XXXXXXXXX有限公司企業(yè)技術(shù)規(guī)范

PCB工藝設(shè)計(jì)規(guī)范

目次

前t..................................................................................................................................11

1范困和簡介............................................................12

1.1范圍...............................................................12

1.2簡介...............................................................12

1.3關(guān)鍵詞.............................................................12

2規(guī)范性引用文件.........................................................12

3術(shù)語和定義.............................................................12

4PCB合層設(shè)計(jì)............................................................13

4.1登層方式...........................................................13

4.2PCB世計(jì)介質(zhì)厚度要?求.............................................14

5PCB尺寸設(shè)計(jì)總則........................................................14

5.1可加工的PCB尺寸范圍...............................................14

5.2PCB外形要求.......................................................16

6拼板及輔助邊連接設(shè)計(jì)..................................................17

6.1V-CUT連接........................................................17

6.2郵票孔連接........................................................18

6.3拼板方式..........................................................19

6.4輔助邊與PCB的連接方法............................................21

7基準(zhǔn)點(diǎn)設(shè)計(jì).............................................................23

7.1分類...............................................................23

7.2基準(zhǔn)點(diǎn)結(jié)構(gòu)........................................................23

7.2.1拼板基準(zhǔn)點(diǎn)和單元基準(zhǔn)點(diǎn)...................................23

7.2.2局部基準(zhǔn)點(diǎn).................................................23

7.3基準(zhǔn)點(diǎn)位置........................................................24

7.3.1拼板的基準(zhǔn)點(diǎn)..............................................24

7.3.2單元板的基準(zhǔn)點(diǎn)............................................25

7.3.3局部基準(zhǔn)點(diǎn).................................................25

8器件布局要求..........................................................25

學(xué)習(xí)參考

8.1器件布局通用要求.................................................25

8.2回流焊............................................................27

8.2.1SMD器件的通用要求.........................................27

8.2.2SMD器件布局要求...........................................28

8.2.3通孔回流焊器件布局總體要求...............................30

8.2.4通孔回流焊器件布局要求....................................30

8.2.5通孔回流洋器件印錫區(qū)域要求...............................30

8.3波峰焊.............................................................31

8.3.1波峰焊SMD器件布局要求.....................................31

8.3.2THD器件布局通用要求.......................................33

8.3.3THD器件波峰焊通用要求.....................................34

8.3.4THD器件選擇性波峰爆要求..................................34

8.4壓接...............................................................38

8.4.1信號(hào)連接器和電源連接器的定位要求........................38

8.4.2壓接器件、連接器禁布區(qū)要求...............................39

9孔設(shè)計(jì)..................................................................42

9.1過孔..............................................................42

9.1.1孔間距......................................................42

9.1.2過孔禁布設(shè)計(jì)...............................................42

9.2安裝定位孔.......................................................42

9.2.1孔類型選擇.................................................42

9.2.2禁布區(qū)要求.................................................43

9.3槽孔設(shè)計(jì)..........................................................43

10走線設(shè)計(jì)................................................................44

10.1線寬/線距及走線安全性要求.......................................44

10.2出線方式..........................................................45

10.3覆銅設(shè)計(jì)工藝要求................................................47

11阻焊設(shè)計(jì)................................................................48

