY

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EXAMPLECOVERAGE(REPRESENTATIVEFORMANYDEVICES)

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FUNCTIONALSAFETY–ISO26262COMPLIANTPRODUCTS

ISO26262compliant–scalableFS,uptoASIL-DcertifiedPWRATTACHproducts,withlongFuSahistoryand

establisheddevelopmentprocess

ComplementsSOC/MCUforsystemsafetyrequirements

Clarityofsafetyfunctionsandresponsibilitiesforsystemintegrationandverificationefficiency

SystemSafetyRequirements

SOC/MCU+

PWRATTACH

Analysis

PWRATTACHSafetyConcept

SAFETY

REQUIREMENTS

FMEDA-CARTOOLAllowscustomizedanalysis

SAFETY

APPLICATIONNOTE

EffectiveFuSaworkproductsforsystemintegrators(SafetyandSWfunctions)consistentwithSOC/MCU

CentralFuSasupportthatcoversbothSOC/MCUaswellasPWRATTACHproducts

IndependentreviewprocesswithFSassessor

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PMIC&MCU/SOCFUNCTIONALSAFETY

CollaborativeworkwithRH850/RCARforsystem-levelsafety/robustness

RH850/RCAR+PMICintegrationandtestingreducecustomer’sverificationeffortsPMICHWRef

Design

ReducedBOM

PMIC&MCU

ChangeManagement

PMIC&MCU

QualityManagement

ISO26262SafetyManuals

PMICSWDrivers

PotentialimpactofchangesinMCU/SoCorPMIConfunctionalsafetyareassessedbeforechangesaremadeManagementmethodisdefined&trace-abilityismaintained

ThePMICalsofollowstheMCU/SoCqualitymanagementprocessandsafetyconcept

MCU/SoC+PMICintegrationandtestingissupported,furtherdrivingthePMICsafetyconcept

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FUSA&AUTOMOTIVEQUALITY

Renesas’AutomotiveProductDevelopment

ProcedurealignswithIATF16949and

ISO26262withindependent,I3level

assessment.

Automotiveproductsarequalifiedtothe

AEC-Q100revJspecification,with

QBE(QualifiedbyExtension),singlelot

qualificationormultipleFABlotqualification.

Thequalificationdownpointshavemultiple

temperaturetesting.

HTOL(HighTemperatureOperationLife)

stresstestingroom(25C),cold(-40C)and

hot(85C,105Cor125Cdependingon

Automotivegrade)temperaturetestingat

testdownpoints.

Strictadherenceto

developmentstandards

RenesashasmultipleinitiativestosupportanddrivelowDPPMonallproducts

FABDefectreduction:RenesascoordinateswithallourFabricationOSATstohavequarterly

defectreduction.RenesasrequestsorrequiresadditionaldefectreductionparametersorprocessstepsfromtheFabsubcon.

On-GoingReliabilityMonitoringRenesashason-goingreliabilitymonitoringforbothFABandAssembly.EveryquarterHTOL(forFAB)andotherreliabilitytests(forpackages)areexecutedbasedonprocesstechnologynodesorassemblysites.

Thesemonitorsassistinrecognizinganyadditionaldefects.

On-goingProductiontestImprovement

SBL(StatisticBinLimit),SYL(StatisticYieldlimit),andSPAT(StaticPartAverageTesting).

ContinuousefforttodrivelowDPPM

Renesashasmultipleareastoimproveproductsreliability

HVS:NewAutomotivePMICproductsimplementHVSfordigitalandanalogFETs

Burnin:Burn-inisexecutedwhenrequiredforautomotiveproducts

Scantest:AutomotiveproductsexceedthescantestrequirementsfortheirASILcategory.

BIST:ASIL-DproductsimplementABISTandLBISTforimprovedin-fieldfailureidentification

Drivingproductreliabilityimprovements

Page24

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MARKETTRENDS&OUTLOOK

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E/EARCHITECTUREEVOLUTION

Motivation

-Functionconsolidation,harnesssimplification,weightreduction

Requirements

-Increasedreal-timeprocessingperformance,enhancedfunctionalsafetylevelwithlowpower

-SecureOTAsolutionthroughcloudcollaborationlikemobileapproach

FUTURE-Zonearchitecture

Centralcompute/

Zone

VehicleLevel

Simpleactuator

TOMORROW-Centralizedarchitecture

TODAY-Distributedarchitecture

Gateway

Domaincontrol

Simpleactuator

Scalable&Easytoplug-inhardware

Upgradable&Reusablesoftware

Safe,redundantandstreamlinednetwork

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E/EARCHITECTUREPOWERMANAGEMENTTRENDS

SDVTransition:VehicleplatformsaremovingtoSDVbasedarchitectures,resultinginincreasedprocessingpower

requirementsinzonalandHPCapplications.MorepowerfulMCUsandSoCsdemandhighercurrents,complexpowersequencing,functionalsafety,andperformancetosupporttheadvancedcapabilitieswithinthesesolutions.

