分揀機器人參考程序（主要包括設備自檢子程序、人工補料子程序、基礎分揀組程序、復雜分揀子程序等。）PROCSBZJ()//設備自檢程序QXP; //拾取吸盤工具HOME; //回到Home點SENDZJOK,1; //觸摸屏顯示第一個字樣WAITTIME3; //停留3秒SETBVAC_1； //打開小吸盤吹氣功能SENDZJOK,2; //觸摸屏顯示第二個字樣WAITTIME3; //停留3秒SETVacunm_1； //打開大吸盤吸氣功能SENDZJOK,3; //觸摸屏顯示第三個字樣WAITTIME3; //停留3秒RESETVacunm_1； //關閉小吸盤吹氣功能RESETBVAC_1； //關閉大吸盤吸氣功能SENDZJOK,4; //觸摸屏顯示第四個字樣ENDPROCPROCRGBL()//人工補料程序SENDRGBL,XPXH; //發(fā)送需要的芯片型號至觸摸屏SENDRGBL,XPLX; //發(fā)送需要的芯片類型至觸摸屏HOME; //回到Home點WAITDIContinue,1; //等待人工放置完成HMI; //接收觸摸屏設定值RGBLWZ:=RECEIVE{16}; //觸摸屏設定的放料位置YDXPYLQ,RGBLWZ; //取出人工放置位置芯片YDGWXP,A; //放置工作區(qū)空位ENDPROCPROCJCFJ()//基礎分揀程序MOVEABSJHOME\NOEOFFS,V1000,FINE,TOOL0;RESET; //初始化子程序QXP;FORAFROM1TO4DO //拆除四個工位蓋板YDGB,A;IFVacSen_1=1THEN //判斷真空檢知(雙)是否吸到蓋板YDGBYLQ,1; //放置蓋板原料區(qū)ELSE RESETVacunm_1; //關閉真空(雙)吸盤ENDIFENDFORDRPD:=0; //電容判斷清零FORAFROM1TO26DO //對原料區(qū)芯片視覺檢測YDXPYLQ,A;CCD;IFCCD_OK=1THEN //如果檢測OK放回YDXPYLQ,A;ELSEYDXPHSQ,A; //檢測NG放回回收區(qū)IFA>=20ANDA<=27THEN //判斷是否為電容DRPD:=1;ENDIFENDIFENDFORFORAFROM1TO20DOYDGWXP,A;CCD;IFCCD_OK=1THEN //如果檢測OK放回YDGWXP,A;ELSEYDXPHSQ,A; //檢測NG放回回收區(qū)ENDIFENDFORIFDRPD=1THEN //補充對應工位空位芯片FORAFROM1TO5DOFORBFROM1TO26DOIFXPZT{A}=0ANDXPZT{B}=1ANDXPLX{A}=XPLX{B}THENYDB,A;ENDIFENDFORENDFORFORAFROM16TO20DOFORBFROM1TO26DOIFXPZT{A}=0ANDXPZT{B}=1ANDXPLX{A}=XPLX{B}THENYDB,A;ENDIFENDFORENDFORELSEFORAFROM1TO5DOFORBFROM1TO26DOIFXPZT{A}=0ANDXPZT{B}=1ANDXPLX{A}=XPLX{B}THENYDB,A;ENDIFENDFORENDFORFORAFROM6TO10DOFORBFROM1TO26DOIFXPZT{A}=0ANDXPZT{B}=1ANDXPLX{A}=XPLX{B}THENYDB,A;ENDIFENDFORENDFORENDIFMOVEABSJHOME\NOEOFFS,V1000,FINE,TOOL0;GWJC1; //第一次工位檢測FORAFROM6TO10DO //判斷二、三號工位相同編號、相同FORBFROM11TO15DO //種類、顏色不同芯片互換IFXPZT{A}=1ANDXPZT{B}=1ANDXPLX{A}=XPLX{B}ANDXPYS{A}<>XPYS{B}THENYDGWXP,A;YDXPYLQ,27;YDGWXP,B;YDGWXP,A;YDXPYLQ,27;YDGWXP,B;ENDIFENDFORENDFORGWJC2; //第二次工位檢測 