焊接中英文對(duì)照表不良現(xiàn)象中英文對(duì)照表缺件(MISSINGPARTS)錯(cuò)件(WRONGPARTS)多件(EXCESSIVEPARTS)短路(SHORT)斷路(OPEN)線短(WIRESHORT)線長(zhǎng)(WIRELONG)8?拐線(WIREPOORDDRESS)冷焊(COLDSOLDER)包焊(EXCESSSOLDER)空焊(MISSINGSOLDER)錫尖(SOLDERICICLE)錫渣(SOLDERSPLASH)錫裂(SODERCRACK)錫洞(PINHOLE)錫球(SOLDERBALL)錫橋(SOLDERBRIDGE)滑牙(SCREWLOOSE)氧化(RUST)異物(FOREIGNERMATERIAL)溢膠(EXCESSIVEGLUE)錫短路(SOLDERBRIDGE)23.錫不足(SOLDERINSUFFICIENT)極性反(WRONGPOLARITY)腳未入(PINUNSEATED)腳未出(PINUNVISIBLE)腳未剪(PINNOCUT)28?腳未彎(PINNOTBENT)29.缺蓋章(MISSINGSTAMP)30.缺標(biāo)簽(MISSINGLABEL)31.缺序號(hào)(MISSINGS/N)序號(hào)錯(cuò)(WRONGS/N)標(biāo)簽錯(cuò)(WRONGLABEL)標(biāo)示錯(cuò)(WRONGMARK)腳太短(PINSHORT)J1不潔(J1DIRTY)錫凹陷（SOLDERSCOOPED）線序錯(cuò)（W/LOFWIRE）未測(cè)試（NOTEST）VR變形（VRDEFORMED）FundamentalsofSoldersandSoldering（焊料及焊接基礎(chǔ)知識(shí)）SolderingTheory（焊接理論）MicrostructureandSoldering（顯微結(jié)構(gòu)及焊接）EffectofElementalConstituentsonWetting（焊料成分對(duì)潤(rùn)濕的影響）EffectofImpuritiesonSoldering（雜質(zhì)對(duì)焊接的影響）SolderPasteTechnology（焊膏工藝）SolderPowder（錫粉）SolderPasteRheology（錫膏流變學(xué)）SolderPasteComposition&Manufacturing（錫膏成分和制造）SMTProblemsOccurredPriortoReflow（回流前SMT問(wèn)題）FluxSeparation（助焊劑分離）PasteHardening（焊膏硬化）PoorStencilLife（網(wǎng)板壽命問(wèn)題）PoorPrintThickness（印刷厚度不理想）PoorPasteReleaseFromSqueegee（錫膏脫離刮刀問(wèn)題）Smear（印錫模糊）Insufficiency（印錫不足）NeedleClogging（針孔堵塞）Slump（塌落）LowTack（低粘性）ShortTackTime（粘性時(shí)間短）SMTProblemsOccurredDuringReflow（回流過(guò)程中的SMT問(wèn)題）ColdJoints（冷焊）Nonwetting（不潤(rùn)濕）Dewetting（反潤(rùn)濕）Leaching（浸析）Intermetallics（金屬互化物）Tombstoning（立碑）Skewing（歪斜）Wicking（焊料上吸）Bridging（橋連）Voiding（空洞）Opening（開(kāi)路）SolderBalling（錫球）SolderBeading（錫珠）Spattering（飛濺）SMTProblemsOccurredatPostReflowStage（回流后問(wèn)題）WhiteResidue（白色殘留物）CharredResidue（炭化殘留物）PoorProbingContact（探針測(cè)接問(wèn)題）SurfaceInsulationResistanceorElectrochemicalMigrationFailure（表面絕緣阻抗或電化遷移缺陷）Delamination/Voiding/Non-curingOfConformalCoating/Encapsulants（分層/空洞/敷形涂覆或包封的固化問(wèn)題）ChallengesatBGAandCSPAssemblyandReworkStage（BGA、CSP組裝和翻修的挑戰(zhàn)）StarvedSolderJoint（少錫焊點(diǎn)）PoorSelf-Alignment（自對(duì)位問(wèn)題）PoorWetting（潤(rùn)濕不良）Voiding（空洞）Bridging（橋連）UnevenJointHeight（焊點(diǎn)高度不均）Open（開(kāi)路）PopcornandDelamination（爆米花和分層）SolderWebbing（錫網(wǎng)）SolderBalling（錫球）ProblemsOccurredatFlipChipReflowAttachment（倒裝晶片回流期間發(fā)生的問(wèn)題）Misalignment（位置不準(zhǔn)）PoorWetting（潤(rùn)濕不良）SolderVoiding（空洞）UnderfillVoiding（底部填充空洞）Bridging（橋連）Open（開(kāi)路）UnderfillCrack（底部填充裂縫）Delamination（分層）FillerSegregation（填充分離）InsufficientUnderfilling（底部填充不充分）OptimizingReflowProfileviaDefectMechanismsAnalysis（回流曲線優(yōu)化與缺陷機(jī)理分析）FluxReaction（助焊劑反應(yīng)）PeakTemperature（峰值溫度）CoolingStage（冷卻階段）HeatingStage（加熱階段）TimingConsiderations（時(shí)間研究