微專業(yè)---半導(dǎo)體制造技術(shù)課程：半導(dǎo)體工程專業(yè)英語ContentsSemiconductorProperties半導(dǎo)體特性01SemiconductorMaterials半導(dǎo)體材料02SemiconductorDeviceandHowTheyareUsed半導(dǎo)體器件及其使用03ProcessTechnology工藝技術(shù)04FabricationProcesses制造工藝05SemiconductorMaterialsandProcessCharacterization半導(dǎo)體材料與工藝表征06ProcessTechnology4.1SubstratesfromtheProcessPerspective4.2Liquid-Phase(Wet)Processes4.3Gas-Phase(Dry)Processes4.4ProcessesinSemiconductorManufacturing4.5ContaminationControl4.6ProcessIntegration044ProcessTechnology1ChapterOverview

Semiconductorprocesstechnology,understoodasatechnologydeveloped

andusedforthepurposeofmanufacturingsemiconductordevices,involves

complextools,methods,andproceduresdevisedspecificallyforsemiconductordevicefabrication.

Thischapteraddressesthesemiconductorprocessingrelatedissueswhich

aregeneralinnatureandnotspecifictothetypesofmaterialsinvolved./d??va?zd/設(shè)計2Introduction

Thewayvariousprocessingstepinvolvedinthemanufactureofsemiconductordevicesareimplementeddependsonthesize,shape,degreeofflexibility,

andchemicalmakeupofmaterialsusedtoconstructsuchdevices./??mpl?ment?d/實現(xiàn)4.1SubstratesfromtheProcessPerspective4ProcessTechnology/?fleks??b?l?ti/靈活性/?me??k?p/組成3

Thesubstratewafersinsemiconductortechnologyaregettinglargerin

ordertoincreasethenumberofdevicesbuiltintothewaferandinconsequencetodecreasethecostofelectronic/photonicfunctionsperformedby

devicesbuiltintothewafer.Economicsofsemiconductorprocessingare

suchthataslargeaspossiblenumberofidenticaldevices,orchips,isfitted

ontothewafer.Initialbarewaferafterbeingsubjecttohundredsofpreciselyexecutedoperationsistransformedintothe

wafercontaininganarrayoffunctionaldevices,confinedwithinasinglechip.Followingcompletionofthefabricationsequencewafersare

separatedintoindividualchipswhicharethenpackagedandusedasapart

oftheelectroniccircuitryaccordingtotheirspecifications./ber/裸4.1SubstratesfromtheProcessPerspective4ProcessTechnology/?kɑ?ns?kwens/結(jié)果/a??dent?k(?)l/完全相同的4.1.1

WafersubstratesText/k?m?pli??(?)n/完成/?spes?f??ke??n/規(guī)格/?s??rk?tri/電路/?s?bd?ekt/使經(jīng)受4Fromthebaresemiconductorwafertotheprocessedwafercontaining

hundredsofself-containedindividualdevices/chips.4.1SubstratesfromtheProcessPerspective4ProcessTechnology4.1.1

Wafersubstrates/?selfk?n?te?nd/獨立的

Intermsofprocessimplementation,thechoiceisbetweensingle-wafer

processeswhereonewaferatatimeisexposedtotheprocessambient,and

batchprocesseswherethenumberofwafersisloadedintotheprocesstoolin

batchesandthenprocessedsimultaneously.Therearesomemanufacturingoperationswhichcannot

beexecutedonthewafersinbatches,butotherwisefabricationstepsinvolved

insemiconductormanufacturingcanbeimplementedeitherinbatch,orin

thesingle-waferprocessmode.54.1SubstratesfromtheProcessPerspective4ProcessTechnology4.1.1

Wafersubstrates/?sa?m(?)l?te?ni?sli/同時的/b?t?/一批/??mbi?nt/環(huán)境64.1SubstratesfromtheProcessPerspective4ProcessTechnology4.1.1

Wafersubstrates/?selfk?n?te?nd/獨立的

Thechoicebetweenarrangementsofwafersprocessedinbatches

dependsonthenatureofanygivenprocess.Forinstance,arrangement

wherethewafersareloadedverticallyintotheboat(Fig(a))isoften

employedinhigh-temperatureprocesseswhichincludedeposition/growthof

variousthinfilms.Ontheotherhand,arrangementshowninFig(b)is

oftenencounteredinlow-pressureprocesseswhilethebatchprocessinvolving

chemicallyresistantcassette

depictedinFig(c)isatthecoreofwet

processingwherewafersareimmersedinliquidchemicalsandwater./d??p?kt?d/描述/k??set/盒子/??m??rst/浸入的74.1SubstratesfromtheProcessPerspective4ProcessTechnology4.1.1

WafersubstratesSchematicrepresentationofthedifferentwaysbatchprocessesinsemiconductormanufacturingareimplemented./b?t?/一批8

Averydistinctchallengeinsemiconductordevicefabricationisconcerned

withextra-largeglasspanelsusedtomanufacturelargedisplays.Connectiontosemiconductortechnologycomesfromthefactthatthekeyelement

involvedinthedisplaymanufacturingisasequenceconcernedwithafabricationontheThin-FilmTransistors

(TFT).Inprinciple,intheprocessingoflargesubstratesthesameinnatureasinthecaseofwafer-basedmanufacturingprocessesareemployed,however,theirimplementationismodifiedtoaccommodatedrasticallylargersubstrates.4.1SubstratesfromtheProcessPerspective4ProcessTechnology/??kɑ?m?de?t/適應(yīng)4.1.2

LargeareasubstratesText/??mpl?men?te??(?)n/實施9

Thefunctionalityofsemiconductordevicesandsystemsisexpandedwhenin

additiontotheirfabricationontherigidsubstrates,theyarealsoavailablein

theflexiblevariations.AsthediscussioninChapter3indicated,semiconductordevicesfindimportantapplicationsasflexibleelectroniccircuits,flexible

displays,solarcells,lightingpanels,aswellaselementsofwearableelectronicsandphotonics.Obviously,implementationofflexiblesemiconductor

electronicandphotonicdevicesrequiresnotonlyflexibilityofthematerials

usedtofabricatedevices,butalsoadequateflexiblesubstratesup