APA4863

CopyrightANPECElectronicsCorp.

Rev.A.3-Apr.,2001

PAGE

10

Stereo2.2WAudioPowerAmplifier

Features

DepopCircuitryIntegrated

ThermalShutdownCircuitryIntegrated

Bridge-TiedLoad(BTL)orSingle-Ended(SE)ModesOperation

DD

OutputPowerat1%THD+N,V=5V

2.2W/Ch(typ)intoa3Load

1.8W/Ch(typ)intoa4Load

1.2W/Ch(typ)intoa8Load

SD

ShutdownControlMode,I=0.5μA

DD

OutputPower(SE)at0.5%THD+N,V=5V

90mW/Ch(typ.)intoa32Load

VariousPowerPackagesAvailableSOP,TSSOP,TSSOP-P

Applications

StereoAudioPowerAmplifierforNotebookComputer

Portable evisions

PortableandDesktopComputers

GeneralDescription

TheAPA4863isastereobridge-tiedaudiopoweram-plifierinvariouspowerpackages,includingSOP,TSSOPandTSSOP-P.Whenconnectingtoa5Vvolt-agesupply,theAPA4863iscapableofdelivering2.2W/1.8W/1.2WofcontinuousRMSpowerperchan-nelinto348bridge-tiedloadswithlessthan1%THD+Nrespectively.WhenAPA4863operatesinthesingle-endedload,itiscapableofdelivering90mWofcontinuousRMSpowerperchannelinto32load.TheAPA4863simplifiesdesignandsupboardspaceforotherfeatures.

TheAPA4863alsoservedwellinlow-voltageappli-cations,whichprovides750mW(1%THD+N)perchannelinto4loadswitha3.3Vsupplyvoltage.BothofthedepopcircuitryandthethermalshutdownprotectioncircuitryareintegratedintheAPA4863,thatreducespopsandclicksnoiseduringpowerupandwhenusingtheshutdownmodeandprotectsthechipfrombeingdestroyedbyover-temperaturefail-ure.Tosimplifytheaudiosystemdesigninnote-bookcompupplications,theAPA4863combinesastereobridge-tiedloadsmodeforspeakerdriveandastereosingle-endmodeforheadphonedriveintoasinglechip,wherebothmodesareeasilyswitchedbytheHP-INinputcontrolpinsignal.Forpowersen-sitiveapplications,theAPA4863alsofeaturesashut-downfunctionwhichkeepsthesupplycurrentonly

0.5μA(typ.).

OrderingandMarkingInformation

APA4863

PackageCode

:SOP O:TSSOP R:TSSOP-P*

Temp.Range

I:-40to85C

HandlingCode

TU:Tube TR:Tape&Reel TY:TrayLeadCode

:LeadDevice Blank:OriginalDevice

LeadCode

HandlingCode

Temp.Range

PackageCode

APA4863K:

APA4863XXXXX

XXXXX-

APA4863R/O:

APA4863

XXXXX

XXXXX-

*TSSOP-PisastandardTSSOPpackagewithathermalpadexposedonthebottomofthepackage.

ANPECreservestherighttomakechangestoimprovereliabilityormanufacturabilitywithoutnotice,andadvisecustomerstoobtainthelatestversionofrelevantinformationtoverifybeforecingorders.

BlockDiagram

AudioInput

RF

R1 20K 6

CS

-INA

0.1F

VDD

4,13

CO

+

100F

1K

R

Control

Pin Ring

L

8

ToHP-INCircuit

CO

+

100F

TipSleeve

HeadphoneJack

R

1K

L

8

-OUTA

C1

1F

20K

8+INA*

Bypass

5

20K

5

20K

20K

C V

10

B

DD/2

+OUTA

3

AudioInput

2.2F

R

50K

C1

1FVDD

1

ToControlPinon

1

20K

11

9

RF

20K

1

16

-INB

+INB*

ShutdownHP-IN

20K

-OUTB1220K

20K

+OUTB

14

HeadphoneJack

100K

GND27,15

*+INAand+INBpinsareconnectedtoBypasspininsidetheIC.

AbsoluteumRatings

(Overoperating-airtemperaturerangeunlessotherwisenoted.)

Symbol

Parameter

Rating

Unit

VDD

SupplyVoltage

6

V

TA

OperatingAmbientTemperatureRange

-40to85

C

TJ

umJunctionTemperature

150

C

TSTG

StorageTemperatureRange

-65to+150

C

TS

SolderingTemperature,10seconds

260

C

VESD

ElectrostaticDischarge

-2000to2000*1

V

Note:*1.Humanbodymodel:C=100pF,R=1500,3positivepulsesplus3negativepulses

RecommendedOperatingConditions

Min.

