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DevelopmentofTGV
SubstratesforGlass
Core〇Feng
Tsai,AtsukiSaito2025
Aug.26-27,Shenzhen,The2ndGlassSubstrate
TGVIndustryChainSummitForum
NipponElectricglass
Co.,Ltd.?Ni
on
ElectricGlassCo.,
Ltd.,?
NEG
solution
for
in-organic
core
materials-GC
core-Glass
core?
Evaluation
related
to
Build-up
process-Metallization-Se-Wa-Re
issues?
Summary?
Introduction
of
NEG-Company
profile-Product-Manufacturingtechnology?Ni
on
ElectricGlassCo.,
Ltd.Contents2?
NEG
solution
for
in-organic
core
materials-GC
core-Glass
core?
Evaluation
related
to
Build-up
process-Metallization-Se-Wa-Re
issues?
Summary?
Introduction
of
NEG-Company
profile-Product-Manufacturingtechnology?Ni
on
ElectricGlassCo.,
Ltd.Contents3
LowCTE
/
highmodulus→Reduce
warpagein
Largesubstrate
Dimensionalstability
Highthroughhole
density
LowLoss
HigherTemperature
capabilityIntelannouncedthatitaimstocommercializeglasscoresubstratesby2030Glasseswith
TGV
arerequired!Source:https://www.anandtech.com/show/20058/intel-shows-off-
glass-core-substrate-plans-deployment-late-decadeSpotlighttoglassesforcoresubstratematerial?Ni
on
ElectricGlassCo.,
Ltd.4MaterialGC
CoreTM
(LTCC)Glass
CoreViaformingCO2
LaserLasermodification
+
EtchingCO2
LaserFeatures
Hightact
drilling
LowDk
Small/highdensityvia
Cleansurface
Hightact
drilling
Lowinitial
costWearedevelopingmultiplematerialsand
drilling
methodsNEGstrategiesforin-organiccoredevelopment?Ni
on
ElectricGlassCo.,
Ltd.5GCcoreTM
canachievelowDk/Df.Wesuccessmakinglargesubstrates(510-515mm)asaprototype.Nowweareworking
on
qualityimprovement.CTE(ppm/℃)6.
1Dk
at2.45GHz3.9Dfat2.45GHz0.0013?Nippon
ElectricGlassCo.,
Ltd.Example
properties
of
GC
coreTMGC
CoreTMTopCrosssection6Wearedevelopingtwotype
ofTGV
forming
technology?Nippon
ElectricGlassCo.,
Ltd.Small
/
Highdensityvia
CleansurfacebyetchingTGV
by
CO2
Laser(Underdevelopment)TGV
byLasermodification
+EtchingFast
TGV
formation
Lowinitial
costsGlass
CoreCrosssectionCrosssection7CTE[ppm/℃]
(20
～260℃)2.83.53.65.26.78.49.8Dk(1GHz)4.85.64.65.46.57.07.4Df
(1GHz)0.0020.0030.0060.010.010.010.01Glass
typeNon-Alkaline
glassAlkaline-glassWehave
Wide-CTE
glasslineupforcoresubstrates.CTEof
theglassisinthe
range
of
3~
10ppm.LowDk/DFcanbeachievedinthe
low
CTErangeLow
CTE
High?Ni
on
ElectricGlassCo.,
Ltd.Glass
lineup81）Laser
modificationIrradiatewithanultrashort
pulselaserat
the
holeposition.2）EtchingEtchingtheglassbywetsolution.Themodifiedregionisselectivelyetched.<
Crosssection＞
modifiedregionProcessof
Laermodification
+EtchingItisimportanttounderstandoptimalconditionsforeachglasscomposition.
?Nippon
ElectricGlassCo.,
Ltd.LasermodificationDuringetchingAfteretchingBareglassCTE3.53.65.26.7TGVimag(CrosssectiGlassthickness400
μmHolediameterΦ50μmTaperangle4
。122Aspectratio8?
Wecan
achieve
straighthole
shape
in
several
CTErange.?
TGV
shapecould
be
controlledbyetching
conditions?Ni
on
ElectricGlassCo.,
Ltd.TGV
examples10。。。?
NEG
solution
for
in-organic
core
materials-GC
core-Glass
core?
Evaluation
related
to
Build-up
process-Metallization-Se-Wa-Re
issues?
Summary?
Introduction
of
NEG-Company
profile-Product-Manufacturingtechnology?Ni
on
ElectricGlassCo.,
Ltd.Contents11PeelstrengthtestCTE
CTE
CTE
CTE3.5ppm
3.6ppm5.2ppm8.9ppmProcess1.Seedlayerdeposition2.Electroless
Cuplating3.Electrolytic
CuplatingTarget
Value>4~6N/cm※
EvaluationareconductedbycollaboratorSufficient
peel
strength
can
be
obtained
for
wide
range
of
glasses.Metallizationproperties?Ni
on
ElectricGlassCo.,
Ltd.12?
Se-Wa-Reisoneof
themajorchallengesfor
glass
core
application?
Tensilestress
occurs
because
of
CTEmismatchbetweeninsulationfilmandcorematerialsTensilestressTensilestressInsulationFilm
CTE
~20ppmGlassCTE3
~
10ppm?Ni
on
ElectricGlassCo.,
Ltd.Crack
propagatefromthe
flawsmadebydicingbladeSe-Wa-Re
issuesMcCann
et
al.(IEEE2015)CutbyDicingblade13ChallengesHigherCTEleadsto
themismatch
betweensubstrateandSi
chips.LowCTEinsulatingfilmsoffera
one
of
thepromisingsolutionto
this
issue.Wesimulatedinternaltensilestressacross
variousglass
CTEs.HigherCTEorthicker
glasssubstrateshelpreducestresslevelsSimulationresultsof
internaltensilestressCondition
of
simulation
Tensile
Stress
Profile
in
the
Thickness
Direction(0.4mmt)?Nippon
ElectricGlassCo.,
Ltd.Maximumtensilestressover
glassCTE0
1020
3040
50Tensilestress
(MPa)High
CTELowCTE0
CTE
(5ppm)
100.20.
10-0.1-0.235302520Maxtensilestress14Distance
(mm)0.4
t1.0
t4540(MPa)15?
NEG
solution
for
in-organic
core
materials-GC
core-Glass
core?
Evaluation
related
to
Build-up
process-Metallization-Se-Wa-Re
issues?
Summary?
Introduction
of
NEG-Company
profile-Product-Manufacturingtechnology?Ni
on
ElectricGlassCo.,
Ltd.Contents15Compositional
designTGV
processdevelopmentManufacturingtechnologyThroughglass,NEGremainscommittedtoadvancingthesemiconductorindustry.?Ni
on
ElectricGlassCo.,
Ltd.Summary16?
NEG
solution
for
in-organic
core
materials-GC
core-Glass
core?
Evaluation
related
to
Build-up
process-Metallization-Se-Wa-Re
issues?
Summary?
Introduction
of
NEG-Company
profile-Product-Manufacturingtechnology?Ni
on
ElectricGlassCo.,
Ltd.Contents17?Ni
on
ElectricGlassCo.,
Ltd.NEG
GlobalNetwork18GlasscarrierZero
CTEGlassWehavealotof
experienceinsemi-conductorfieldNEGProductforSemi-conductorfield?Ni
on
ElectricGlassCo.,
Ltd.LTCCSubstratePowderGlass19We
h
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