11.1導(dǎo)線的膽并設(shè)計(jì)...................................................48

11.2孔的阻焊設(shè)計(jì).....................................................48

學(xué)習(xí)參考

11.2.1過孔.......................................................48

11.2.2測試孔...................................................48

11.2.3安裝孔...................................................48

11.2.4定位孔...................................................49

11.2.5過孔塞孔設(shè)計(jì).............................................49

11.3焊盤的阻焊設(shè)計(jì)..................................................50

11.4金手指的阻算設(shè)計(jì)................................................51

11.5板邊阻焊設(shè)計(jì).....................................................52

12表面處理...............................................................52

12.1熱風(fēng)整平.........................................................52

12.1.1工藝要求..................................................52

12.1.2適用范圍..................................................52

12.2化學(xué)媒金.........................................................52

12.2.1工藝要求..................................................52

12.2.2適用危國..................................................53

12.3有機(jī)可焊性保護(hù)層.................................................53

12.4選擇性電皺金.....................................................53

13絲印設(shè)計(jì)...............................................................53

13.1絲巾設(shè)計(jì)通用要求................................................53

13.2絲印內(nèi)容.........................................................53

14尺寸和公差標(biāo)注.........................................................55

14.1需要標(biāo)注的內(nèi)容...................................................55

14.2其它要求..........................................................55

15榆出文件的工藝要求....................................................56

15.1裝配圖要求........................................................56

15.2鋼網(wǎng)圖要求.......................................................56

15.3鉆孔圖內(nèi)容要求...................................................56

16背板部分...............................................................56

16.1背板尺寸設(shè)計(jì).....................................................56

16.1.1可加工的尺寸范圍..........................................56

學(xué)習(xí)參考

16.1.2拼板方式.................................................57

16.1.3開窗和倒角處理...........................................57

16.2背板器件位優(yōu)要求.................................................57

16.2.1基本要求..................................................57

16.2.2非連接器類器件............................................57

16.2.3配線連接器................................................57

16.2.4背板連接器和護(hù)套....................................59

16.2.5防誤導(dǎo)向器件、電源連接器................................60

16.3禁布區(qū)............................................................62

16.3.1裝配禁布區(qū)................................................62

16.3.2器件禁布區(qū)................................................62

16.4絲印...............................................................65

17附錄...................................................................66

17.1"PCBA五種主流工藝路線”.......................................66

17.2背板六種加工工藝.................................................67

17.3其它的特殊設(shè)計(jì)要求..............................................69

18參考文獻(xiàn).............................................錯(cuò)誤!未定義書簽。

學(xué)習(xí)參考

圖1左右插板示意圖.................................................................13

圖2PCB制作受法示意圖..............................................................13

圖3對(duì)孫設(shè)計(jì)示意圖.................................................................14

圖4PCB外形示意圖..................................................................15

圖5PCB輔助邊設(shè)計(jì)要求一............................................................15

圖6PC8精助邊謾計(jì)要求二............................................................16

圖7PC8輔助邊設(shè)計(jì)要求三............................................................16

圖8PCB外形設(shè)計(jì)要求一..............................................................16

圖9PCB外身設(shè)計(jì)要求二..............................................................17

圖10V-CUT自動(dòng)分析PCB禁布要求.................................................17

?11自動(dòng)分板機(jī)刀片對(duì)PCB板邊器件漿布要求........................................18

圖12V-WI板諄設(shè)計(jì)要求...........................................................18

圖13V-CUT與PCB邊球線珞/pad設(shè)計(jì)要求...........................................18

圖14郵票孔設(shè)計(jì)拳數(shù)..............................................................19

國15銃板邊示意圖................................................................19

圖16L形PCB猶速拼板方式..........................................................19

圖17拼板數(shù)量示意圖..............................................................20

圖18規(guī)則單元板拼板示意圖......................................................20

圖19不規(guī)則單元板拼板示意圖....................................................20

圖20拼板蒙固輔助設(shè)計(jì)............................................................21

圖21金手指PCB拼板推薦方式.......................................................21

圖22枝,像對(duì)稱拼板示意圖..........................................................21

圖23輔助邊的連接長度要求........................................................22

圖24不規(guī)則外形PCB補(bǔ)齊示意圖.....................................................22

圖25PCB外形空軌處理示意.........................................................23

圖26基準(zhǔn)點(diǎn)分類...................................................................23

圖27單元MARK點(diǎn)結(jié)構(gòu)..............................................................23

圖28局部MARK點(diǎn)晶構(gòu).............................................................24

圖29正反面原準(zhǔn)點(diǎn)位置.基本一致...................................................24

K30輔助邊上卷準(zhǔn)點(diǎn)的位置要求...................................................24

圖31鏡像對(duì)稱拼板輔助邊上MARK點(diǎn)位置要求.........................................25

圖32局部MARK點(diǎn)相對(duì)于器件中心點(diǎn)中心對(duì)稱.........................................25

