nsyspartof

synopsys"CPO

下的硅光子芯片設計與挑戰(zhàn)周錚?2025

ANSYS,

Inc./

Proprietary.

Do

NotShare.

nsyspart。f

synopsys"CPOChallengesand

Solutions?2025

ANSYS,

Inc./

Proprietary.

Do

NotShare.?TraditionalCu

interconnectscannotscaleto

current

requirements?Optical

interconnectswillcontinueto

replace

copper?Currentoptical

interconnects

provide

increasedscalability,

but

power/cost

requirements

become

untenable?Co-packagedoptics

brings

powerandcost

down

and

allows

forbreaking

through

the“power

wall”Ref:Co-Packaged

Opticsand

anOpen

Ecosystem-Cisco

BlogsRef:Intel

Labs

Day2020WhyCo-Packaged

Optics?Ref:

“Perspective

onthefuture

ofsilicon

photonicsandelectronics”

N.

Margalit,et.al.,Appl.

Phys.

Lett.

118,

220501

(2021)

nsyspart。f

synopsys"3?2025ANSYS,

Inc./

Proprietary.

Do

NotShare.Industry

MovingTowardsCPO,

keyenableroffutureAI/HPC

systemsK.Zhang,"Semiconductor

Industry:

Present&Future,"2024IEEEISSCC,San

Francisco,

2024,

pp.

10-15,/10.1109/ISSCC49657.2024.10454358SamsungNVIDIAAnnouncesSpectrum-XPhotonics,Co-Packaged

OpticsNetworkingSwitchestoScaleAI

Factories

to

Millionsof

GPUsBroadcomAdvancesOpticalConnectivityforAI

Infrastructure

with

Industry-LeadingSolutionsat

OFC

2025SamsungShowcasesAI-EraVisionand

Latest

FoundryTechnologiesatSFF

2024|Samsung

SemiconductorGlobalCisco

DemonstratesCo-packaged

Optics

(CPO)Systemat

OFC

2023

-

Cisco

BlogsAyar

Labs

UnveilsWorld's

First

UCIe

Optical

ChipletforAIScale-UpArchitectures

nsyspart。f

synopsys"Intel

Demonstrates

First

Fully

IntegratedOptical

I/OChipletOdin

CPO

2.0

architecture-

Ranovus4

?2025ANSYS,

Inc./

Proprietary.

Do

NotShare.TSMCRef:

“Perspective

onthefuture

ofsilicon

photonicsandelectronics”

N.

Margalit,et.al.,Appl.

Phys.

Lett.

118,

220501

(2021)CrossdieelectromagneticsSignificant

Multiphysics

Challengewith

CPO

EvolvingIncreasedIRdropselectromigrationOptical

I/Oand

photonicdevicesimulation

nsyspart。f

synopsys"5?2025ANSYS,

Inc./

Proprietary.

Do

NotShare.ThermalandStressThermal

Management

RHSC/Totem/

RHSC-ET/

Icepak/

LumericalTHERMALAWAREStructural

Integrity

Mechanical/

RHSC

ETPhotonicComponents

LumericalEMIRTotem/

RHSCESDAnalysisPathfinderSCOptical

Input/Output

Lumerical/ZemaxSignal

IntegrityRaptorX/

HFSS/

LumericalAnsys

MultiphysicsSolutionsfor

CPOSTRUCTURALAWARE

nsyspart。f

synopsys"6?2025ANSYS,

Inc./

Proprietary.

Do

NotShare.Thermal

ManagementAnsysCollaborateswithTSMCon

COUPEAnsysandTSMC

Enablea

Multiphysics

PlatformforOpticsand

Photonics,AddressingNeedsofAI,

HPCSiliconSystemsCollaborationon

TSMC’sCOUPEsiliconphotonicsplatformdramaticallyspeedschip-to-chipandmachine-to-machinecommunication

forcloud,datacenters,HPC,and

AIchips?

Optical

input/output→Zemax?

Photonicchip

→Lumerical?

Multi-die

power

integritysignoff

→RedHawk-SCandTotem?

High-frequencyelectromagnetic

analysis

between

dies

→RaptorX?Thermal

managementofthe

multi-die

heterogenoussystem

→RedHawk-SCElectrothermal/news-center/press-releases/4-24-24-ansys-collaborates-with-tsmc-coupe-on-multiphysics

nsyspart。f

synopsys"7?2025ANSYS,

Inc./

Proprietary.

Do

NotShare.

nsyspart。f

synopsys"Photonic

IntegratedCircuit

Design

Overview?2025

ANSYS,

Inc./

Proprietary.

Do

NotShare.INTERCONNECTIntegrated

Circuit

levelsimulatorCMLCompilerModel

librarydevelopmentfor

Photonic

PDKsVerilog-A

PlatformPhotoniccircuit

modelingwith

Verilog-AAComprehensiveSuiteof

Leading

Photonic

DesignTools-

LumericalPHOTONIC

INTEGRATEDCIRCUITSIMULATION

nsyspart。f

synopsys"9?2025ANSYS,

Inc./

Proprietary.