Typ.

Max.

Unit

SupplyVoltage,VDD

3

5

5.5

V

Operating-airtemperature,TA

VDD=5V, 4-stereoBTLdrive,with250mW/Chaverage properPCBdesign

power

VDD=5V, 4-stereoBTLdrive,with

1.8W/Chaverage properPCBdesignand300power CFM d-aircooling

-20

-20

85

85

C

monmodeinputvoltage,VICM

=5V

1.25

4.5

V

VDD=3.3V

1.25

2.7

DissipationRatingTable

Package

AirFlow(CFM)

Thermal

JA(C/W)

TA25C

TA=70C

SO16+

0

50

2.5W

1.6W

TSSOP++

0

200

73.2

66.6

1.7W

1.8W

1.1W

1.2W

TSSOP-P++

0

200

37.6

32.3

3.3W

3.8W

2.1W

2.4W

+:Theparameterismeasuredwiththe mendedcopperheatsinkpatternonan2-layerPCB,11.7in23.02.4in2i B,1oz.copper,3.01.5in2incoverageatToyerandBottom-layerat100%coverage(7.2in2).

++:TheparameterismeasuredwiththeJEDECstandardtestboards(multi-layerPCB).

ElecticalCharacteristics

ElectricalCharacteristicsforEntireIC

ThefollowingspecificationsapplyforVDD=5Vunlessotherwisenoted.LimitsapplyforTA=25°C

Symbol

Parameter

TestConditions

APA4863

Unit

Min.

Typ.

Max.

VDD

SupplyVoltage

3

5.5

V

IDD

QuiescentPowerSupply

Current

VIN=0V,IO=0A,HP-IN=0V

VIN=0V,IO=0A,HP-IN=4V

9

5

13.5

7.5

mA

ISD

ShutdownCurrent

VPIN1=VDD

5

0.5

A

VIH

HeadphoneHighInputVoltage

4

V

VIL

HeadphoneLowInputVoltage

0.8

V

ElecticalCharacteristicsCont.

ElectricalCharacteristicsforBTLModeOperation

ThefollowingspecificationsapplyforVDD=5Vunlessotherwisenoted.LimitsapplyforTA=25°C

Symbol

Parameter

TestConditions

APA4863

Unit

Typ.

VOS

OutputOffsetVoltage

VIN=0V

5

mV

PO

OutputPower

THD=1%,f=1kHz

RL=3

2.2

W

RL=4RL=8

1.8

1.2

THD=10%,f=1kHz

RL=3

2.7

RL=4

RL=8

2.3

1.5

THD+N

TotalHarmonicDistortion+Noise

AVD=2,f=1kHz

RL=4,PO=1.8W

0.3

%

RL=8,PO=1W

0.15

RSRR

PowerSupplyRejectionRatio

VDD=5V,VRIPPLE=200MvRms,RL=8CB=2.2F

64

dB

XTALK

ChannelSeparation

f=1kHz,CB=2.2F,PO=1W,RL=8

90

dB

SNR

Signal-to-NoiseRatio

VDD=5V,PO=1.1W,RL=8

95

dB

ElectricalCharacteristicsforSEModeOperation

ThefollowingspecificationsapplyforVDD=5Vunlessotherwisenoted.LimitsapplyforTA=25°C

Symbol

Parameter

TestConditions

APA4863

Unit

Typ.