圖33熱a攵元件的放置..............................................................26

學(xué)習(xí)參考

圖34插拔器件需要考慮操作空間...................................................26

圖35大面枳PCB預(yù)留印錫支撐PIN位置...............................................26

圖36拉手條與器件高度匹紀(jì)........................................................27

1937纖點(diǎn)日視檢查燙水示恁圖......................................................27

困38插框PCB進(jìn)槽方向SND器件禁布區(qū)示意圖.........................................27

圖39面陣列器件的禁布區(qū)要求......................................................28

困40兩個(gè)SOP封裝器件架容的示意圖................................................28

圖41片式器件兼容示意圖..........................................................28

圖42貼片與插件器件某容設(shè)計(jì)示意圖...............................................28

圖43貼片苕件引腳與炸盤接觸面枳示意困...........................................29

圖44器件布局的距離要求示意圖...................................................29

圖45BARCODE與各美器件的布局要求...............................................30

圖46印蜴區(qū)內(nèi)禁布絲即............................................................31

圖47偷錫憚盤設(shè)計(jì)要求............................................................31

圖48SOT器件波峰墀布局要求......................................................31

圖49相同類型器件布局圖示........................................................32

圖50不同類型器件布局圖..........................................................32

圖51道孔、測試點(diǎn)與?尾盤距離具體定義.............................................33

圖52元件本體之間的距離..........................................................33

圖53熔鐵操作空間.................................................................34

圖54最小絆盆邊緣間距............................................................34

圖55焊叁排列方向（相對(duì)于進(jìn)板方向）.............................................34

圖56評(píng)點(diǎn)和器件之間位宣示意圖...................................................35

圖57焊點(diǎn)為中心、R=6m的示意圖.................................................35

國58間距大于1.27mm,憚盤大于1rm的多引腳插件評(píng)點(diǎn)................................35

圖59單點(diǎn)焊接推薦的布局..........................................................36

國60對(duì)側(cè)或三鋤有器件的單點(diǎn)布局.................................................36

圖61相鄰兩側(cè)有器件的單點(diǎn)布局...................................................36

圖62一側(cè)有器件的單點(diǎn)布局........................................................37

圖63器件兩制或兩側(cè)以上有器件的布局.............................................37

圖64一便有器件的布局............................................................37

圖65多排多引腳器件禁布區(qū)........................................................38

圖66歐式連接器、接地連接器定位要求.............................................38

圖672mtnFB連接器、電源插針定位要求..............................................38

學(xué)習(xí)參考

圖682mmHM、2.5mi1S3、2mmHM電源連接器定位要求................................39

圖69彎公/母連接器正面和背面的禁布區(qū)............................................39

圖70連接器面的禁布要求..........................................................40

1971連按髯背面的禁布曼求........................................................40

圖72比括座的禁布要求............................................................40

圖732mmFB電源插座的禁布要求....................................................41

圖74壓接型牛頭插座的禁布要求...................................................41

圖75D型連接器的禁布要求.......................................................41

圖76孔距離要求...................................................................42

圖77孔類型.......................................................................43

圖78定位孔示意圖.................................................................43

?79楮孔在平面層的最小間隙要求.................................................44

圖8U走線到評(píng)叁崗..............................................................44

國81金屬殼體器件表層走線過孔禁布區(qū).............................................45

圖82插槽區(qū)域的禁布區(qū)............................................................45

困83避免不時(shí)稱走線..............................................................46

圖84理盤中心出線................................................................46

圖85焊盤中心出線................................................................46

圖86焊盤出線要求一..............................................................47

圖87焊叁出線要求二..............................................................47

圖88走線與過孔的連接方式........................................................47

圖89網(wǎng)格的設(shè)計(jì)...................................................................48

