SINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINEIPC-A-610CNF版-2014年7月

取代E版2010年4月電子組件的可接受性由IPC開發(fā)SINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINE標準化1995年5月，IPC技術(shù)行動執(zhí)行委員會(TAEC)采用了該“標準化的原則”作為IPC致的原則·表達可制造性設(shè)計(DFM)與為環(huán)境設(shè)計(DFE)的關(guān)系·最小化上市時間·使用簡單的(簡化的)語言·只涉及技術(shù)規(guī)范特別說明IPC改進，協(xié)助買家進行選擇并以最短的延遲時間獲得滿足其特殊需要的適當?shù)漠a(chǎn)品，以IPC會員或非會員制造或銷售不符合這些標準和出版物要求的產(chǎn)品，也不應(yīng)當排斥那些IPCIPC提供的標準和出版物是推薦性的，不考慮其采用是否涉及有關(guān)文獻、材料或工藝的專利。IPC準和出版物的團體承擔任何義務(wù)。使用者對于一切專利侵權(quán)的指控承擔全部辯護的責IPC關(guān)于規(guī)范修訂使用和執(zhí)行IPCIPC技術(shù)行動執(zhí)行委員會的立場。當某個IPC出版物升級以及修訂版面世時，TAEC的意變更的?見是，除非由合同要求，這種新的修訂版作為現(xiàn)行版的一部分來使用的關(guān)系不是自動場聲明1998106為什么要您購買本標準是在為今后的新標準開發(fā)和行業(yè)標準升級作貢獻。標準讓制造商、用付費購買戶、供應(yīng)商更好地相互理解。標準會幫助制造商建立滿足行業(yè)規(guī)范的工藝，獲得更高本?件？效率IPC每年投入數(shù)十萬美元支持IPC的志愿者在標準和出版物上的開發(fā)。草案稿需要多遍

審查們要花費數(shù)百小時進行評審和開發(fā)。IPC員工要出席和參加委員

會的活動，打印排版，以及完成所有必要的手續(xù)以達到ASI(美國國家標準學(xué)會)認要求。IPC的會費一直保持在低位以使盡可能多的公司加入。因此，有必要用標準和出版物

的收入補償會費收入IPC會員可以得到50%的折扣價格果貴公司需要購買IPC標

準和出版物，為什么不加入會員得到這個實惠，并同時享有IPC會員的其他好處呢？

有關(guān)IPC會員的其他信息，請瀏覽，或致電001-847-597-2872；中國地區(qū)

繼續(xù)支持。?2014版權(quán)歸伊利諾斯州班諾克本市的IPC所有。依據(jù)《國際版權(quán)公約》及《泛美版權(quán)公約》保留所有權(quán)利。任何未經(jīng)版權(quán)所有者的事先書面同意而對本資料進行的復(fù)印掃描或其它復(fù)制行為被嚴格禁止并構(gòu)成《美國版權(quán)法》意義下的侵權(quán)。SINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINEIPCA-610F?IfaconflictoccursbetweentheEnglishandtranslatedversionsofthisdocument,theEnglishversionwilltakeprecedence.翻以。由IPC產(chǎn)品保證委員會（7-30及7-30C）IPC-A-610開發(fā)團隊開發(fā)，該團隊包括7-31B技術(shù)組、7-31BC亞洲技術(shù)7-31BD7-31BDE7-31BI。取代：IPC-A-610E，2010年4月IPC-A-610D，2005年2月IPC-A-610C，2000年1月IPC-A-610B，1994年12月IPC-A-610A，1990年3月IPC-A-610，1983年8月聯(lián)系方式：IPC3000LakesideDriveSuite309SBannockburn,Illinois60015-1249847615.7100Fax847615.7105IPC中國電話：400-621-8610郵箱：BDAChina@網(wǎng)址：上海青島深圳北京蘇州成都SINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINEIPC-A610ADOPTIONNOTICEIPC-A610,"AcceptabilityofElectronicAssemblies",wasadopted

on12-FEB-02forusebytheDepartmentofDefense(DoD).

ProposedchangesbyDoDactivitiesmustbesubmittedtotheDoD

AdoptingActivity:Commander,USArmyTank-Automotiveand

ArmamentsCommand,ATTN:AMSTA-TR-E/IE,Warren,MI48397-5000.

