1、PC端用詞匯中英文對(duì)照所屬目錄：PC眼術(shù)資訊發(fā)布時(shí)間：2007-08-14A/W(artwork)底片Ablation燒溶(laser),切除abrade粗化abrasionresistance而寸磨性absorption吸收ACC(accept)允收acceleratedcorrosiontest力口速腐蝕acceleratedtest力口速試驗(yàn)acceleration速化反響accelerator力口速齊acceptable允收activator活化液activeworkinprocess實(shí)際在制品adhesion附著力adhesivemethod黏著法airinclusion氣泡airk

2、nife風(fēng)刀amorphouschange不定形的改變amount總量amylnitrite硝基戊烷analyzer分析儀anneal回火annularring環(huán)狀墊圈；孔環(huán)anodeslime(sludge)陽(yáng)極泥anodizing陽(yáng)極處理AOI(automaticopticalinspection)自動(dòng)：光學(xué)檢測(cè)applicabledocuments弓I用之文件AQLsampling允收水準(zhǔn)抽樣aqueousphotoresist液態(tài)光阻aspectratio縱橫比(厚寬比)Asreceived到貨時(shí)backlighting背光back-up墊板bankedworkinprocess預(yù)留在

3、制品basematerial基材baselineperformance基準(zhǔn)績(jī)效batch批betabackscattering貝他射線照射法beveling切斜邊;斜邊biaxialdeformation二方向之變形black-oxide黑化blankcontroller空白對(duì)照組blankpanel空板blanking挖空blip彈開(kāi)blister氣泡；起泡blistering氣泡blowhole吹孔board-thicknesserror板厚錯(cuò)誤bondingplies黏結(jié)層bow;bowing板彎breakout從平環(huán)內(nèi)破出bridging搭橋;橋接BTO(BuildToOrder)接單

4、生產(chǎn)burning燒焦burr毛邊(毛頭)camcorder一體型攝錄放機(jī)carbide碳化物carlsonpin定位梢carrier載運(yùn)劑catalyzing催化catholicsputtering陰極濺射法caulplate隔板；鋼板calibrationsystemrequirements校驗(yàn)系統(tǒng)之各種要求centerbeammethod中央光束法centralprojection集中式投射線certification認(rèn)證chamfer倒角金手指chamfering切斜邊;倒角characteristicimpedance特性阻抗chargetransferoverpotential電量

5、傳遞過(guò)電壓chase網(wǎng)框checkboard棋盤(pán)chelator螯合劑chemicalbond化學(xué)鍵chemicalvapordeposition化學(xué)蒸著鍍circumferentialvoid圓周性之孔破cladmetal包夾金屬cleanroom無(wú)塵室clearance間隙coat鍍外表coatingerror防焊覆蓋錯(cuò)誤coefficientofthermalexpansion(CTE)熱澎脹系數(shù)coldsolderjoint冷焊點(diǎn)cold-weld金屬粉末冷焊color顏色colorerror顏色錯(cuò)誤compensation補(bǔ)償competitiveperformance競(jìng)爭(zhēng)力績(jī)效co

6、mplexsalt絡(luò)化物complexor絡(luò)化物componenthole零件孔componentside零件面concentric同心conformance密貼性consumerproducts消費(fèi)性產(chǎn)品contactresistance接觸電阻continuousperformance連續(xù)發(fā)揮效能contractservice協(xié)力廠controlledsplit均裂式conventionalflow舌1流方式conventionaltensiletest傳統(tǒng)張力測(cè)試法conversioncoating轉(zhuǎn)化層convex突出coordinatelist數(shù)據(jù)清單coppercladedlami

7、nates(CCL)銅箔基板copperexposure線路露銅coppermirror鏡銅copperpad銅箔圓配copperresidue(coppersplash)銅渣c(diǎn)orrosionratenumbering腐蝕速率計(jì)數(shù)系統(tǒng)corrosionresistance抗蝕性coulombslaw庫(kù)倫定律countersink喇叭孔coupon試樣couponlocation試樣點(diǎn)coveringpower遮蓋力CPU中央處理器crack破裂；裂痕crazing裂痕；白斑crosslinking交聯(lián)聚合crosstalk照應(yīng)作用crosslinking交聯(lián)crystalcollection

