1、半導(dǎo)體封裝制程與設(shè)備材料知識(shí)介紹,半導(dǎo)體封裝制程概述,半導(dǎo)體前段晶圓wafer制程半導(dǎo)體后段封裝測(cè)試封裝前段（B/G-MOLD）封裝后段（MARK-PLANT）測(cè)試封裝就是將前製程加工完成後所提供晶圓中之每一顆IC晶粒獨(dú)立分離，並外接信號(hào)線至導(dǎo)線架上分離而予以包覆包裝測(cè)試直至IC成品。,半導(dǎo)體制程,封裝型式概述,IC封裝型式可以分為兩大類，一為引腳插入型，另一為表面黏著型,封裝型式(PACKAGE),封裝型式,封裝型式,封裝型式,封裝型式,封裝型式,SanDiskAssemblyMainProcess,DieCure(Optional),DieBond,DieSaw,Plasma,CardAs

2、y,MemoryTest,Cleaner,CardTest,PackingforOutgoing,Detaping(Optional),Grinding(Optional),Taping(Optional),WaferMount,UVCure(Optional),Lasermark,PostMoldCure,Molding,LaserCut,PackageSaw,WireBond,SMT(Optional),半導(dǎo)體設(shè)備供應(yīng)商介紹-前道部分,半導(dǎo)體設(shè)備供應(yīng)商介紹-前道部分,半導(dǎo)體設(shè)備供應(yīng)商介紹,半導(dǎo)體設(shè)備供應(yīng)商介紹,半導(dǎo)體設(shè)備供應(yīng)商介紹,常用術(shù)語(yǔ)介紹,SOP-StandardOperationP

3、rocedureFMEA-FailureModeEffectAnalysisSPC-StatisticalProcessControlDOE-DesignOfExperimentIQC/OQC-Incoming/OutingQualityControlMTBA/MTBF-betweenassit/FailureUPH-UnitsPerHourCPK-品質(zhì)參數(shù),晶圓研磨(GRINDING),1.GRINDING工藝,l研磨1.研磨分為粗磨與細(xì)磨,晶圓粗糙度需小於0.08um.2.細(xì)磨厚度在1020um之間,而二次研磨參數(shù)中,細(xì)磨厚度為15um(二次研磨變更作業(yè)膠膜為230um).3.研磨標(biāo)準(zhǔn)厚度

4、:a.HSBGA:1113MIL標(biāo)準(zhǔn)研磨厚度為12MILb.PBGA:1116MIL標(biāo)準(zhǔn)研磨厚度為12MIL.c.LBGA:9.510.5MIL標(biāo)準(zhǔn)研磨厚度為10MIL.5.研磨時(shí)機(jī)器會(huì)先量側(cè)晶片厚度以此為初始值,粗磨厚度及最終厚度(即細(xì)磨要求的厚度).,.,19,Spindle1粗磨,spindle2細(xì)磨,清洗區(qū),離心除水,離心除水,背面朝上,Wafer,研磨時(shí)晶圓與SPINDLE轉(zhuǎn)向,2.Grinding相關(guān)材料ATAPE麥拉BGinding砂輪CWAFERCASSETTLE,.,21,工藝對(duì)TAPE麥拉的要求：,1。MOUNTNodelaminationSTRONG2。SAWADHESI

5、ONNodieflyingoffNodiecrack,.,22,工藝對(duì)麥拉的要求：,3。EXPANDINGTAPEDiedistanceELONGATIONUniformity4。PICKINGUPWEAKADHESIONNocontamination,.,23,TAPE種類:a.ADWILLD-575UV膠膜(黏晶片膠膜白色)厚度150UMb.ADWILL-295黏晶片膠膜黑色厚度120UMc.ADWILLS-200熱封式膠帶(去膠膜膠帶)白色厚度d.FURUKAWAUC-353EP-110AP(PRE-CUT)UV膠膜白色厚度110ume.FURUKAWAUC-353EP-110AUV膠膜

6、白色厚110umf.FURUKAWAUC-353EP-110BPUVTAPE白色厚110um.g.ADWILLG16P370黑色厚80UM.h.NITTO224SP75UM,3.Grinding輔助設(shè)備AWaferThicknessMeasurement厚度測(cè)量?jī)x一般有接觸式和非接觸式光學(xué)測(cè)量?jī)x兩種；BWaferroughnessMeasurement粗糙度測(cè)量?jī)x主要為光學(xué)反射式粗糙度測(cè)量方式；,4.Grinding配套設(shè)備ATaping貼膜機(jī)BDetaping揭膜機(jī)CWaferMounter貼膜機(jī),.,26,Taping需確認(rèn)wafer是否有破片或污染或者有氣泡等等現(xiàn)象.特別是VOID；上膠

7、膜後容易發(fā)生的defect為龜裂或破片；,切割,正面上膠,上膠,電腦偵測(cè)方向,取出,背面朝下,.,27,Detaping,.,28,lWafermount,Waferframe,晶圓切割(Dicing),1.Dicing設(shè)備介紹ADISCO641/651系列BACCERTECH東京精密200T/300T,.,30,MainSectionsIntroduction,CuttingArea:Spindles(Blade,Flange,CarbonBrush),CuttingTable,Axes(X,Y1,Y2,Z1,Z2,Theta),OPCLoaderUnits:Spinner,Elevator

8、,Cassette,RotationArm,.,31,BladeClose-View,Blade,CuttingWaterNozzle,CoolingWaterNozzle,.,32,Twin-SpindleStructure,Rear,Front,X-axisspeed:upto600mm/sCuttingspeed:upto80mm/s,.,33,AFewConcepts,BBD(BladeBrokenDetector)Cutter-set:ContactandOpticalPrecisionInspectionUp-CutandDown-CutCut-inandCut-remain,晶圓

9、切割(Dicing),2.Dicing相關(guān)工藝ADieChipping芯片崩角BDieCorrosive芯片腐蝕CDieFlying芯片飛片,.,35,Wmax,Wmin,Lmax,DDY,DY,規(guī)格DY0.008mmWmax0.070mmWmin0.8*刀厚Lmax1000,490/1004,8,1180o,8o,OrganicContaminationvsContactAngle,WaterDrop,Chip,Chip,塑封(Molding),Molding設(shè)備介紹ATOWAY1-SERIESBASAONEGA3.8,.,116,TowaAutoMoldTraining,機(jī)器上指示燈的說(shuō)明：1、綠燈機(jī)器處于正常工作狀態(tài)；2、黃燈機(jī)器在自動(dòng)運(yùn)行過(guò)程中出現(xiàn)了報(bào)警提示，但機(jī)器不會(huì)立即停機(jī)；3、紅燈機(jī)器在自動(dòng)運(yùn)行過(guò)程中出現(xiàn)了故障，會(huì)立即停機(jī)，需要馬上處理。,機(jī)器結(jié)構(gòu)了解正面,.,117,TowaAutoMoldTraining,機(jī)器結(jié)構(gòu)了解背面,CULLBOX用來(lái)裝切下來(lái)的料餅；OUTMG用來(lái)裝封裝好的L/F；配電柜用來(lái)安裝整個(gè)模機(jī)的電源和PLC，以及伺服電機(jī)的SERVOPACK。,.,118,TowaAutoMoldTraining,模具介紹：,型腔,注塑孔,膠道,模具是由硬而脆的鋼材加工而成的。所有的清潔模具的工具必須為銅制品，以免對(duì)模具表面產(chǎn)生損傷。嚴(yán)禁使用鎢鋼筆、cull等