VOS

OutputOffsetVoltage

VIN=0V

5

mV

PO

OutputPower

THD=0.5%, f=1kHz,RL=32

THD=1%, f=1kHz,RL=8THD=10%, f=1kHz,RL=8

90

320

400

mW

THD+N

TotalHarmonicDistortionplusNoise

AV=-1,PO=75mW,f=1kHz,RL=32

0.02

%

RSRR

PowerSupplyRejectionRatio

VRIPPLE=200mVRMS,f=1kHz,CB=2.2F,RL=8

49

dB

XTALK

ChannelSeparation

f=1kHz,CB=2.2F,PO=32mW,RL=32

85

dB

SNR

Signal-to-NoiseRatio

VDD=5V,PO=340mW,RL=8

95

dB

TruthTableforLogicInputs

Shutdown

HP-IN

APA4863Mode

Low

Low

Bridge-Tied

Low

High

Single-Ended

High

Low

APA4863Shutdown

High

High

APA4863Shutdown

PinDescription

SHUTDOWN

GND

+OUTA

VDD

-OUTA

-INAGND

+INA

HP-INGND

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

SHUTDOWN

1

20

HP-IN

GND

2

19

GND

+OUTA

3

18

+OUTB

V

4

17

VDD

-OUTA

-INA

5

6

16

15

OUTB

INB

GND

7

14

BYPASS

+INA

8

13

+INB

NC

9

12

NC

NC

10

11

NC

TopView

forTSSOP

+OUTB

V

DD

DD

OUTB

INB

BYPASS

+INB

TopViewforSOP

SHUTDOWN

1

20

HP-IN

GND

2

19

GND

+OUTA

3

18

+OUTB

VDD

4

17

VDD

-OUTA

5

16

-OUTB

-INA

6

15

-INB

GND

7

14

BYPASS

+INA

8

13

+INB

GND

9

12

GND

GND

10

11

GND

ThermalPad

TopView

forTSSOP-P

PinDescription

BottomViewforTSSOP-P

Name

I/O

Description

GND

Groundconnectionofcircuitry

VDD

I

Supplyvoltageinput

+INA

I

Non-invertinginputofchannelA,connectedtobypasspininsidetheIC

-INA

I

InputpinofchannelA

+OUTA

O

Achannel+outputinBTLmode,highimpedanceinSEmode

-OUTA

O

Achannel-outputinBTLmode,+outputinSEmode

+INB

I

Non-invertinginputofchannelB,connectedtobypasspininsidetheIC

-INB

I

InputpinofchannelB

+OUTB

O

Bchannel+outputinBTLmode,highimpedanceinSEmode

-OUTB

O

Bchannel-outputinBTLmode,+outputinSEmode

BYPASS

Connecttovoltagedividerforinternalmid-supplybias

HP-IN

I

Headphonecontrolpininput,holdhighforsingle-endedmodeoperation

SHUTDOWN

I

Shutdownmodecontrolpininput,cesentireICinshutdownmode

whenheldhigh,IDD=0.5A

TypicalCharacteristics

THD+NvsOutputPower

VDD=5V,RL=4BW<80kHz

20Hz

20kHz1kHz

10

THD+NvsFrequency

VDD=5V,PO=1.8WRL=4BW<80kHz

10

1

THD+N(%)

THD+N(%)

1

0.1

0.1

0.01

10m

100m 1 3

0.01

20

100

1k 10k20k

Figure1:OutputPower(W) Figure2:Frequency(Hz)

PowerDissipationvsOutputPower

VDD=5V

RL=4

RL=8

1.4

PowerDissipation(W)

1.2

1

0.8

0.6

0.4

10

THD+N(%)

1

0.1

THD+NvsFrequency

0.2

0

0 0.5 1 1.5 2 2.5

0.01

VDD=5V,PO=1W

RL=8BTLMode

AVD=10

AVD=2

20

100 1k

10k20k

Figure3:OutputPower(W) Figure4:Frequency(Hz)

TypicalCharacteristicsCont.

THD+NvsFrequency

VDD=5V,PO=150mW

RL=16SEMode

AV=-5

AV=-1

10

THD+NvsFrequency

VDD=5V,PO=75mW

RL=32SEMode

AV=-5

AV=-1

10

1 1

THD+N(%)

THD+N(%)

0.1 0.1

0.001

20

100 1k

10k

20k

0.001

20

100 1k 10k20k

Figure5:Frequency(Hz) Figure6:Frequency(Hz)

THD+NvsOutputPower

f=20Hz

f=20kHz

f=1kHz

VDD=5V,RL=8

AVD=2,BW<80kHz

BTLMode

10

THD+NvsOutputPower

10

THD+N(%)

1

0.1

1

THD+N(%)

0.1

f=20kHzf=20Hz

f=1kHz

VDD=5V,RL=16

0.01

10m

100m 1 2

0.001

10m

AV=-1,BW<80kHz

SEMode

70m 200m 500m

Figure7:OutputPower(W) Figure8:OutputPower(W)

TypicalCharacteristicsCont.