8、結(jié)晶收集curing聚合體currentefficiency電流效率cut-outs挖空cutting裁板cyanide氟化物cyclesoflearning學(xué)習(xí)循環(huán)cycle-timereduction交期縮短datecode周期deburring去毛頭dedicated專(zhuān)用型degradation退變delamination分層dent/pinhole凹陷/針孔departmentofdefense國(guó)防部designation字碼簡(jiǎn)示法de-smear除膠渣developing顯影dewetting縮錫dewettingtime縮錫時(shí)間dimensionerror外形尺寸錯(cuò)誤dielect

9、ricconstant介質(zhì)常數(shù)difficulty困難度difunctional雙功能dimension尺寸dimensionstability尺寸安定性dimensionalstability尺度安定性dimensionandtolerance尺寸與公差dirtyhole孔內(nèi)異物discolorhole孔黑；孔灰；氧化discoloration變色disposableeyeletmethod消耗性怫車(chē)丁法distortionfactor尺寸變形函數(shù)doubleside雙面板downtime停機(jī)時(shí)間drill鉆孔dr川bit鉆頭dr川facet鉆尖切前面dr川pointer鉆尖重研磨機(jī)dril

10、ledblankboard已鉆孔之裸板drilling鉆孔dryfilm干膜ductility延展性economyofscale經(jīng)濟(jì)規(guī)模edgespacing板邊空地edge-boardcontact(goldfinger)金手指efficiency能量效率electrictest電測(cè)electricaltesting電測(cè);測(cè)試electrochemicalmachineECM電化學(xué)加工法electrochemicalreactor電化學(xué)反響器electroforming電鑄electrolessplate化學(xué)銅electroless-deposition無(wú)電鍍electropolishing

11、電解拋光electrorefining電解精煉electrowinning電解萃取ellipticalset橢圓形embrittlement脆性entitlementperformance可達(dá)成績(jī)效entrapment電鍍夾雜物epoxy環(huán)氧樹(shù)酯equipotential電位線errordatafile異常t青形etchrate蝕銅速率etchants蝕刻液etchback回蝕evaluationprogram評(píng)估用程序exposure曝光externalpinmethod夕卜部插梢法eyelethole怫車(chē)丁孑LEyeletting怫眼fabric網(wǎng)布failure故障fastrespons

12、e快速響應(yīng)fault瑕疵；缺陷fiberexposure纖維顯露fiberprotrusion纖維突出fiducialmark光學(xué)點(diǎn),基準(zhǔn)記號(hào)filler填充料film底片filtration過(guò)濾finishedboard成品fixing固著fixture電測(cè)夾具治具flakingoff粹離flammabilityrating燃性等級(jí)flare喇叭形孔flatcable并排電纜feedbackloop回饋循環(huán)first-in-first-out(FIFO)先進(jìn)先出flexiblemanufacturingsystem(FMS)彈性制造系統(tǒng)flux助焊劑foildistortion銅層變形fol

13、d空泡foreigninclude異物foreignmaterial基材內(nèi)異物freeradicalchainpolymerization自由基連鎖聚合fullyadditive加成法fullyannealedtype徹底回火物化之類(lèi)形function函數(shù)fundamentalandbasic根本fungusresistance抗霉性funnelflange喇叭形折翼galvanized加法尼化制程gap鉆尖分開(kāi)gaugelength有效長(zhǎng)度geltime膠化時(shí)間generalresistink一般阻劑油墨general通論generalindustrial一般性(電子)工業(yè)級(jí)geometri