PowermanagementwithinthesemoduleswillproviderailsfortheMCU/SoC,DDRmemory,communicationssuchasethernet,CAN,LINandSERDES,aswellasotherICs.

Therearetransitionalarchitecturesthathybridizepreviousdomain-basedsystemswithzonal,butthisisnotthelong-termobjective.Eveninthesescenarios,thepowermanagementstrategiesarechangingtohandleincreasedrequirements.

Zonal:ThezonalmoduleCAGR(2027-2032)=23.2%growingto~172Muby2032.12Vpowerdistributionisstillthestandardandtherewillbesubstantialgrowthinthepowersupplytreestiedto12Vbattery.48VhasbeenusedbyTeslaandisbeingadoptedatotherOEMsinChina/APAC,buttheestimationof48Vmarketpenetrationisquitedynamic.Therewillbedesignsmovingforwardthatrequireconversionfrom48VbatterydowntoSoCrailvoltages.

HPC/CCU:TheHPCmoduleCAGR(2027-2032)=16.6%growingto~26Muby2032.Powerattachisalargeareaoffocustosupportthewholecentralcomputesolution.OEMstakedifferentapproaches,butthenumberofSoCstodaytendstobe2to3withpossibly1to2companionMCUs,requiringcomplexpowersolutions.LongtermamorepowerfulSoCsuchasGen5couldreducethisto1permodule.Thiswillleadtomorecost-effectivesystemsolutionsbut

requiresdeeperanalysisfromafunctionalsafetyperspectiveaswellasacceptanceattheOEMs.

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ZONALHIGH/LOW&HPC/CCUSPLITSBYMODULE(2027-2032)

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E/EARCHITECTUREPOWERMANAGEMENTTAMESTIMATE

CAGR(2027to2032)forZonalPower=20%&HPCPower=21%

Page29

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RENESASSOLUTIONS

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RENESASAUTOMOTIVEPOWERPILLARS

Comprehensive,efficientpower

portfoliothatconnects

seamlesslywithindustry-

leadingMCUs

Pincompatibleproductfamilies

allowhighestROIbyusingthe

samedesignformultiple

platforms

108xPMICfamilysupportsmultipleRH850MCUs

FeatureRich

Programmablepower-up/downsequence;Windowed

Question-Answerwatchdog;MCUerrorsignalinput;

MCUreset(RSTB)andinterruptsignals;Second

safetypath(select.delayw/reset);DualBandgaps,

Vref&Irefw/monitoring;OV/UVmonitoringforeach

outputvoltage;Externalcore-voltagemonitoring;BIST

(logic/analog),OSCclockmonitoring;More…

ScalablePortfolio

ASIL-BtoASIL-Drefdesigns

Functionalsafetysolutions/docs

Safety

Provensystemsolutions

thathelpacceleratestimetomarketwhileenabling

customerstoinnovate

Power

FunctionalSafety

Software

MCU/SoC

FasterTimetoMarket

Winningcombinations

Comprehensiveengineering-vettedsolutions

leveragingthebestcombinationofour

digital,analogandpowerproducts

Easeofusethroughdevelopmenttoolsand

Docs,SW,engineeringsupport,andreference

designs

Examples:

EVBatteryMgmtSystem

Optimizedsolutions

System-focusedICspecification

ICsystemvalidation

SOC

Power

Refdesign/FuSa

Customerdesignandramp

EasytoStart

Sunroofcontroller

MCU/

Winningcombinationstoaccelerateyourapplicationdesign

Analog+Power+EmbeddedProcessing+Connectivity

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PMICVALUEPROPOSITION:EXPEDITEDEVELOPMENTCYCLE

STRONGSUPPORTINCUSTOMERDEVELOPMENTPROCESS

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RCAR(SOC)SYSTEMPMIC&SUBPMICADVANTAGES

Thereare4competitiveadvantagestotheSystem&SubPMICapproach

FlexiblePowerSequencingtofitanyapplication

ProgrammingviaGUI

SupportforwiderangeofSoCs

Scalableapproachtoservemultipleplatforms

Maximizedesignre-useandminimizeredesign

WorkseamlessywithSub-PMICs

10‘sofmAsto10‘sofAmps

Small,highlyintegrated,cost-effectivefootprintandlowBOM

Highlyintegrated,smallinductors,fewdiscretes

Integratedsupportforfunctionalsafety/ISO-26262

Outstandingpeformance

Leadingelectricalperformance(efficiency,transientetc)!

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HPC–GEN4V4M/HRECOMMENDEDPOWERATTACH

SoCpart

RecommendedPMICs

Functionalsafetydesignconsidered

V4M2

RAA271005(OTP10.61)

ASIL–D(RAA271003forASIL–B)

V4M3

RAA271005(OTP10.61)

ASIL–D(RAA271003forASIL–B)

V4M5

RAA271005(OTP10.61)

ASIL–