圖90過孔阻祥開窗示意圖..........................................................48

圖91金屬化安裝孔的恒炸開窗示意圖...............................................49

國92非金屬化安裝孔阻坤設(shè)計(jì)......................................................49

圖93微帶焊在孔的阻焊開窗........................................................49

國94非金屬化定位孔阻洋開窗示意圖...............................................49

圖95BGA測試好盤示意圖.........................................................50

圖96BGA下測試孔阻焊開窗示意圖.................................................50

圖97嬋盤的租坪設(shè)計(jì)..............................................................50

圖98焊盤陽焊開窗尺寸............................................................51

圖99密間距的SMD阻憚開窗處理示點(diǎn)圖.............................................51

圖100金手指租焊開窗示意圖........................................................52

圖101需要過波峰理的PCB板邊阻焊天窗設(shè)計(jì)示意圖...................................52

學(xué)習(xí)參考

圖102條粘碼的位置要求............................................................54

圖103制成板條碼框.................................................................54

圖104成品板條碼框...............................................................54

19105可癡工的尺寸示意圖..........................................................56

圖106背板倒向尺寸示意圖..........................................................57

圖107牛頭插座間距要求............................................................58

圖108D型連接器間距要求...........................................................58

圖109壓接型普通插座間距要求.....................................................59

圖110背板連接器右插板布局示意圖.................................................60

圖111minicoax和2rmiHM連接器的住五要求............................................60

圖112接地連接器和歐式連接器的位1：要求..........................................61

?1132mmFB逐接器和單pin業(yè)源插針的位置要求......................................61

圖1142nmHM連接器和單pin電源插針的位五實(shí)求......................................61

圖1152mmHM—1*3pin電淞連接器和2EHM-C型連接器位置要求........................62

圖1162nmHM-1*3pin電源連接器的位置要求.......................................62

國117歐式連接器禁布要求示意圖...................................................63

圖118波峰焊背板焊點(diǎn)布置要求示意圖...............................................63

圖119D型連接器的禁布要求.........................................................64

圖120牛頭插座禁布要求............................................................64

圖121BNC插座的禁布要求...........................................................65

圖122單面貼裝示意困..............................................................67

圖123單面混裝示意圖..............................................................67

圖124雙面貼裝示意困..............................................................67

圖125常規(guī)波峰焊雙面混裝示意圖...................................................67

圖126選擇性波峰理雙面泥裝示意圖.................................................67

圖127背板主流工藝1示意圖.......................................................67

圖128背版主流工藝2示意圖.........................................................68

圖129背板主流工藝3示意圖.........................................................68

用130背板主流工藝4示意圖.........................................................68

圖131背板主流工藝5示意圖.........................................................69

圖132背板主流工藝6示意圖.........................................................69

圖133同軸連接器選擇性波峰焊布局設(shè)計(jì)要求.........................................70

學(xué)習(xí)參考

表1塊省的層厚要求.................................................................14

表2PC8尺寸要求....................................................................15

表4條碼與各種封裝類型器件距離要求表..............................................30

表6相同類型SS件布局要求數(shù)值表....................................................32

表6不同類型器件布局要求教值表....................................................32

表7安裝定位孔優(yōu)選類型...........................................................42

表8禁布區(qū)要求.....................................................................43

