《?????》2019?3??48??6?

Cu-Sn???????????????????,??,??,??(??????????,????030051)

??：?Cu-Sn????????????，????????0.01s-1、??????500～700℃。??EBSD??????????????????。????：??????-??????????????????????????，?????????，??Cu-Sn?????????。???????，Cu-Sn??????????，????????，????????????????????。?500～550℃Σ（CSL）?????Σ3????；??，??????????????????????????????????，???????????。

???：Cu-Sn??；EBSD；?????；???DOI:10.14158/j.cnki.1001-3814.2019.06.013

?????：TG146.1+1；TG113.12 ?????：A ????：1001-3814(2019)06-0055-03

AnalysisonGrainBoundaryMicrostructureofHighTemperatureThermalSimulationCompressionofCu-SnAlloyMAJianqiang,YANHongwei,WANGYang,YUANFei

(SchoolofMechanicalEngineering,NorthUniversityofChina,Taiyuan030051,China)

Abstract：Cu-Snalloywassubjectedtohigh-temperatureisothermalcompressiontestwithhotcompressivestrainrateof0.01s-1andthermaldeformationtemperatureof500-700℃.EBSDtechniquewasusedtoanalyzethehightemperaturedeformationandmicrostructurecharacteristicsofthealloy.Theresultsshowthatthethermalcompressionturestress-turestraincurvereflectstheconfrontationprocessofworkhardeninganddynamicrecoveryandrecrystallization.Ithasadistinctsofteningtendency,indicatingthattheCu-Snalloyisaheat-sensitivealloy.Withtheincreaseoftemperature,thedeformationresistanceofCu-Snalloygraduallydecreases.Withtheincreaseofthestrain,therearedifferentdegreesofworkhardeningphenomenonundervariousdeformationconditions.ThegrainboundaryofΣ(CSL)graduallytransformsintotheΣ3grainboundaryat500-550℃.Atthesametime,theenergiesofsomehigh-anglegrainboundarieswithspecialorientationdifferencesarelowerthanthatofotherhigh-anglegrainboundary,andthegrainboundarymigrationandslippingarepronetooccur.

Keywords：Cu-Snalloy;EBSD;dynamicrecrystallization;misorientation

Cu-Sn???????????????????。????????????????P、Zn、Ni?????，??????????????、???，?????????????[1-4]。??，?????????????、???[5-6]。

??Cu-Sn????????????、??????????[7]。????????????、??????????，???????????????。??，???????????????

????:2018-05-17????:?????????????????(201603D321117)????:???(1992-),?,?????,??,??????:???

?????????????;??

E-mail:939295865@

?。Miura?[7]???Cu-Sn-P?????????，???????????????，?????????，??????????，????????????????????，??????，???????。??，Cu-Sn?????????????????????????????。?????????????????????，????????????????????????[8-10]。?????，?????????，???Cu-Sn???????，???????????????????????。

1

???Cu-Sn????????，????????????。??????????0.01s-、

??????500～700℃????，Cu-Sn???

55

HotWorkingTechnology2019,Vol.48,No.6

???????????。 250

500℃

???/MPa

1 ??????? 200

??250℃、2h????Cu-Sn?????? 150 550℃

??，??????1。??????Gleele-3500D???????，???????8mm×12mm，?????500～700℃、?????0.01s-1、???????0.6。???????????6℃/s、?????5min。????????????????????。??????????500～700℃、0.01s-1?Cu-Sn???????????，???????????。

2 ?????

?1Cu-Sn???????(????，%)Tab.1ChemicalcompositionofCu-Snalloy(wt%)

100 600℃

650℃50 700℃

00.10.2 0.3 0.40.50.60.7???

?1Cu-Sn????????????-?????Fig.1Turestress-turestraincurveofCu-Snalloyatdifferenthightemperaturecompression

?500～600℃?，????????，??????????????，??????。???????550℃??????????????????，??????????。??650～700℃?，?

???????，??????，????????

Sn Al Zn

6.5 <0.002 <0.1

Ni Fe Pb P Cu

0.087 <0.01 <0.01 0.17 ??

?????????，??????。

?2?Cu-Sn???????????CSL

?1?Cu-Sn????????????????-?????。???，?????Cu-Sn?????????????，??????0.01s-1????，??????，??????????。???Cu-Sn?????????。???????，Cu-Sn??????????，???????

?，????????????????????。

?????????。??，???????CSL??????????，?Σ3??（???）??????，?Σ9???????。???????，Σ（5，7，11，13…）???????，?700℃????Σ3+Σ9??（??2（i）、（j）），?????????，Σ（5，7，11，13…）??Σ3+Σ9???????。?650℃???Σ3?????????。??

????700℃?，Σ3??????????，?

(a)500℃

3.0

7

2

1

0

25

0

12

4

35

30

15

0

??(%)

??(%)

??(%)

??(%)

??(%)

Σ

??

Σ

??

Σ

??

Σ

100μm

(e)600℃

100μm

(i)700℃

100μm

3.5 (b)500℃(c)550℃ 6 (d)550℃

2.5 5

2.0 4

1.5 3

1.00.5

0

39152127333945 100μm 3915212733394530 (f)600℃(g)650℃14(h)650℃

20 10

15 8

10 6

5 2

39152127333945 100μm 039152127333945

??

40 (j)700℃

?2??????????Cu-Sn??

25 CSL???????

20 Fig.2Grainboundarypositionandfrequency

10 ofCu-SnalloyCSLatatdifferenthigh

5 temperaturecompressions

39152127333945Σ??

Σ3Σ5Σ7

Σ9

56

《?????》2019?3??48??6?

???????????????，????，Σ3???????????????????。

????，Σ3????????????，Σ3???????????????，???，???????，Cu-Sn??????????，????????，????????????????????，???????????????，???

Σ3+Σ9?????，?????????????

??????（??3（b））。???????，?????????，???Cu??????α???，α????????。????????????????????????，??????????????????α?，????-??????????。??????????，?????????，???????????，??????

???????，???????????。

????，Σ3+Σ9??????。????，?????????，CSL???????????，?

?????????????????，????

3 ??

（1）Cu-Sn???????????????

??????；????????????????????，??????????????????????????????????，???????????，????。

?????500℃???700℃?????，?3（a）???????-???????????

?，????????，??????，?????

????????????????????????????。CSL?????????????Σ3?????。

（2）Cu-Sn???????????，????、????????，??????。

????：

?????????，????????，????

40

18

6

3

(a)

350

300

140

120

??/MPa

???(%)

450 500℃ 650℃

400

350 700℃600℃550℃

??/MPa

300

250 R3

200 A

150 16 34

100 26 9250

0 20 40 60 80 100

450(b) ?? 180

400 500℃ 160

550℃600℃650℃

250 700℃ 1002008015060

100 40

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