CopiesofthisdocumentmaybepurchasedfromtheTheInstitute

forInterconnectingandPackagingElectronicCircuits,2215

SandersRd,Suite200South,Northbrook,IL60062.

http://ww___________Custodians:AdoptingActivity:

Army-ATArmy-AT

Navy-AS(ProjectSOLD-0060)

AirForce-11ReviewerActivities:Army-AV,MIAREASOLDDISTRIBUTIONSTATEMENTA:Approvedforpublicrelease;distributionisunlimited.SINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINEIPC

7-30及7-30CIPC-A-6107-31B技術(shù)組、7-31BC亞洲技術(shù)組、7-31BD北歐技術(shù)組、7-31BDE德語技術(shù)組和7-31BI印度技術(shù)組的主要成員。然而我們不得不提到IPCTGAsia7-31BC技術(shù)組的成員，他們力求譯文文字的信達雅，為此標準中文版的翻譯、審核付出了大量的時間和艱苦的勞動。我們在此一并對上述各有關(guān)組織和個人表示衷心的感謝。產(chǎn)品保證委員會IPC董事會技術(shù)聯(lián)絡(luò)員主席MelParrishSTIElectronics,Inc.BobevesMicrotek(Changzhou)Laboratories副主席MikeHillGroup,Inc.IPC-A-610技術(shù)組(7-31B)IPC-A-610技術(shù)組–中國(7-31BC)聯(lián)合主席ConstantinoJ.GonzalezACME&Consulting主席RenhuaJabilCircuit(Shanghai)Ltd.JenniferDayCGIFederalKathyJohnstonRaytheonMissileSystemsIPC-A-610技術(shù)組–德語(7-31BDE)主席RainerElectronicGmbHIPC-A-610技術(shù)組–北歐(7-31BND)聯(lián)合主席AlexChristensenHYTEKClausMolgaardALPHA-elektronikA/SKeldMaaloeeLEGOSystemsA/SIPC-A-610技術(shù)組–印度(7-31BI)主席anjundaswamyIPCConsultingPvtLtdIPC-A-610（7-31B）技術(shù)組成員JonRobertsScottArrowElectronicsInc.DougRogersMarkShireman,ArmamentSystemsRoweDonaldMcFarland,3iAryeGrushka,A.A.ConsultingandA.G.Ltd.AgnieszkaOzarowski,BAESystemsMarkHoylman,BAESystemsCIJosephKane,BAESystemsPlatformSolutionsAlejandroCruz,ACME&ConsultingConstantinoGonzalez,ACME&ConsultingDebbieAdvancedReworkMarvinBanks,BallAerospace&Corp.JonathonBallAerospace&Corp.AndreBaune,BautechInc.JohnAdvancedReworkGeraldLeslieBogert,BechtelPlantInc.DarrinDodson,Alcatel-LucentJosephSmetana,Alcatel-LucentormanBESTInc.DorothyCornell,BlackfoxInstituteRussellowland,Alcatel-LucentKarlBoeingCompanySeanKeating,AmphenolLimited(UK)BruceHughes,AmrdecMS&TEPPTMichaelAldrich,AnalogDevicesInc.EdwardCuneo,BoeingCompanyMaryBellon,BoeingResearch&DevelopmentMichaelJawitz,BoeingResearch&DevelopmentChristopherAQS-AllQuality&Services,Inc.JackOlson,CaterpillarInc.IPC-A-610F2014年7月iiiSINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINEZenaidaCelesticaJenniferCGIFederalAlanisHeriberto,ChamberlainMarcoHuberConsultingPoulJuul,HYTEKBertEl-Bakri,Inc.StevenPerng,CiscoSystemsInc.JagadeeshRadhakrishnan,IntelCorporationRobertPriore,CiscoSystemsInc.LavanyaGopalakrishnan,CiscoSystemsInc.IfeHsu,IntelCorporationRicardoMoncaglieri,SERichardBrown,CommScopeJames(Chunguang)Liu,IPCChina(BeijingMarilynLawrence,ConformanceInc.IsraelMartinez,ContinentalAutomotiveogalesS.A.deCynthiaGomez,ContinentalSAdeCVJoseServin,ContinentalSAdeCVMiguelDominguez,ContinentalSAdeCVMaryCraneAerospace&ElectronicsReggieMalli,CreationLowellSherman,DefenseSupplyCenterColumbusAbles,DellInc.JohnBorneman,DelphiElectronicsandSafetyIreneRomero,DeltaGroupElectronicsInc.JohnI-SACElectronicCo.,Ltd.RichardPond,ItronInc.QuyenChu,JabilCircuit,Inc.GirishJabilCircuit,Inc.