14、callevelling幾何平整glasstransitiontemperature(Tg)玻璃態(tài)轉(zhuǎn)換溫度Gold金goldfinger金手指goldplating鍍金goldenboard標(biāo)準(zhǔn)板gouges刷磨凹溝gouging挖破grainboundary金屬晶體之四邊green綠色grip夾頭groundplane接地層groundplaneclearance接地空環(huán)hackers駭客HAL(hotairleveling)噴錫haloing白邊；白圈hardener硬化齊1Jhardness硬度hepafilter空氣濾清器highperformanceindustrial高性能(電子)

15、工業(yè)級(jí)highreliability高可靠度highresolution高分辨率hightemperatureelongation(HTE)高溫延展性銅箔h(huán)ightemperatureepoxy(HTE)高溫樹(shù)酯hit擊holecounter數(shù)孔機(jī)holediameter孔徑holediametererror孑L徑錯(cuò)誤holelocation孔位holenumber孔數(shù)holewallquality孔壁品質(zhì)hook外弧hotdip熱浸法hullcell哈氏槽hybrid混成集成電路hydrogenbonding氫鍵hydrolysis水解hydrometallurgy濕法冶金法imageana

16、lysissystem影像分析系統(tǒng)imagetransfer影像轉(zhuǎn)移immersiongold浸金化鍥金immersionplating浸鍍法impedance阻抗infraredreflow紅外線重熔inhibitor熱聚合抑制劑injectionmold射模ink油墨innerlayer&outlayer內(nèi)外層insulationresistance絕緣電阻intendedposition應(yīng)該在的位置intensifier增強(qiáng)器intensity強(qiáng)度intermolecularexchange交互改變interconnection互相連通ioniccontaminants離子性污染物ion

17、iccontaminationtesting離子污染試驗(yàn)IPA異丙醇5I:inspiration啟蒙identification確認(rèn)方案目標(biāo)implementation改善方案information數(shù)據(jù)internalization制度化invisibleinventory無(wú)形的庫(kù)存knifeedges刀緣Knoop努普硬度單位kraftpaper牛皮名氏laminarflow層流laminate基層板laminating壓合lamination壓合laminator壓膜機(jī)land焊墊layback刃角磨損layup組合疊板layout布線;布局leadscrew牽弓I螺絲leakage漏電l

18、earningcurve學(xué)習(xí)曲線legend文字標(biāo)記leveling平整levellingadditive平整潔levellingpower平整力lifesupport維系生命limitingcurrent極限電流linespace線距l(xiāng)inewidth線寬linearvariabledifferentialtransformer(LVDL)線性可變差動(dòng)：轉(zhuǎn)換器liquid液狀(態(tài))liquidcrystalresins液晶樹(shù)月旨liquidphotoimageablesolderresistink液態(tài)感光防焊油墨liquidphotoresistink液態(tài)光阻劑油墨lotsize批量lowe

19、rcarrier底部承載板mechanicalplating機(jī)械鍍法machinescrub刷磨清潔法macrothrowingpower巨分布力margin鉆頭刃帶marketshare市場(chǎng)占有率markingerror文字錯(cuò)誤maskedleveling偏裝平整masslamination大型壓板masstransfer質(zhì)量傳送效應(yīng)質(zhì)量傳遞過(guò)電壓masstransferoverpotentialmasstransportation質(zhì)傳masterdrawing主圖;藍(lán)圖materialusefactor材料使用率mealing泡點(diǎn)；白點(diǎn)memory記憶裝置meniscographsolde

20、rabilitymeasurement新月型焊錫效果microetch微蝕microetching微蝕microfocus微焦距microfocussystem微焦距系統(tǒng)microprofile微外表microsectioning微切片法microthrowingpower微分布力migration遷移mini-tensiletester迷你拉力測(cè)試儀misholelocation孑L位錯(cuò)誤misregistration焊錫面與零件面對(duì)位偏差misregsitration對(duì)不準(zhǔn)moistureandinsulationresistancetest濕氣與絕緣電阻試驗(yàn)moldedcircuitbo