10

THD+N(%)

1

0.1

0.001

THD+NvsOutputPower

VDD=5V,RL=32

AV=-1,BW<80kHz

SEMode

f=20kHzf=20Hz

f=1kHz

10

THD+N(%)

1

0.1

0.01

THD+NvsOutputPower

f=20kHz

f=20Hz

f=1kHz

VDD=3.3V,RL=4AVD=2

10m

50m

100m

200m

10m

100m 1 2

Figure9:OutputPower(W) Figure10:OutputPower(W)

THD+NvsFrequency THD+NvsOutputPower

f=20kHz

f=20Hz

f=1kHz

VDD=3.3V,RL=8,AVD=2

VDD=3.3V,PO=700mWRL=4,AVD=2

10 10

1 1

THD+N(%)

THD+N(%)

0.1 0.1

0.01

20

100 1k 10k

20k

0.01

10m

100m 1

Figure11:Frequency(Hz) Figure12:OutputPower(W)

TypicalCharacteristicsCont.

THD+NvsFrequency

10

VDD=3.3V,PO=450mWRL=8,AVD=2

1

OutputPowervsLoad

VDD=3.3V,f=1kHzAVD=2,BW<80kHz

THD+N=10%

THD+N=1%

0.2

0.15

THD+N(%)

OutputPower(W)

0.1

0.1

0.05

0.01

20

100

1k 10k

20k

0

0 10 20 30 40

Figure13:Frequency(Hz) Figure14:Load ()

PowerDissipationvsOutputPower OutputPowervsSupplyVoltage

0.35

0.3

PowerDissipation(W)

0.25

0.2

0.15

0.1

0.05

0

RL=8

RL=16

VDD=3.3V,SEMode

0 0.2 0.4 0.6 0.8

2

VDD=5V,f=1kHz

RL=8BW<80kHz

BTLMode

THD+N=10%

THD+N=1%

1.75

OutputPower(W)

1.5

1.25

1

0.75

0.5

0.25

02

2.5 3 3.5 4

4.5 5 5.5

Figure15:OutputPower(W) Figure16:SupplyVoltage(V)

TypicalCharacteristicsCont.

300

250

OutputPower

200

150

100

50

OutputPowervsSupplyVoltage

VDD=5V,f=1kHz

RL=16BW<80kHz

SEMode

THD+N=10%

THD+N=1%

150

130

OutputPower

110

90

70

50

30

10

OutputPowervsSupplyVoltage

02 2.5 3 3.5 4 4.5 5 5.5

SupplyVoltage(V)Figure17

-10

VDD=5V,f=1kHz

RL=32BW<80kHz

SEMode

THD+N=10%

THD+N=1%

2 2.5 3 3.5 4 4.5 5 5.5

SupplyVoltage(V)Figure18

OutputPowervsLoad OutputPowervsLoad

VDD=5V,f=1kHz

AVD=2BW<80kHz

BTLMode

10%THD+N

1%THD+N

1.75

1.5

OutputPower(W)

1.25

1

0.75

0.5

0.25

0

1

VDD=5V,f=1kHz

AV=-1BW<80kHz

SEMode

10%THD+N

1%THD+N

OutputPower(W)

0.8

0.6

0.4

0.2

8 18 28 38 48 58 68

00 1020 30 40 50 60 70

Figure19:Load () Figure20:Load ()

TypicalCharacteristicsCont.

PowerDissipationvsOutputPower

RL=4

R=8

VDD=5V,f=1kHzTHD+N<1%

BW<80kHz

BTLMode

L

RL=16

RL=32

1.4

1.2

PowerDissipation

1

0.8

0.6

0.4

0.2

0

0 0.5 1 1.5

OutputPower(W)Figure21

0.18

0.16

PowerDissipation

0.14

0.12

0.1

0.08

0.06

0.04

0.02

0

PowerDissipationvsOutputPower

RL=8

RL=32 VDD=5V,f=1kHz

THD+N<1%

BW<80kHz

SEMode

RL=16

0 0.1 0.2 0.3 0.4 0.5

OutputPower(W)Figure22

OutputNoiseVoltage(V)

100

10

NoiseFloor

+0

ChannelSeparation(dB)

-20

-40

-60

ChannelSeparation

VO++VO-

VO-

VDD=5V,RL=8AVD=2,CB=1F

1

20 100

1k 10k20k

-80

VDD=5V,RL=8AVD=2,PO=1WCB=1F

BTLMode

ChannelAtoB

ChannelBtoA

-100

-120

20

100 1k 10k20k

Figure23:Frequency(Hz) Figure24:Frequency(Hz)

TypicalCharacteristicsCont.