(HQ)ThomasCipielewski,JabilCircuit,Inc.(HQ)MinhDo,JetPropulsionLaboratoryReza,Ghaffarian,JetPropulsionLaboratoryFrankHules,JohansonDielectricsInc.AkikazuShibata,JPCA-JapanElectronicsPackagingandCircuitsAssociationancyBullock-Ludwig,KimballElectronicsAugustinStan,L&GAdviceServSRLMichaelMora,DeltaGroupElectronicsInc.CengizOztunc,DZLtd.GabrielRosin,ElbitSystemsLtd.ShelleyHolt,L-3CommunicationsRobertFornefeld,L-3CommunicationsFrederickBeltran,L-3CommunicationsPamMcCord,ElbitSystemsofAmericaByronCase,L-3CommunicationsImeldaEPICHelenaPasquito,CorporationLeoLambert,CorporationPeterMenuez,L-3Communications-CincinnatiElectronicsBruceBryla,L-3Communications-ardaMicrowaveEastKeldMaaloee,LEGOSystemsA/SJoachimSchuett,FED-FachverbandElektronikDesignancyChism,FlextronicsOmarKarinHernandez,FlextronicsManufacturingMex,SAdeCVEricCamden,Foresite,Inc.MichaelFoxconnCMMSG-VPDDougLamond,FoxconnLLCStephenFribbins,FribbinsServicesRayDavison,FSIGaryFerrari,FTGCircuitsFrederickSantos,GeneralDynamics-C4SystemsKristenHewlett-PackardCompanyElizabethBenedetto,Hewlett-PackardCompanyRobertZak,HoneywellJohnMastorides,HoneywellAerospaceRichardRumas,HoneywellCanadaovak,HoneywellInternationalJennieHwang,GroupLindaLockheedMartinMissile&FireControlLockheedMartinMissile&FireControlSamPolk,LockheedMartinMissiles&FireControlKimberlyShields,LockheedMartinMissionSystems&PamelaLockheedMartinMissionSystems&DominikLockheedMartinSpaceSystemsCompanyeilLogicPDDanielMissileDefenseAgencyBillKasprzak,MoogInc.MaryLouSachenik,MoogInc.MoogInc.AnthonyASAJohnsonSpaceCenterRobertCooke,ASAJohnsonSpaceCenterJamesBlanche,ASAMarshallSpaceFlightCenterCharlesGamble,ASAMarshallSpaceFlightCenterChristopherHunt,ationalPhysicalLaboratoryThomas,exteerAutomotiveReneMartinez,orthropGrummanAerospaceSystemsiv2014年7月IPC-A-610FSINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINEMahendraGandhi,orthropGrummanAerospaceSystemsRobertCass,orthropGrummanAmherstSystemsRandyMcutt,orthropGrummanCorp.DavidHillman,RockwellCollinsDavidAdams,RockwellCollinsGregHurst,RSI,Inc.MacorthropGrummanCorporationeilJohnson,Saab-ElectronicDefenceSystemsorthropGrummanCorporationDorisMcGee,orthropGrummanCorporationCasimirBudzinski,SafariCircuitsInc.GastonHidalgo,SamsungAmericaSKCo.,ltd.RichardHenrick,SanminaCorporationAngelaPennington,EngineeringKenMoore,OmniCorp.RaymondFalkenthal,OptimumDesignAssociatesMaryJames,SchlumbergerServicesDanScienscopeInternationalCorporationFinnSkaanning,SkaanningQuality&Certification-SQCMattGarrett,PhononCorporationRonPIEKInternationalEducationCentre(I.E.C.)BVFrankHuijsmans,PIEKInternationalEducationCentre(I.E.C.)BVRobPIEKInternationalEducationCentre(I.E.C.)BVPeterPKSSystemtechnikGmbHRichardKraszewski,PlexusCorp.Pitsch,PlexusCorporationBillBarthel,PlexusManufacturingSolutionsPoleZeroCorporationGuyR&DAssemblyLisaMaciolek,RaytheonCompanyJamesSaunders,RaytheonCompanyDavidelson,RaytheonCompanyJoeRaytheonCompanyRogerMiedico,RaytheonCompanyAmyRaytheonCompanyRaytheonCompanyDavidRaytheonCompanyRaytheonCompanyFondaRaytheonCompanyJamesDaggett,RaytheonCompanyKathyJohnston,RaytheonMissileSystemsLanceBrack,RaytheonMissileSystemsMillman,RaytheonMissileSystemsPatrickKane,RaytheonSystemPaulaJackson,RaytheonUKUdoRobertBoschGmbHCarolineRockwellCollinsDebieRockwellCollinsDouglasPauls,RockwellCollinsCraigSouthernCaliforniaBraidingInc.GreggOwens,SpaceExplorationRogerBell,SpaceSystems/LoralPaulPidgeon,STEMMelParrish,STIElectronics,Inc.PatriciaScott,STIElectronics,Inc.FloydBertagnolli,STM-ServiceMankindClitheroe,SurfaceMountCircuitBoardAssociationAndresOjalill,PolytechnicSchoolRainerElectronicGmbHClancyCenterCarySchmidt,Inc.ConstantinosMetaxas,CorporationThomasAhrens,GmbHCaletteChamness,U.S.Army&MissileCommandR.MichaelMoore,U.S.Army&MissileCommandDavidCarlton,U.S.Army&MissileCommandSharonU.S.Army&MissileCommandHeidiHavelka,UnipowerCorporationScottUTCAerospaceSystemsConstantinHudon,Inc.Gabriela,MedicalSystemsLindaProducts,Inc.Lawrence(Skip)Foust,HospitalGerjanDiepstraten,SoltecDavidZueck,DigitalCorporationBlack,ElectricCo.-POPeterewell,WhirlpoolCorporationLionelFullwood,WKKDistributionLtd.Zhe(Jacky)Liu,ZTECorporationJiaminZhang,ZTECorporationJianfengLiu,ZTECorporationIPC-A-610F2014年7月vSINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINEIPC-A-610（7-31BC）中國技術(shù)組成員HeZhouHuilin,HuaweiCo.,Ltd.ZhouGuanjunCaoAlcatel-LucentShanghaiBellCo.,Ltd.LiuZhijie,BeijingDinghanCo.,LtdZhaoJack,EmersonetworkPowerCo.Ltd.Zhao,Charlie,EmersonetworkPowerCo.Ltd.ZhangCylin,FlextronicsElectronics(Suzhou)Co.Ltd.Zhang,HuaweiCo.,Ltd.