表9推薦的線寬/線距..............................................................44

表10走線到非金屬化孔距離.......................................................45

表11阻坪設(shè)計(jì)推薦尺寸..........................................................51

表12可加工的尺寸................................................................56

表13元器件絲印要求表............................................................65

表14擴(kuò)展卡PCB的諄度要求.........................................................67

表15內(nèi)存條PCB的厚度要求.........................................................69

學(xué)習(xí)參考

前言

本規(guī)范的其他系列規(guī)范：《柔性PCB工藝設(shè)計(jì)規(guī)范》

與對(duì)應(yīng)的國際標(biāo)準(zhǔn)或其他文件的一致性程度：無

規(guī)范代替或作廢的全部或部分其他文件：《PCB工藝設(shè)計(jì)規(guī)范》

本規(guī)范由單板工藝設(shè)計(jì)部門提出。

本規(guī)危批準(zhǔn)人：

學(xué)習(xí)參考

1范圍和簡介

1.1范圍

本規(guī)范規(guī)定了PCB設(shè)計(jì)中的相關(guān)工藝設(shè)計(jì)參數(shù)o

本規(guī)應(yīng)適用于PCB工藝設(shè)計(jì)。

1.2簡介

本規(guī)范從PCB外形、材料在法、卷準(zhǔn)點(diǎn)、器件布局、走線、孔、阻焊、表面殳理方式、絲印

設(shè)計(jì)等多方面，從DFM甬度定義了剛?性PCB（含背板）的相關(guān)工藝設(shè)計(jì)參數(shù)。

本現(xiàn)范還包括以下附加設(shè)計(jì)文檔：

1.3關(guān)鍵詞

PCBDFM

2規(guī)范性引用文件

下列文件中的條款通過本規(guī)范的引月而成為本規(guī)范的條款。凡是注日期的引用文件，其隨后

所有的修改單（不包括勘誤的內(nèi)容）或修訂版均不適用于本規(guī)范，然而，鼓勵(lì)根據(jù)本規(guī)范達(dá)成核議

的各方研究是否可使用這些文件的最新版本。凡是不注日期的引用文件，其最新版本適用于本規(guī)范。

序號(hào)編號(hào)名稱

1GB（ITU、IEC等）XX標(biāo)準(zhǔn)

2Q/DKBAXXXXXX技術(shù)規(guī)范

3術(shù)語和定義

細(xì)間距器件：pitchWO.65m的翼形；I腳器件以及pitchWO.8mm的面陣列器件

StandOff：器件安裝在PCB上后，本體底部與PCB表面的建禹。

PCB表面處理方式縮寫：

熱風(fēng)整平：HotAirSolderLeveling

化學(xué)鎂金：ElectrolessNickelandImmersionGold

有機(jī)可爆性保護(hù)涂層：OrganicSolderabiIityPreservatives

選擇性電鍍金:SelectiveElectroplatedGold

玨板（Backplane/midplane）：安裝在插框的底部/中都，用于各單板之間信號(hào)的互聯(lián)和

給單板供電的栽體。

護(hù)套：和長針的磐板連接器配合使用，安裝在連接器的另一面，保護(hù)連接器的插針.

學(xué)習(xí)參考

說明：本規(guī)范中沒有定義的術(shù)語和定義請(qǐng)參考《電子裝聯(lián)術(shù)語》(Q/DKBA3001)。

54PCB疊層設(shè)計(jì)帶格式的：項(xiàng)“符號(hào)和編號(hào))

244.1疊層方式法鈾要求

⑷~1]PCB庚層方式法推薦為FoiI4法年主。

G3PC8在法一般有兩種設(shè)計(jì)：一種是銅箔加芯板(Core)的結(jié)構(gòu)，筒稱為Foil生法：另一種是

芯板(Core)費(fèi)加的方式，簡稱為BeekCoreGere疊法。特殊材料(如Rogers4350等)多層

板以及板材混壓■時(shí)可采用的fBox密法。

圖?絲_PC8制作變法示龍圖<'帶格式的：項(xiàng)日符號(hào)和編號(hào))

U3-12]PCB外層一般選用0.50Z的銅笳，內(nèi)層一般,選用10Z的銅笛：盡量避也在內(nèi)層使用兩

向鋼箔厚度不一致的芯板。

曬@PCB全法需采用對(duì)稱談?dòng)?jì)。

對(duì)稱設(shè)計(jì)指絕緣層厚度、半固化片類別、桐箔厚度、圖形分布類理(大銅箔層、線路層)盡

量相對(duì)于PCB的垂直中心線對(duì)稱。

學(xué)習(xí)參考

lOmil

H0K

介

質(zhì)

銅

對(duì)

層

稱

對(duì)

稱OZ

對(duì)

呼

稱

omi軸

oz線

興拎儂對(duì)杯設(shè)計(jì)示如圖帶格式的：項(xiàng)目符號(hào)和編號(hào)

M4.2PCB設(shè)計(jì)介質(zhì)厚度要求

曰-?PCB缺花