ChannelSeparation

OpenLoopFrequencyResponse

VDD=5V,RL=32AV=-1,PO=75mWCB=1F

SEMode

ChannelAtoB

ChannelBtoA

+80

+70

+60

+50

+40

+30

+20

+10

VDD=5V

SEMode

Gain

Phase

+0

100 1k 10k 100k 1M 10M

(dB)

-20

ChannelSeparation

-40

Gain(dB)

-60

-80

-120

20

100

1k 10k20k

Figure25:Frequency(Hz) Figure26:Frequency(Hz)

SupplyCurrentvsSupplyVoltage

VIN=0V

NoLoad

BTLMode

(H ND)

SEMode

(HP-IN=VDD)

10

8

SupplyCurrent(mA)

6

4

2

02 2.5 3 3.5 4 4.5 5 5.5

Figure27:SupplyVoltage(V)

PackagingInformation

SO–300mil(ReferenceJEDECRegistrationMS-013)

D

N

H

E

GAUGE

NE

L

1

123

A

e

B

A1

Dim

Millimeters

Variations-D

Dim

Inches

Variations-D

Min.

Max.

Variations

Min.

Max.

Min.

Max.

Variations

Min.

Max.

A

2.35

2.65

SO-16

10.10

10.50

A

0.093

0.1043

SO-16

0.398

0.413

A1

0.10

0.30

SO-18

11.35

11.76

A1

0.004

0.0120

SO-18

0.447

0.463

B

0.33

0.51

SO-20

12.60

13

B

0.013

0.020

SO-20

0.496

0.512

D

Seevariations

SO-24

15.20

15.60

D

Seevariations

SO-24

0.599

0.614

E

7.40

7.60

SO-28

17.70

18.11

E

0.2914

0.2992

SO-28

0.697

0.713

e

1.27BSC

SO-14

8.80

9.20

e

0.050BSC

SO-14

0.347

0.362

H

10

10.65

H

0.394

0.419

L

0.40

1.27

L

0.016

0.050

N

Seevariations

N

Seevariations

1

0

8

1

0

8

APA4863

CopyrightANPECElectronicsCorp.

Rev.A.3-Apr.,2001

PAGE

14

PackagingInformation

TSSOP/TSSOP-P(ReferenceJEDECRegistrationMO-153)

e

N

2xE/2

E1 E

123

e/2

D

A2

A

b

A1

(2)

GAUGE

NE

S

0.25

L

(L1)

1

(3)

D1

EXPOSEDTHERMAL

PADZONE

E2

BOTTOMVIEW

(THERMALLYENHANCEDVARIATIONDSONLY)

Dim

Millimeters

Inches

Min.

Max.

Min.

Max.

A

1.2

0.047

A1

0.00

0.15

0.000

0.006

A2

0.80

1.05

0.031

0.041

D

6.4(N=20PIN)

7.7(N=24PIN)

9.6(N=28PIN)

6.6(N=20PIN)

7.9(N=24PIN)

9.8(N=28PIN)

0.252(N=20PIN)

0.303(N=24PIN)

0.378(N=28PIN)

0.260(N=20PIN)

0.311(N=24PIN)

0.386(N=28PIN)

D1

4.2BSC(N=20PIN)

4.7BSC(N=24PIN)

3.8BSC(N=28PIN)

0.165BSC(N=20PIN)

0.188BSC(N=24PIN)

0.150BSC(N=28PIN)

e

0.65BSC

0.026BSC

E

6.40BSC

0.252BSC

E1

4.30

4.50

0.169

0.177

E2

3.0BSC(N=20PIN)

3.2BSC(N=24PIN)

2.8BSC(N=28PIN)

0.118BSC(N=20PIN)

0.127BSC(N=24PIN)

0.110BSC(N=28PIN)

L

0.45

0.75

0.018

0.030

L1

1.0REF

0.039REF

R

0.09

0.004

R1

0.09

0.004

S

0.2

0.008

1

0

8

0

8

2

12REF

12REF

3

12REF

12REF

APA4863

CopyrightANPECElectronicsCorp.

Rev.A.3-Apr.,2001

PAGE

15

PhysicalSpecifications

TerminalMaterial

Solder- tedCopper(SolderMaterial:90/10or63/37SnPb),100%Sn

LeadSolderability

MeetsEIASpecificationRSI86-91,ANSI/J-STD-002Category3.

Packaging

1000devicesperreel

ReflowCondition(IR/ConvectionorVPRReflow)

tp

CriticalZone

Ramp-up

TLtoTP

tL

ts

Preheat

t25CtoPeak

Ramp-down

Tsmin

Tsmax

TP

Temperature

TL

25

ClassificatinReflowProfiles

Time

ProfileFeature

Sn-PbEutectic