1、LCD制程簡介1TFT-LCD制程流程2面板世代廠3LCD Panel構造下玻璃基板上玻璃基板上偏光板間隔劑液晶分子下偏光板框膠配向膜ITO電極彩色濾光板液晶層LCD PANEL構造圖456TN Type PanelTN Type Panel需經(jīng)過配向制程，使液晶產(chǎn)生預傾角，電壓驅動時利用液晶傾斜角度的變化使光源穿透或阻擋.(Normally White:未驅動時為白色)7MVA Type PanelMVA Type Panel不需經(jīng)配向制程，液晶與基板呈垂直站立狀(Normally Black:未驅動時為黑色)利用宊起物暗示液晶倒向利用ITO Slit改變電場分布8TN vs. MVA Ty

2、pe 在制程上的差異PI/LC/End Seal等材料及制程參數(shù)不同9Panel制作CFCFCFCFCFCFTFTTFTTFTTFTTFTTFTPanel10OOOOOOOOOOXXCF84%TFT84%Panel Yield 67%OOOOXX11LCD Process Flow Chart (Conventional)前工程流程圖TFT基板投入單板切割基板洗凈PI印刷PI預烤PI硬烤配向CF基板投入單板切割基板洗凈PI印刷PI預烤PI硬烤配向銀膠打點基板組立熱壓著CELL后制程基板洗凈/干燥基板洗凈/干燥間隔劑散布框膠涂寫LCD PANEL12LCD Process Flow Chart

3、(ODF)前工程流程圖(ODF)TFT基板投入單板切割基板洗凈PI印刷PI預烤PI硬烤配向CF基板投入單板切割基板洗凈PI印刷PI預烤PI硬烤配向銀膠打點ODF熱壓著CELL后制程基板洗凈/干燥基板洗凈/干燥框膠涂寫LCD PANEL13LCD Process Flow ChartLCD PANEL后工程流程圖Cell ScriberLC FillerEnd SealingRealign OvenPanel CleanerEdge GrindingCutlet RemoverSRCNLOT 1PACNAPAMACLVLOT 2PACKLCM傳統(tǒng)線ODFCell ScriberEdge Grin

4、dingCutlet RemoverSRCNLOT 1PACNAPAMACLVLOT 2LCMPACKNHADNHBD14LCD PI印刷前洗凈制程ExciterUVUV LampBrushBrushDIWshowerCJ DI showerUpper CJ：0.80.1MpaLower CJ：0.70.1MpaMS DI showerMS HEADMS HEADAir knifeIRUVCoolingFrequency：1.6MHzOscillation Output：80W x 3 x 2setMS shower：27L/min x 2setMS DI shower：27L/minCJPU

5、MPMSPUMPCJTankMSTankAqua knifeshowerBPCL制程&設備組成15LCD PI印刷前洗凈制程16PI制程原理17LCD配向制程-1絨布滾筒玻璃基板移動方向移動方向ITO 透明電極經(jīng) Rubbing 后之配向膜玻璃基板液晶分子配 向 工 程(Rubbing)18LCD配向制程-219如何判斷LC分子是左旋或右旋20LCD配向后洗凈制程BrushBrushCJ DI showerMS DI showerMS HEADMS HEADIRCoolingCJPUMPMSPUMPCJTankMSTankAqua knifeshowerArcx製程&設備組成Entrancea

6、rmExit armSpin dryRinseShower21LCD框膠涂布/銀膠打點制程22LCD間隔劑散布制程23LCD間隔劑散布制程Spacer間隔劑散布工程(Dry Spacer Spray)SprinklerTFT基板24LCD面板組立制程面板組立工程(Panel Aligner)CF基板框膠間隔劑下玻璃基板對位記號上下基板對位完成記號狀態(tài)下玻璃基板對位記號TFT基板上定盤下定盤25LCD Cell former26Cellgap的決定27LCD Process Flowchart( ODF )前工程流程圖(ODF)TFT基板投入單板切割基板洗凈PI印刷PI預烤PI硬烤配向CF基板投

7、入單板切割基板洗凈PI印刷PI預烤PI硬烤配向銀膠打點ODF熱壓著CELL后制程基板洗凈/干燥基板洗凈/干燥框膠涂寫LCD PANEL28ODF(One Drop Filling)原理加壓& 注入口封口Alignment& PressureVAC. 液晶注入CF/TFT基板對組后利用液晶通過注入口之方式注入現(xiàn)有方式大氣壓放置& UV照射VAC. ChamberAlignment& PressureLC DropCF/TFT基板對組前利用液晶Drop方式注入Panel內(nèi)LDF方式29ODF設備簡介真空貼合部UV照射部控制臺LCDP部基板搬送部(2枚搬送)LoaderD-D stageVAC Pu

8、mp本裝置將CF/TFT基板以枚葉式搬送,大氣狀態(tài)下執(zhí)行液晶滴下,在于真空Chamber內(nèi)執(zhí)行對位壓合,接著UV照射至seal硬化.robotrobotUnoader30LCD Process Flow ChartLCD PANEL后工程流程圖Cell ScriberLC FillerEnd SealingRealign OvenPanel CleanerEdge GrindingCutlet RemoverSRCNLOT 1PACNAPAMACLVLOT 2PACKLCM傳統(tǒng)線ODFCell ScriberEdge GrindingCutlet RemoverSRCNLOT 1PACNAPA

9、MACLVLOT 2LCMPACKNHADNHBD31LCD Cell切割裂片制程-1Cell切割工程(Cell Scriber)PanelSubstrrate32LCD Cell切割裂片制程-233LC Filling & End Seal制程原理-1液晶注入工程(LC Filling)34LC Filling & End Seal制程原理-2End seal35LCD Realign Oven液晶的clean point約80度，oven溫度約100度，持續(xù)40min36LCD Panel Clean將Panel浸于洗劑中并作超音波震蕩洗凈洗劑37磨邊導角工程(ABVL)去除shortin

10、g bar避免Panel受損避免TAB刮傷38ACRM Process刮除異物工程(ACRM)封口膠刮除表面研磨去除Panel表面異物1. Cullet2.End-Seal3. 表面其它臟污39SRCN Process面板整列部VCRR/B洗凈部溫風干燥除電部Rinse(F/S)擰干部HPMJL/DConveyor表面clean磨邊后洗凈機一次外觀磨邊后(表面清潔后) ，Light-On前表面殘留Particle清潔端子部清潔40LOT 1 點燈測試Light on test偏貼前Light On點燈測試41PACN Process面板整列部VCRR/B洗凈部溫風干燥除電部Rinse(F/S)擰干部HPMJL/DConveyor表面clean磨邊后洗凈機一次外觀偏光板貼付前，玻璃表面之清潔避免Panel于偏貼前受污染提供潔凈之Panel至偏貼機42APAM Process偏光板貼附工程(APAM)穩(wěn)定之偏光板自動貼附Cassette制御BOX受取回轉部CCD alignment貼附部反轉部貼附部反轉部ULD alignmentInspectionCCD alignment部VCR清掃roller中間搬送Alignmnnt部清掃roller偏光板set部ULD43LOT 2 點燈測試Light on