21、ard(MCB)模制電路板monoethanalamine單乙醇氨monohydratestate水化物monomer單分子膜;單體mousebite鋸齒;蝕刻缺口msec毫秒mufflefurnace高溫焚火爐multichip超大IC型多芯片模塊mylar保護(hù)膜nailhead車(chē)丁頭NCdr川數(shù)字鉆孔機(jī)negativeetchback反回蝕negativefilm負(fù)片negativerakeangle負(fù)摳耙角network回路；網(wǎng)絡(luò)neutralization中和nick缺口nickel鍥nodule銅瘤;瘤粒noflowresin不流樹(shù)脂noise噪聲nominal標(biāo)示nominaldi

22、mension標(biāo)定長(zhǎng)度nominalgeltime標(biāo)示膠性時(shí)間nominalresincontent標(biāo)示膠含量nominalresinflow標(biāo)示膠流量nominalscaledflowthickness標(biāo)示比例流量厚度OAequip辦公室自動(dòng)：化設(shè)備obsolescencefactor報(bào)廢因素OEM原設(shè)備制造商offset-list補(bǔ)償數(shù)據(jù)清單ohmmeter歐姆計(jì)open斷路opencircuits斷路openshorttesting斷短路測(cè)試opening開(kāi)口originalartwork(A/W)原稿底片Others其它outgrowth增出overdesign牛刀殺雞overlap鉆

23、尖重疊overlayentry蓋板overpotential過(guò)電壓oxidation氧化oxidetreatment黑化處理oxidedcytochrome氧化性之細(xì)包色素oxygenevolution氧氣發(fā)生反響packedbed充填床式pad錫墊;圓配padcopperexposurepad露銅panel小型板面；母板panelplating一次銅電鍍parasitic寄生的partno.料號(hào)patternplating二次銅電鍍PCBprintcircuitboardER刷電路板pcs片peelstrength抗撕強(qiáng)度peelingoff剝離剝落performancespecificat

24、ion性能標(biāo)準(zhǔn)permittivity透電率perspectivesonexperience經(jīng)驗(yàn)透視PET聚酯photodiodedetector發(fā)光二極管偵測(cè)器photoinitiator感光啟始劑photoresist光阻phototool光具指工作底片piece子板面pincetonappliedresearch腐蝕測(cè)定儀pinkring粉紅匿pit凹點(diǎn)pitch腳距planar平面plating電鍍platingexposure下鍍層露出pluggauge插規(guī)plughole孔塞PNL(panel)排板polar-polarinteraction極性之間的吸力polyester聚酯類(lèi)p

25、olyglycols聚乙二醇polyimide聚亞醯氨poorbevelling磨邊加工引起突起,剝離poordr川孔形不良poorHAL噴錫不良poormarking字體不良poorpad錫墊不良poorprintedER刷偏差poorsolderability焊錫性不良poortouch-up補(bǔ)線不良positioncontrolsystem位置限制系統(tǒng)positiverakeangle正摳耙角powercurvemodel幕次曲線模式practice工藝慣例preferred良好prematuretearing提前撕裂prepolymer預(yù)聚合物prepreg膠片pre-process(

26、front-end)制前press壓床presscycle壓合周期primarycurrentdistribution一次電流分布primary主要productlifetimes生命周期productprocess制程promoter促進(jìn)劑protocal初步資料prussicacid普魯土酸PTF-basedprocess厚膜糊法PTH(platingthoughhole)導(dǎo)通孔pullaway拉開(kāi)pumice浮石粉pumicescrub噴砂清潔法pyrometallurgy火燒法冶煉QC(qualitycontrol)品管QFP(quadflatpack)扁方型封裝體qualificat

27、ioninspection資格審查檢驗(yàn)qualificationtesting資格檢定qualityclassification品質(zhì)等級(jí)quantitative計(jì)量式測(cè)試rack掛架radiometer能量劑rakeangle摳耙角RAMRandomAccessMemory隨機(jī)存取內(nèi)存realtime關(guān)鍵時(shí)刻recessedtraceprocess凹槽線路法recoverytank回收槽reduction復(fù)原re-eninforcement強(qiáng)化refraction折光率reinforcementstyle補(bǔ)強(qiáng)材料的型式registermark對(duì)位用標(biāo)記registrationhole對(duì)位孑Lr