Do

NotShare.'uecPhotonic

Foundries

PDKs

nsyspart。f

synopsys"10?2025ANSYS,

Inc./

Proprietary.

Do

NotShare.OpticalCouplingWorkflow?2025

ANSYS,

Inc./

Proprietary.

Do

NotShare.

nsyspart。f

synopsys"Optical

I/O?

Reliablycouple

light

inandout

of

package?Connectsinglefiberor

multi-fiber

arraysto

package

with

active

and

passive

alignments?Limited

beachfrontdensity

encourages

3D

stackingof

photonic

layers

necessitating

verticalopticalcouplingChip-to-chip

couplingFiber-to-chipcouplingAyar

Labs’optical

I/Ochiplets

picturedalongsidea

hostSoC,andshowingthefinal

packaged

module

(Ayar

Labs

Partnerswith

Nvidia

forOptical

I/OChiplets-

EE

Times)

nsyspart。f

synopsys"?2025ANSYS,

Inc./

Proprietary.

Do

NotShare.12Coupling

Lighttoand

from

PIC?

Duetothe

large

modesize

mismatch

betweentheopticalfibers

andwaveguide,

getting

light

in

and

out

of

PIC

remains

achallenge?

Commondesignsforgetting

light

inand

out

of

PIC:GratingcouplerEdgecoupler

nsyspart。f

synopsys"13?2025ANSYS,

Inc./

Proprietary.

Do

NotShare.?

Inversetaper

is

includedto:-

Vary

modeconfinement-Reducefiber-waveguide

mode

mismatch?

Majorsourcesof

coupling

loss:-Modeconversion

loss-Reflection

atfacet-Mode

mismatchEdgeCoupler

Design

nsyspart。f

synopsys"14?2025ANSYS,

Inc./

Proprietary.

Do

NotShare.?

Finite

Difference

Eigenmode(FDE)solver-

Calculatetheoverlap

betweenthefiber

modeand

thewaveguide

mode?

Eigenmode

Expansion(EME)solver-

Calculatethe

modeconversion

lossalongthetaper-Modeconversioncanalso

be

calculated

with

fewer

approximations

usingfullwavesimulations

(FDTD)

acceleratedwith

GPUsEdgeCoupler

SimulationWaveguide

ModeFiber

Mode

nsyspart。f

synopsys"15?2025ANSYS,

Inc./

Proprietary.

Do

NotShare.Grating

Coupler

Design?

Diffractiongrating-

Changesthewave-vector

directionof

light-

Couple

light

betweenfiber

(nearvertical)

andwaveguide

(horizontal)?

Keydesign

parameters:-Pitch

andetch

length/depthofgrating-Position/tiltingangle

offiber?

Morecomplicatedgratingdesigns

(apodized,

multiple

etch

depths,…)

involve

additionaldesign

parameters

nsyspart。f

synopsys"16?2025ANSYS,

Inc./

Proprietary.

Do

NotShare.?

Finite-DifferenceTime-Domain(FDTD)solver-

Solve

Maxwell‘s

equationsforarbitrarygeometries-

Simulate

light

propagationanddiffractionGrating

CouplerSimulation

nsyspart。f

synopsys"17?2025ANSYS,

Inc./

Proprietary.

Do

NotShare.GratingcouplerWaveguidelayersProcessFiberGrating

CouplerOptimization?

PhotonicInverse

Designautomatically

discoveroptimalgeometries

for

a

desiredtarget

performance

withonlytwosimulations

in

each

iteration.Generate

Geometry

Run

Simulation

Check

Performance/hc/en-us/articles/360042800573-Inverse-Design-of-Grating-Coupler-2D-/hc/en-us/articles/1500000306621-Inverse-design-of-grating-coupler-3D-J

nsyspart。f

synopsys"18?2025ANSYS,

Inc./

Proprietary.

Do

NotShare.AutomaticallyAdjust

Design2025

R1?

Multi-GPUjobsconfigurationfrom

FDTD

tabandSweeps

panel?

Memory

Usage

andResourceConfiguration

improvementsfor

multi-

GPU?

Supportfordispersivematerials,

PEC

materials,

anddipolesourcesFastand

Continuous

Innovation

ofGPU-Accelerated

FDTD2024

R1?

Single-nodemulti-GPUextendedmemory

capacity?

Meshing

performance

improvements?

New

PML

boundaries?

Single-Node

Multi-GPU

acceleration?

SupportforPeriodicandBloch

BoundaryConditions?

Multi-Node,

Multi-GPU

acceleration?

Supportforon-demandcompute

usingAnsys

Burst2023

R2?

IntroductionofGPUsupport

for

Lumerical

FDTDImportant

links:AO

nsyspart。f

synopsys"19?2025ANSYS,

Inc./

Proprietary.