ENDPROCPROCFZFJ()//復雜分揀程序HMI; //接收觸摸屏設定值HMISDGW1:=RECEIVE{1}; //設定工位HMISDGW2:=RECEIVE{2}; HMISDCP1:=RECEIVE{3}; //設定產品HMISDCP2:=RECEIVE{4};FORAFROM1TO5DO //設定產品顏色HMICPYS1{A}:=RECEIVE{4+A};ENDFORFORAFROM1TO5DOHMICPYS2{A}:=RECEIVE{9+A};ENDFORGW{HMISDGW1}:=HMISDCP1; //將新工位產品賦值GW{HMISDGW2}:=HMISDCP2; FORAFROM1TO4DO //尋找相同的產品工位d:=0;FORBFROM1TO4DOIFGW{A}=GW{B}THEND:=D+1;IFD=2THENXTGW:=GW{A}; GOTOZ;ENDIFENDIFENDFORENDFORZ:FORAFROM1TO2DO //先對產品安裝蓋板YDGBYLQ,A;YDGWGZQ,HMISDGW{A};ENDFORFXP;QLSQ;FORAFROM1TO2DO //對產品鎖螺絲FORBFROM1TO2DOYDLSD,1;YDGWLSD{A},B;ENDFORENDFORFLSQ;QXP;FORAFROM1TO2DO //產品放置成品區(qū)YDGWGZQ,HMISDGW{A};YDCPQ,1;ENDFORFORAFROM(HMISDGW1-1)*5+1TOHMISDGW1*5DOYDGWXP,A;CCD;IFCCD_OK=1THEN //如果檢測OK放回YDGWXP,A;ELSEYDXPHSQ,A; //檢測NG放回回收區(qū)ENDIFENDFORFORAFROM(HMISDGW2-1)*5+1TOHMISDGW2*5DOYDGWXP,A;CCD;IFCCD_OK=1THEN //如果檢測OK放回YDGWXP,A;ELSEYDXPHSQ,A; //檢測NG放回回收區(qū)ENDIFENDFORYSFZ; //顏色賦值 FORAFROM1TO15DO //移出多余芯片IFXPZT{A}=1ANDGWYS{A}<>YS{A}THENYDGWXP,A; YDXPYLQ,27;ENDIFENDFORFORAFROM1TO15DOFORBFROM1TO26DOIFXPZT{A}=0ANDXPZT{B}=1ANDXPLX{A}=XPLX{B}ANDGWYS{A}=YS{B}THENYDB,A; //對產品補料ENDIFENDFORENDFORMOVEABSJHOME\NOEOFFS,V1000,FINE,TOOL0;PD:=0;FORAFROM16TO20DOYDGWXP,A;IFVacSen_2=1THEN //判斷真空檢知(單)是否吸到芯片YDGWXP,A; //放置蓋板原料區(qū)ELSE PD:=PD+1;RESETVacunm_2; //關閉真空(單)吸盤ENDIFENDFORIFPD=2ORPD=4THENFORAFROM16TO20DOGWYS{A}:=BYS{A}; ENDFORELSEFORAFROM16TO20DOIFBYS{A}=1THENGWYS{A}:=2;ELSEGWYS{A}:=1;ENDIFENDFORENDIFFORAFROM16TO20DO //移出多余芯片IFXPZT{A}=1ANDGWYS{A}<>YS{A}THENYDGWXP,A; YDXPYLQ,27;ENDIFENDFORFORAFROM16TO20DOFORBFROM1TO26DOIFXPZT{A}=0ANDXPZT{B}=1ANDXPLX{A}=XPLX{B}ANDGWYS{A}=YS{B}THENYDB,A; //對產品補料ENDIFENDFORENDFORGWJC3; //第三次工位檢測 FORAFROM11TO15DO //判斷二、三號工位相同編號、相同FORBFROM16TO20DO //種類、顏色不同芯片互換IFXPZT{A}=1ANDXPZT{B}=1ANDXPLX{A}=XPLX{B}ANDXPYS{A}=XPYS{B}THENGWYS{B}:=2;GWYS{A}:=1;ELSEGWYS{B}:=1;GWYS{A}:=2;ENDIFENDFORENDFORFORAFROM11TO20DO //移出多余芯片IFXPZT{A}=1ANDGWYS{A}<>YS{A}THENYDGWXP,A; Y