1、A,1,WIRE BOND PROCESS INTRODUCTION,A,2,CONTENTS,ASSEMBLY FLOW OF PLASTIC IC Wire Bond 原理 M/C Introduction Wire Bond Process Material SPEC Calculator DEFECT,A,3,封裝簡(jiǎn)介,晶片Die,金線 Gold Wire,導(dǎo)線架 Lead fram,A,4,Wafer Grinding,Die Bonding,Wafer Saw,toaster,Wire Bonding,Die Surface Coating,Molding,Laser Mark,S

2、older Ball Placement,Singulation,Packing,封裝流程,Dejunk TRIM,Solder Plating,Solder Plating,Dejunk TRIM,TRIM/ FORMING,BGA,SURFACE MOUNTPKG,THROUGH HOLE PKG,A,5,Wire Bond 原理,pad,lead,Gold wire,Ball Bond ( 1st Bond ),Wedge Bond ( 2nd Bond ),A,6,Al,B.PRINCIPLE,A,7,銲接條件,HARD WELDING Pressure (Force) Amplify

3、 或著一個(gè)Die上出現(xiàn)不同Pad大小那就是以?xún)蓚€(gè)Pad中心距離為BPP,但是一般我們要取一個(gè)Die上最小的BPP,Bond Pad Pitch,Bond Pad Open,Bond Pad Open,A,73,Ball Size,Ball Thickness,Ball Size Ball Size = y; Area = (y/2) x/(y/2) = z g/mil,A,77,C,Ball bond,Test specimen,Specimen clamp,Shearing ram,Wire,Bond shoulder,Interfacial contactball bond weld ar

4、ea,Bonding pad,h,(A) Unsheared,C,L,C,Ball bond,C,L,Test specimen,Specimen clamp,Bonding pad,Full ball attached towire-except for regionsof intermetallic voiding,Ball separated at bonding pad-Ball interface-residual intermetallic(and sometimes portion of unalloyedball and metal) on pad in bondinterac

5、tion area,(D) Ball bond-bonding pad interface separation (typical Au to Al),C,Test specimen,Specimen clamp,Shearing ram,Wire,Minor fragment of ballattached to wire,Bonding pad,C,L,Ball sheared too high(off line, etc.)only aportion of shoulder andball top removed,Interfacial contactball bond weld are

6、a,(B) Wire (ball top and/or side) shear,C,Ball bond,C,L,Test specimen,Specimen clamp,Bonding pad,Major portionof ball attached to wire,Interfacial contact-ball bond weld areaintact,(C) Below center line shear, ball sheared through (typically Au to Au),C,Ball bond,C,L,Test specimen,Specimen clamp,Bon

7、ding pad,Pad metallizationseparates fromunderlying surface,Residual pad on ballball-pad interfaceremains intact,(E) Bond pad lifts,Test specimen,Specimen clamp,C,Ball bond,C,L,Bonding pad,Bonding pad lifts,taking portion of underlyingsubstrate material with it,(F) Cratering,Residual pad and substrat

8、e attachedto ball,ball-pad interface remainsintact,Shear Failure Modes,A,78,Crater Test,A,79,Calculate (I),UP Time =,(Total Actual Production Times Total Repair Time ),Total Actual Production Time,DOWN TIME RATE=,Total Repair Time,Total Actual Production Times,Total Operator Actual Repair Time,Total

9、 Operator Repair Frequency Stoppages,Total Actual Production Times Total Operator Repair Time,Total Operator Repair Frequency Stoppages,Total Technical Actual Repair Times,Total Technical Repair Frequency Stoppages,MTTS (MEAN TIME TO STOP ) =,MTBS (MEAN TIME BETWEEN STOP)=,MTTA (MEAN TIME TO ASSISTA

10、NCE ) =,A,80,Calculate (II),MTBA (Mean Time Between Assistance) =,Total Actual Production Times Total Technican Repair Times,Total Technical Repair Frequency Stoppages,MTBF(Mean Time Between Failure)=,Total Actual Production Times Total Technician Repair Time,Total Change Parts Repair Frequency Stop

11、page,規(guī)格寬度,製程寬度,規(guī)格上限 - 規(guī)格下限,6 ( 公差),(上限 or 下限 ) - 平均值,三個(gè)公差,CP ( 製程能力指標(biāo)) =,CPK =,=,A,81,Quality,正常品 Material Problem 1st Bond issue (Peeling , Ball Lift , Off Center) 2nd Bond issue (滑針，縫點(diǎn)脫，short tail ) Looping Fail (wire snake wire，sweep wire loop base bent ),A,82,正常品,A,83,Material Problem,A,84,With

12、Ball,Wire,Pad Size,Missing Ball,Wire Broken,Bonding Ball Inspection,Ball Detection,A,85,Ball Size,Pad Center,Ball Center,Ball Placement (X,Y),Ball Off Pad,Bonding Ball Inspection (cont.),Ball Measurement,A,86,Peeling,1st Bond Fail ( I ),A,87,Ball Lift,1st Bond Fail (II),Ball Lift,A,88,Neck Crack,1st Bond Fail ( III ),A,89,Off Center,1st Bond Fail (IV),Off Center Ball,A,90,1st Bond Fail (V),Smash Ball,Smash Ball,A,91,With Weld,Wire,Capillary Mark,Missing Weld,Wire Broken,Lead,Bonding Weld Inspection,Weld Detection,A,92,2nd Bond Fail (