(Danny),HuaweiCo.,Ltd.GongHuaweiCo.,Ltd.CaoXi,HuaweiCo.,Ltd.HeDapeng,HuaweiCo.,Ltd.ChenIntegratedService(Kunshan)Renhua,JabilCircuit(Shanghai)Ltd.SunJabilCircuit(Shanghai)Ltd.JabilCircuit(Shanghai)Ltd.LiLiyi,JabilCircuit(Shanghai)Ltd.ZhaoJohnson(Songtao),ShenZhenEasywayScience&Co.Ltd.LuoJinsong,ShenzhenKaiFaCo.,Ltd.JiaBianfen,ZTECorporationGaoZTECorporationXuemei,ZTECorporationIPC-A-610（7-31BD）北歐技術(shù)組成員ClausMolgaard,ALPHA-elektronikA/SJacobAPCDenmarkElinOlsen,KitronASKeldMaaloee,LEGOSystemsA/SRoslund,Bang&OlufsenHenrickSnaebum,MADieselStenstrup,DanfossDrivesA/SJesperKonge,GaasdalBygningsindustriA/Sordhus,orautronASPallePedersen,PrintcaGRAPHICA/SJesperDjurhuus,GPVElectronicsA/SGregersDybdal,ProtecElectronicsApSKruse,GrundfosManagementA/SSveinKolbu,HaproASAlexChristensen,HYTEKCarstens,ProtecElectronicsApSStevenHansen,ControlSystemsBjarneHartvigsen,ControlSystemsEvaKitronASJanIPC-A-610（7-31BDE）德語技術(shù)組成員ThomasCassidianPeterPKSSystemtechnikGmbHJoachimSchuett,FED-FachverbandElektronikDesignRainerElectronicGmbHMarcoHuberConsultingThomasAhrens,GmbHIPC-A-610（7-31BI）印度技術(shù)組成員Jithashreeayakarahalli,CentumElectronicsLimitedPhanishayee,IPCConsultingPvtLtdagarajaUpadhya,CentumRakonIndiaPvt.Ltd.IPCConsultingPvtLtdRentachintalaElectronics&DevelopmentCenterChandrashekaraiahagaraj,IPCConsultingPvtLtdAppanallurSaravanan,IndianInstituteofSciencePanchapakesanKannan,IndsoltechDilip,Rane,IPCConsultingPvtLtdB.J.,Srinivas,Kreativevi2014年7月IPC-A-610FSINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINE特別鳴謝對于以下提供本修訂版中所用的照片和圖片的成員表示特別的感謝。DonaldMcFarland,3iLindaLockheedMartinMissile&FireControlConstantinoGonzalez,ACME&ConsultingHueGreen,LockheedMartinSpaceSystemsCompanyDarrinDodson,Alcatel-LucentJonathonBallAerospace&Corp.DanielMissileDefenseAgencyKenMoore,OmniCorp.1JenniferCGIFederalRobPIEKInternationalEducationCentreBVCynthiaGomez,ContinentalSAdeCVAnithaSinkfield,DelphiElectronicsandSafetyJackZhao,EmersonetworkPowerCo.Ltd.JuliePitsch,PlexusCorp.Davidelson,RaytheonCompanyKathyJohnston,RaytheonMissileSystemsOmarKarinHernandez,FlextronicsManufacturingMex,SAdeCVHeDaPeng,HuaweiCo.,ZhouHuiLing,HuaweiCo.,ZhangHuaweiCo.,AlexChristensen,HYTEKBertEl-Bakri,Inc.LucaMoliterni,IstitutoItalianodellaSaldaturaRenhua,JabilCircuit,ShanghaiancyBullock-Ludwig,KimballElectronicsGroupC.DonDupriest,LockheedMartinMissilesandFireControlPaulaJackson,RaytheonUKMarcinREEXDavidHillman,RockwellCollinsDouglasPauls,RockwellCollinsDavidSamtecBobGroup2MelParrish,STIElectronicsPatriciaScott,STIElectronicsBee-EngSarafyn,StrataflexCorporationThomasAhrens,GmbHPhilippGmbH&CoKG參與IPC-A-610F中?版開發(fā)的7-31BC技術(shù)組成員：李澤山捷普科技(上海)有限公司孫夢華憶科華電子系統(tǒng)(蘇州)有限公司付成麗佰電科技(蘇州)有限公司賈變芬中興通訊股份有限公司陳彥奇宜特科技(昆山)電子有限公司劉振鑫宜特科技(昆山)電子有限公司趙松濤深圳市易思維科技有限公司趙景清艾默生網(wǎng)絡(luò)能源有限公司周冠軍比比電子(蘇州)有限公司盧壇廣州視源電子科技股份有限公司張源華為技術(shù)有限公司汪書遙捷普科技(上海)有限公司羅勁松深圳長城開發(fā)科技股份有限公司張曉燕偉創(chuàng)力電子技術(shù)(蘇州)有限公司1.Figures3-4,3-5,5-18,5-40,6-19,6-22,6-24,6-46,6-68,6-72,6-73,6-86,

