微專業(yè)---半導(dǎo)體制造技術(shù)課程：半導(dǎo)體工程專業(yè)英語(yǔ)ContentsSemiconductorProperties半導(dǎo)體特性01SemiconductorMaterials半導(dǎo)體材料02SemiconductorDeviceandHowTheyareUsed半導(dǎo)體器件及其使用03ProcessTechnology工藝技術(shù)04FabricationProcesses制造工藝05SemiconductorMaterialsandProcessCharacterization半導(dǎo)體材料與工藝表征06SemiconductorMaterialsandProcessCharacterization6.1Purpose6.2Methods6.3ExamplesofApplications066SemiconductorMaterialsandProcessCharacterization1ChapterOverview

Thereisastrongcorrelationbetweenconditionofthematerialsusedtoprocessfunctionaldevice,andtheperformanceofsuchdevice.Therefore,itis

importanttoanyresearchanddevelopmentendeavorinvolvingsemiconductormaterials,andequallyimportanttothecommercialmanufacturingof

semiconductordevices,thatthephysicalandchemicalcharacteristicsofthe

processedmaterialareknownandcontrolledateverystageofthefabrication

procedures.Forthatreason,characterizationofsemiconductormaterials

anddevicesisanintegralpartofanysemiconductorengineeringeffort./?k??r??le??(?)n/關(guān)聯(lián)/?n?dev?r/嘗試/??nt?ɡr?l/完整的，必須的2Introduction

Toreiteratethepointmadeearlier,operationofsemiconductordevicesdependsontheintricatephysicalinteractionsbetweenoutsidestimuli(current,voltage,light,temperature,andothers),andsemiconductormaterials.Therefore,inordertoassurepredictable,controllable,andreproducible

characteristicsofthedevice,propertiesofthematerialsusedtofabricate

anygivendevicemustbeknownnotonlyintermsoftheirinherentcharacteristics,butalsointermsofthepotentialchangesinflictedbytheprocesses

discussedinChapter5ofthisvolume./??ntr?k?t/復(fù)雜的6.1Purpose/?n?her?nt/內(nèi)在的/ri??t?re?t/重述/pr??d?kt?b(?)l/可預(yù)測(cè)的6SemiconductorMaterialsandProcessCharacterization/?st?mj?la?/激勵(lì)/?n?fl?kt?d/造成的/?ri?pr??du?s?bl/可重現(xiàn)2Processmonitoring

isanindispensablepartofanymanufacturingendeavor.Itisessentialtotheoutcomeofthefabricationprocedurestoknow

whatistheconditionofthesemiconductorwaferunderprocessingateach

andeverystageofthefabricationprocess.Thus,semiconductormanufacturingprocessesmustbethoroughlymonitored.

Thegoaloftheprocessmonitoringistodetectpossibleprocessmalfunctionassoonasitactuallyoccurs.Otherwise,withwafersgettinglarger

andmoreexpensive,thecostofmanufacturingprocessesincreasing,andthe

numberofoperationsperformedoneachwafergrowing,lossesresultingfromanyprocessmalfunctioncouldbestaggering./?st?ɡ?r??/令人吃驚的6.1Purpose/??nd??spens?b(?)l/必需的/?m?l?f??k?(?)n/失效6SemiconductorMaterialsandProcessCharacterization26.1Purpose6SemiconductorMaterialsandProcessCharacterization(a)Off-lineprocessmonitoringondesig