1、altiumdesigncb設(shè)計規(guī)則中英對照電氣規(guī)則(電氣規(guī)則)Clearance :安全螺距規(guī)則短circuit :短路規(guī)則UnRoutedNet :未布線的網(wǎng)絡(luò)規(guī)則未連接管腳：未連接管腳規(guī)則路由選擇規(guī)則Width :行駛寬度規(guī)則路由拓?fù)洌壕€性拓?fù)涞牟季忠?guī)則路由優(yōu)先級規(guī)則路由層：布線基板層的布線規(guī)則路由角規(guī)則：線角規(guī)則RoutingViaStyle :布線通孔形式規(guī)則FanoutControl :布線扇出控制規(guī)則差分對布線規(guī)則。差分對布線規(guī)則SMT (表貼填充規(guī)則)SMDToCorner:SMD焊盤和引線角的最小間距規(guī)則SMDToPlane:SMD焊盤和電源層通孔的最小間距規(guī)則SMDNeck

2、Down:SMD墊頭收縮率規(guī)則Mask (阻焊規(guī)則)SolderMaskExpansion :阻焊劑層的收縮量規(guī)則PasteMaskExpansion :焊層收縮量規(guī)則Plane (電源層規(guī)則)PowerPlaneConnectStyle :電源層連接類型規(guī)則電源平面間隙：電源層的安全間距規(guī)則PolygonConnectStyle :焊盤和霸銅的連接類型規(guī)則測試點規(guī)則測試點樣式：點樣式規(guī)則的測試測試點使用規(guī)則：測試點使用規(guī)則制造(工業(yè)規(guī)則)最小直徑：焊盤的銅環(huán)最小寬度規(guī)則，防止焊盤脫落。AcuteAngle :銳角約束規(guī)則HoleSize :開口限制規(guī)則層對：配對層設(shè)定規(guī)則。 設(shè)定所有鉆頭電氣

3、符號(焊盤和通孔)的起始層和結(jié)束層。HoleToHoleClearance :孔的間隔minimalsoldermaskusliver:最小阻焊層裂紋silkscreenovocomponenttpads :絲綢打印和組件板之間的間隔規(guī)則SilkToSilkClearance :絲綢印刷間隔規(guī)則NetAntennae :網(wǎng)絡(luò)天線規(guī)則高速(高頻電路規(guī)則)平行段：平行銅膜段的節(jié)距限制規(guī)則Length :網(wǎng)絡(luò)長度限制規(guī)則MatchedNetLengths :網(wǎng)絡(luò)長度匹配規(guī)則DaisyChainStubLength :菊狀配線分支長度限制規(guī)則ViasUnderSMD:SMD焊盤下通孔限制規(guī)則最大通道數(shù)

4、限制規(guī)則放置(元件放置規(guī)則)RoomDefinition :組件集定義規(guī)則ComponentClearance :元件間隔約束規(guī)則組件定向：元件的放置方向規(guī)則。PermittedLayers :允許您為元件設(shè)置板層規(guī)則NetsToIgnore :網(wǎng)絡(luò)忽略規(guī)則高度規(guī)則信號完整性規(guī)則信號規(guī)則：激勵信號規(guī)則Undershoot-FallingEdge :負(fù)下沖過沖限制規(guī)則Undershoot-RisingEdge :正下方過沖量限制規(guī)則Impedance :阻抗限制規(guī)則信號值：高電平信號規(guī)則signallbasevervalue :低電平信號規(guī)則FlightTime-RisingEdge :上升飛行時間規(guī)則FlightTime-FallingEdge :降落飛行時間規(guī)則