6-87,6-96,6-100,6-101,6-102,6-103,6-104,6-107,6-108,6-109,6-123,6-124,7-17,7-28,

7-32,7-84,7-92,7-95,8-171,8-172are?Omniusedbypermission.2.Figures5-50,8-59,8-66,8-95,8-135,8-164,8-165,8-166,8-167,8-168,

8-169,andare?BobWillis,usedbypermission.IPC-A-610F2014年7月viiSINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINEviii2014年7月IPC-A-610FSINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINE1前?....................................1-11.7圖例與插圖............................1-61.1范圍...................................1-21.8檢查?法..............................1-61.2?的...................................1-31.9尺?鑒定..............................1-61.3員?熟練程度..........................1-31.10放?輔助裝置.........................1-61.4分級...................................1-3照明..................................1-71.5對要求的說明..........................1-31.5.1驗收條件............................1-目標條件............................1-可接受條件..........................1-缺陷條件............................1-.1處置................................1-制程警示條件........................1-.1制程控制方法........................1-組合情況............................1-未涉及情形..........................1-特殊設(shè)計............................1-52適??件................................2-12.1IPC標準...............................2-12.2聯(lián)合?業(yè)標準..........................2-12.3EOS/ESD協(xié)會標準.....................2-22.4電??業(yè)聯(lián)合會標準....................2-22.5國際電?委員會標準....................2-22.6美國材料與測試協(xié)會....................2-21.6術(shù)語和定義............................1-51.6.1板面方向............................1-*主面................................1-*輔面................................1-*焊接起始面..........................1-*焊接終止面..........................1-51.6.2*冷焊接連接..........................1-51.6.3電氣間隙............................1-51.6.4FOD(外來物)........................1-51.6.5高電壓..............................1-51.6.6通孔再流焊..........................1-61.6.7彎月形涂層(元器件)..................1-61.6.8*非功能盤............................1-61.6.9針插焊膏............................1-61.6.10焊料球..............................1-6線徑................................1-61.6.12導(dǎo)線重疊............................1-61.6.13導(dǎo)線過纏繞..........................1-62.7技術(shù)出版物............................2-23電?組件的操作..........................3-13.1EOS/ESD的預(yù)防........................3-23.1.1電氣過載(EOS).......................3-33.1.2靜電釋放(ESD).......................3-43.1.3警告標識............................3-53.1.4防護材料............................3-63.2EOS/ESD安全?作臺/...............3-73.3操作注意事項..........................3-93.3.1指南................................3-93.3.2物理損傷...........................3-103.3.3污染...............................3-103.3.4電子組件...........................3-3.3.5焊接后.............................3-3.3.6手套與指套.........................3-12IPC-A-610F2014年7月ixSINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINE4機械零部件..............................4-14.1機械零部件的安裝......................4-24.1.1電氣間隙............................4-24.1.2妨礙................................4-34.1.3大功率元器件安裝....................4-44.1.4散熱裝置............................4-絕緣墊和導(dǎo)熱復(fù)合材料................4-接觸................................4-84.1.5螺紋緊固件和其它螺紋部件的安裝......4-扭矩...............................4-導(dǎo)線...............................4-134.2螺栓安裝.............................4-154.3連接器插針...........................4-164.3.1板邊連接器引針.....................4-164.3.2壓接插針...........................4-焊接...............................4-205.2.8焊料受擾...........................5-145.2.9焊料開裂...........................5-155.2.10拉尖...............................5-16無鉛填充起翹.......................5-175.2.12無鉛熱撕裂/孔收縮..................5-185.2.13焊點表面的探針印記和其它類似表面狀況.........................5-196端?