手機(jī)生產(chǎn)流程產(chǎn)前準(zhǔn)備LG客戶交貨管控下定單供應(yīng)鏈/物控查點(diǎn)不足物料生管追要不足物料倉(cāng)庫(kù)根據(jù)訂單及物料﹑生產(chǎn)狀況安排生產(chǎn)﹐開工單根據(jù)工單備料﹑發(fā)料前加工產(chǎn)線上線掃描登記錫膏印刷泛用機(jī)貼片1~2迴焊爐前目檢APIMASK比對(duì)AOI檢查貼2DLabel裁板手焊聽筒﹑話筒LCD組裝點(diǎn)膠Canshield組裝BAKINGLCD測(cè)試PCB投入PCBLoading中速機(jī)貼片1~6目檢回流焊搬板貼按鍵貼insulator產(chǎn)線生產(chǎn)POWERTESTCMT測(cè)試終檢包裝DEKHOZ02iSpecificationofDEKHOZ02iSolderPrintingMax.BoardSize:508mm*508mmMin.BoardSize:50mm*40mmBoardThinkness:0.2mm~6mmMaxPrintSpeed:2mm~150mm/secAccuracyAndRepeatability:1.6CPK@+/-25μm『ScreenCleanModule』『CameraSystemModule』『SqueegeeModule』SpecificationofSE300PCBSize101*35mm~508*508mmMaxInspectionArea508*503mmInspectionSpeed29cm2/secScanWindow10*20mmSolderThickness50*350μmMachinecapability---SolderInspectionTypeSI-G200PCBSize50*50mm~460*410mmHigh-speedHeadPlacementRate45000cphPlacementPrecision±0.045(3σ)mmPartSize0201chip~100*50mm『SI-G200』『High-speedHead』『CCDCameraⅡ』『CCDCameraⅠ』SpecificationofSI-G200ReturnMachinecapability---MiddleSpeedMachineTr716020μ15μMachinecapability---AutomatedOpticalInspectionPanasonicCM402-LwithMaglevtechnology

SonyF209PanasonicCM402-L

CM402-LMachinecapability---MultifunctionalMachineReflowProfileReflowsolderingwith

Lead-free,

KIC24/7monitorsystemKIC24/7ThermalmanagementsystemTNR40-628PH-LReturnMachinecapability---ReflowovenX-ray,side-viewscope,Stereo-scopeareequippedinshopfloorforquickrootcauseanalysis.NikonStereo-scopeErase-scopeOpentubeX-Raymachine-XD7500-X-RayXD7500SpecificationMachinecapability---InspectionToolsPCBDimension510*460mm(t:0.3*4.0mm)WorkArea510*452mmMax.Speed0.14sec/shotPCBLoadingTime3.5secPositioningAccuracy±0.02mmIterateAccuracy±0.02mmSpecificationofHTD-510-3CReturnUnderfillprocessintroductionSpecificationofJS-ACS-76MMachinecapability---UnderfillBakingSpecificationofJS-PRM-M20Machinecapability---DepanelJS-PRM-M20

Operationrange300mm*320mm*100mmAccuracy(X,Y,Z&R)+/-0.01mm&+/-0.02mmProgramcapacity255programsPLCFunction50Programs,100steps/programDatamemorycapacity30000pointsor255programsSpeedPTP(X,Y)8~800mm/secPTP(Z)3.2~320mm/sec

PTP(Rpm)8~800CP(X,Y,Z)0.1~800mm/secTestEnvironment:TestPCPowerSupply2303PowertestSystemPowertestjigLGtestsoftwareTestDescription:Simplepoweruptesttocheckcharger,leakagecurrent,systembattery.C/T:55sSystemPowerUpTestCal.&AutoFunctionTestTestEnvironment:TestPCAgilent8960testerPowerSupply2303PowertestjigLGtestsoftwareTestDescription:RunboardlevelselftesttodetectpotentialdefectsinSMTprocess(Electricaltests,Audiotest,anddatawriting/reading,RFcalibration.)C/T:130sSolderpastethicknessmeasuringmachine

-ZM-205X-BGAreworkstation:OKIAPR5000StencilClean