28、egistrationpattern長(zhǎng)方形銅地REJ(reject)退貨；拒收rejectable拒收releaseagent脫模齊reliefangle浮離角remark備注repair修理resincontent樹(shù)脂含量(膠含量)resinflow膠流量resinflowpercentage樹(shù)月旨流量之百分率resinrecession樹(shù)月旨下陷resinsmear膠渣resiststrippers錄U干膜齊resistornetwork排列電阻resolution解像度returnonassets資產(chǎn)報(bào)酬率reversibility可逆性rework重工rosin天然松香rotating

29、cylinder旋轉(zhuǎn)圓柱形roughtness孔壁粗糙；粗情routing切外形,成型routingbit銃刀runout偏轉(zhuǎn)S/Lonhole孔內(nèi)沾文字S/M(soldermask),S/L防焊文字S/M(soldermask)防焊S/Merror防焊種類(lèi)錯(cuò)誤S/Monhole孔內(nèi)綠漆saltspraytest鹽水噴霧試驗(yàn)samplingsize抽樣數(shù)scope范圍scored亥U痕scoring樞槽;刮線scrap廢框scratches舌U傷screenprinting網(wǎng)版印刷scum透明殘膜sealing封孔處理secondary次要semi-additive半力口成法sensitize

30、敏化sensitizer敏化液separator鋼隔板sequentiallamination漸成式壓法serratededges毛邊shatter破碎short短路shunt分路silanetreatment硅烷處理siliconecouplingagent硅烷偶合劑silkscreen文字ER刷simulator仿真器singleaxis單軸sizing底片之伸縮補(bǔ)償skip漏印skipprinting跳印;漏印sliver絲條slot開(kāi)槽slotting開(kāi)槽SMD(surfacemountdevice)外表黏著組件smear膠渣SMT(surfacemounttechnology)外表黏

31、著技術(shù)sodiumcarbonatemonohydrate結(jié)晶水碳酸鈉softtooling軟性工具solder焊錫；錫鉛solderbridge錫橋solderbump錫突solderfloat漂錫soldermaskadhesion綠漆附著力solderonG/F金手指沾錫solderontrace線路沾錫solderplug錫塞solderside焊錫面solderability焊錫性solidcarbide實(shí)質(zhì)碳化物spacing間距spacingnonenough間距缺乏SPC(StatisticalProcessControl)統(tǒng)計(jì)生管specification標(biāo)準(zhǔn)specialc

32、onsiderations特另U考慮spincoating旋轉(zhuǎn)涂布spindle鉆軸spiralcontractometer螺旋收縮儀spotface銃靶spraycoating噴涂Squeegee舌U刀stackingstructure疊板結(jié)構(gòu)stamping沖壓standardhydrauliclamination標(biāo)準(zhǔn)液壓法standardizing標(biāo)準(zhǔn)化starvation缺膠steptablet格片數(shù)stockoption認(rèn)股選擇權(quán)strain應(yīng)度strength強(qiáng)度stressmeter應(yīng)力計(jì)subtractive減除法surfaceconvex外表突起surfaceexaminat

33、ion外表檢查surfaceinsulationresistance(SIR)外表絕緣電阻surfacemount外表黏著方式surfaceroughness外表粗情度surges突波switchcircuit開(kāi)關(guān)線路tab金手指tackfree不黏tapedholegauge錐形孔規(guī)targethole靶孑Ltaskforce任務(wù)編組tensilestrength抗拉強(qiáng)度tensilestress張性應(yīng)力tent浮蓋termsanddefinitions術(shù)語(yǔ)與定義terminationload抗匹酉己負(fù)載testcircuit測(cè)試線路testmethod試驗(yàn)方法testpoint測(cè)試點(diǎn)thermalshock熱震蕩試驗(yàn)thermalstress熱應(yīng)力試驗(yàn)thermistor熱電感應(yīng)式t