連接................................6-16.1鉚裝件................................6-26.1.1接線柱..............................6-接線柱基座-焊盤間隙.................6-塔形................................6-雙叉形..............................6-46.1.2卷式翻邊............................6-56.1.3喇叭口形翻邊........................6-66.1.4花瓣形翻邊..........................6-76.1.5焊接................................6-84.4線束的固定...........................4-234.4.1概述...............................4-234.4.2連軋...............................4-2損傷...............................4-274.5布線–導(dǎo)線和線束.....................4-284.5.1導(dǎo)線交叉...........................4-284.5.2彎曲半徑...........................4-294.5.3同軸線纜...........................4-304.5.4空置線頭...........................4-314.5.5接頭和焊環(huán)上的扎點.................4-325焊接....................................5-15.1焊接可接受性要求......................5-35.2焊接異常..............................5-45.2.1暴露金屬基材........................5-45.2.2針孔/吹孔...........................5-65.2.3焊膏再流............................5-75.2.4不潤濕..............................5-85.2.5冷焊/松香焊接連接...................5-95.2.6退潤濕..............................5-95.2.7焊料過量...........................5-焊料球.............................5-橋連...............................5-錫網(wǎng)/潑錫..........................5-136.2絕緣?...............................6-106.2.1損傷...............................6-焊前...............................6-焊后...............................6-126.2.2間隙...............................6-136.2.3撓性套管...........................6-放置...............................6-損傷...............................6-176.3導(dǎo)體..................................6-186.3.1形變...............................6-186.3.2損傷...............................6-多股導(dǎo)線...........................6-實芯線.............................6-206.3.3股線發(fā)散(鳥籠形)–焊前............6-206.3.4股線發(fā)散(鳥籠形)–焊后............6-216.3.5上錫...............................6-226.4維修環(huán)...............................6-246.5應(yīng)?釋放.............................6-256.5.1線束...............................6-256.5.2引線/導(dǎo)線彎曲......................6-266.6引線/導(dǎo)線放置–通?要求..............6-286.7焊接–通?要求.......................6-30x2014年7月IPC-A-610FSINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINE6.8塔形和直針形.........................6-316.8.1引線/導(dǎo)線放置......................6-316.8.2塔形和直針形–焊接................6-3直角...............................7-帶側(cè)墻的插針頭和直立插座連接器.....7-227.1.9導(dǎo)體外殼...........................7-236.9雙叉形...............................6-346.9.1引線/導(dǎo)線放置–側(cè)面進線連接........6-346.9.2引線/導(dǎo)線放置–導(dǎo)線的加固..........6-376.9.3引線/導(dǎo)線放置–底部和頂部進線連接..6-386.9.4焊接...............................6-396.10槽形.................................6-426.10.1引線/導(dǎo)線放置......................6-426.10.2焊接...............................6-43穿孔形...............................6-44引線/導(dǎo)線放置......................6-44焊接...............................6-466.12鉤形.................................6-476.12.1引線/導(dǎo)線放置......................6-476.12.2焊接...............................6-496.13錫杯.................................6-506.13.1引線/導(dǎo)線放置......................6-506.13.2焊接...............................6-526.14及更細的導(dǎo)線–引線/導(dǎo)線放置..6-546.15串聯(lián)連接............................6-556.16邊緣夾簧–位置......................6-567通孔技術(shù)................................7-17.2元器件的固定.........................7-237.2.1固定夾.............................7-237.2.2粘合劑粘接.........................7-2粘合劑粘接–非架高元器件...........7-2粘合劑粘接–架高元器件.............7-297.2.3其它器件...........................7-307.3?撐孔...............................7-317.3.1軸向引線–水平.....................7-317.3.2軸向引線–垂直.....................7-337.3.3導(dǎo)線/引線伸出......................7-357.3.4導(dǎo)線/引線彎折......................7-367.3.5焊接...............................7-3垂直填充(A).......................7-4焊接終止面–引線到孔壁(B).........7-4焊接終止面–焊盤區(qū)覆蓋(C).........7-4焊接起始面–引線到孔壁(D).........7-4焊接起始面–焊盤區(qū)覆蓋(E).........7-4焊料狀況–引線彎曲處的焊料.........7-4焊料狀況–接觸通孔元器件本體.......7-4焊料狀況–焊料中的彎月面絕緣層.....7-50焊接后的引線剪切...................7-50焊料內(nèi)的漆包線絕緣層...............7-53無引線的層間連接–導(dǎo)通孔...........7-52子母板.............................7-557.1元器件的安放..........................7-27.1.1方向................................7-方向–水平..........................7-方向–垂直..........................7-57.1.2引線成形............................7-彎曲半徑............................7-密封/熔接處與彎曲起始處之間的距離...7-應(yīng)力釋放............................7-損傷...............................7-107.1.3引線跨越導(dǎo)體.......................7-7.1.4通孔阻塞...........................7-127.1.5DIP/SIP器件和插座..................7-137.1.6徑向引線–垂直.....................7-限位裝置...........................7-167.1.7徑向引線–水平.....................7-187.1.8連接器.............................7-197.4??