Do

NotShare.2025

R22024

R2▲Incorporating

microlensestocouplingschemes?

PICsensitivityto

misalignment

can

mean

highcostor

lowyield

from

manufacture?

Additionof

microlenses

integratedwithcouplersaims

to

reducethis

limiting

factor-Expands

modefield

diameter

and

relaxes

alignmenttolerancesMarchetti,R.Lacava,C.Carroll,L.Gradkowski,K.andMinzioni,

P.,“Couplingstrategiesforsiliconphotonicsintegratedchips”,

Photonics

Research,

7(2),201-239(2019)MangalN.,SnyderB.,CampenhoutJ.V.,SteenbergeG.V.,MissinneJ.,"Expanded-BeamBacksideCouplingInterfaceforAlignment-TolerantPackagingofSiliconPhotonics",IEEEJSTQE26(2),1-7(2019)

nsyspart。f

synopsys"20?2025ANSYS,

Inc./

Proprietary.

Do

NotShare.Microand

macroscale

inco-packagedopticssimulation?

Co-design

in

microand

macroscale

is

essentialfor

improvingoverall

efficiencies-

Chip-level

performance

needsto

inform

propagationthrough

lens

model!?

AnsysOptics

providesfullsolutionstosimulate

light

coupling

in

micro-

and

macro-scaleStructuresizetowavelength

ratio

nsyspart。f

synopsys"21?2025ANSYS,

Inc./

Proprietary.

Do

NotShare.PZPZ

F

nsyspart。f

synopsys"Solution:Vertical

Fiber-to-ChipCouplingSystem?

Lumerical

FDTD-

Waveguide

mode

injected

at

1.andfield

recordedat

2.-

Scriptforfield

projectionto

plane

normalto

beamdirectionat

3.?ZBFdatacentered

at

peak

intensity,

located

atX

,o?

GCtransmissionfrom

power

ratio

between3.and

1.?Zemax

OpticStudio

Physical

Optics

Propagation

(POP)-Beam

propagationof

projectedfield

inZBFdatafrom

3.to4.-

FiberCoupling

Efficiencyfromoverlapcalculationwithfiber

mode

at

4.?

VaryX,o

tofind

optimalGC

beam

location

relative

tomicrolens.

ForfixedX,o,this

isequivalenttovarying

microlenslocation(X

).?Varyfiber

location(X

A

)

andfiberangle

(θFA).NOTE:

Field

profiles

in

logscaletoshowdifferences

moreclearly.FPPLELEPELXPGC

interfaceNearfieldL:

FDTDcoordinatesP:

POPcoordinates22?2025ANSYS,

Inc./

Proprietary.

Do

NotShare.DFT

monitorPμlens

(radiusRμ)GCWG

modeFiber

mode

Beam

fieldProjectedfieldFiberXE,oXE,oL

XPX

FAXLθFAZLZEθo4321PLL

nsyspart。f

synopsys"WorkflowAutomation23?2025ANSYS,

Inc./

Proprietary.

Do

NotShare.System

inputsFiber

location(X

A

)FPpitchfullwidth1LumericalscriptFDTDParametricSystemPOP5GCdutycycle

=

full

width/pitch

nsyspart。f

synopsys"Fiber

Coupling

Efficiencyμlens

radius(Rμ)μlenslocation

(X)PL24?2025ANSYS,

Inc./

Proprietary.

Do

NotShare.PXE,oθoFiber

angle(θFA)SystemoutputsZBFE,o

3GC

duty

cycleGCtransmission42ParameterTotal

effect

on

Figure

of

Merit

(%)Fiber

CouplingGCTransmissionμlens

location

(X)45.30GC

duty

cycle35.199.4μlens

radius

(Rμ)11.00Fiber

angle

(θFA)45.60Fiber

location

(X

A

)53.30TOTAL86.199.4FPPLSensitivityAnalysis?AI

model

generated

from

300designs

in~1

day*?GC

Transmission:

Linear

regression?

Fiber

Coupling

:

Deep

Feed

Forward

Network

nsyspart。f

synopsys"25?2025ANSYS,

Inc./

Proprietary.

Do

NotShare.

nsyspart。f

synopsys"One-ClickOptimization

(OCO)?

Fast

Optimization

with

AI

model:

1514designs

in~1

minute-

Over500x

faster

than

using

direct

physical

simulation?Target:

Maximize

Total

Coupling

Efficiency=GC

transmission*Fiber

Coupling

Efficiency?Validationof

bestdesign

usingoriginal

physical

solversBesttotalcoupling

efficiency:45.6%

(AI

model)/45.5%

(simulation)26?2025ANSYS,

Inc./

Proprietary.

Do

NotShare.RobustnessAnalysis?Exampleofstatisticalvariations:-

GC

duty

cycle:over/under

etch-

Fiber

location:assembly

error?Failure

limit:

1dB

below

nominal

(optimal)?100designsforeach

scenario

(≤

1

minute

with

AI

model,~8

hoursvalida