撐孔.............................7-587.4.1軸向引線–水平.....................7-587.4.2軸向引線–垂直.....................7-597.4.3引線/導(dǎo)線伸出......................7-607.4.4引線/導(dǎo)線彎折......................7-617.4.5焊接...............................7-637.4.6焊接后的引線剪切...................7-657.5跳線..................................7-667.5.1導(dǎo)線的選擇.........................7-667.5.2布線...............................7-677.5.3導(dǎo)線的固定.........................7-697.5.4支撐孔.............................7-7支撐孔–引線在孔內(nèi).................7-717.5.5纏繞連接...........................7-727.5.6搭焊連接...........................7-73IPC-A-610F2014年7月xiSINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINE8表?貼裝組件............................8-18.1粘合劑固定............................8-38.1.1元器件粘接........................8-38.1.2機械強度..........................8-48.2SMT引線..............................8-68.2.1塑封元器件........................8-68.2.2損傷..............................8-68.2.3壓扁..............................8-78.3.3圓柱體帽形端?.....................8-3側(cè)面偏出(A).......................8-3末端偏出(B).......................8-3末端連接寬度(C)...................8-3側(cè)面連接長度(D)...................8-3最大填充高度(E)...................8-3最小填充高度(F)....................8-3焊料厚度(G).......................8-40末端重疊(J)........................8-418.3SMT連接..............................8-78.3.1?式元器件–僅有底部端?............8-側(cè)面偏出(A)......................8-末端偏出(B)......................8-末端連接寬度(C)..................8-側(cè)面連接長度(D).................8-最大填充高度(E)..................8-最小填充高度(F)..................8-焊料厚度(G).....................8-末端重疊(J)......................8-148.3.2矩形或?形端?式元器件–1，3或5?端?.......................8-側(cè)面偏出(A).....................8-末端偏出(B)......................8-末端連接寬度(C)..................8-側(cè)面連接長度(D).................8-最大填充高度(E)..................8-最小填充高度(F)..................8-焊料厚度(G).....................8-末端重疊(J)......................8-2端子異常.........................8-2.1側(cè)面貼裝(公告板)................8-2.2底面朝上貼裝.....................8-2.3疊裝.............................8-2.4立碑.............................8-300居中焊端.........................8-30.1側(cè)面焊接寬度.....................8-30.2側(cè)面最小填充高度.................8-328.3.4城堡形端?..........................8-4側(cè)面偏出(A).......................8-4末端偏出(B).......................8-4最小末端連接寬度(C)...............8-4最小側(cè)面連接長度(D)...............8-4最大填充高度(E)...................8-4最小填充高度(F)....................8-4焊料厚度(G).......................8-468.3.5扁平鷗翼形引線.....................8-4側(cè)面偏出(A).......................8-4趾部偏出(B).......................8-5最小末端連接寬度(C)...............8-5最小側(cè)面連接長度(D)...............8-5最大跟部填充高度(E)...............8-5最小跟部填充高度(F)................8-5焊料厚度(G).......................8-5共面性.............................8-598.3.6圓形或扁圓(精壓)鷗翼形引線..........8-60側(cè)面偏出...........................8-6趾部偏出(B).......................8-6最小末端連接寬度(C)...............8-6最小側(cè)面連接長度(D)...............8-6最大跟部填充高度(E)...............8-6最小跟部填充高度(F)................8-6焊料厚度(G).......................8-6最小側(cè)面連接高度(Q)...............8-6共面性.............................8-67xii2014年7月IPC-A-610FSINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINE8.3.7J形引線.............................8-6側(cè)面偏出(A).......................8-6趾部偏出(B).......................8-70末端連接寬度(C)...................8-70側(cè)面連接長度(D)...................8-7最大跟部填充高度(E)...............8-7最小跟部填充高度(F)................8-7焊料厚度(G).......................8-7共面性.............................8-768.3.16P型連接...........................8-10最大側(cè)面偏出(A)..................8-10最大趾部偏出(B)..................8-10最小末端連接寬度(C)..............8-10最小側(cè)面連接長度(D)..............8-10最小填充高度(F)...................8-1058.4特殊SMT端?........................8-1068.5表?貼裝連接器......................8-1078.3.8垛形/I形連接........................8-7修整的通孔引線.....................8-7預(yù)置焊料端子.......................8-7最大側(cè)面偏出(A)...................8-7最大趾部偏出(B)...................8-80最小末端連接寬度(C)...............8-8最小側(cè)面連接長度(D)...............8-8最大填充高度(E)...................8-8最小填充高度(F)....................8-8焊料厚度(G).......................8-848.6跳線.................................8-1088.6.1SMT..............................8-10片式和圓柱體帽形元器件............8-10鷗翼形引線........................8-J形引線...........................8-城堡形端子........................8-焊盤..............................8-9元器件損傷..............................9-19.1?屬鍍層缺失..........................9-28.3.9885扁平焊?引線........................-8.3.10僅有底部端?的?外形元器件........8-86內(nèi)彎L形帶狀引線...................8-878.3.12889表?貼裝?陣列....................-890對準...........