HDS服務(wù)器產(chǎn)品技術(shù)回顧及市場定位HITACHI刀片服務(wù)器概述創(chuàng)新研發(fā)和領(lǐng)導(dǎo)者質(zhì)量和可靠性服務(wù)和支持

擁有50年以上傳統(tǒng)的企業(yè)計算市場領(lǐng)導(dǎo)者HITACHI服務(wù)器市場情況介紹(*)Reference:IDCJapan“CY2012ResearchforJapanesex86servervendor’ssupport”

IDC#J12220104

2012.3在日本市場的出色表現(xiàn)22%的市場份額2004年發(fā)布以來超過50,000臺的銷量日本市場外的快速增長13.5%的年增長率vs.

3.5%的行業(yè)平均增長率迅速發(fā)展的全球增長和廣泛的行業(yè)覆蓋最高級別的可靠性Hitachi質(zhì)量–為支持關(guān)鍵業(yè)務(wù)系統(tǒng)而設(shè)計-大量的RAS

功能-

高可靠性背板Hitachi分區(qū)管理特點

Linux高可用選項

N+M冷備模式高可靠性平臺High-reliabilitybackplaneNoelectroniccomponentssuchascondensersandICsareused.StrictqualitystandardsandQAprocess從2004年至今的0宕機記錄

日本制造的質(zhì)量保證5HitachiservershavethelowestproblemoccurrenceandhighestsatisfactionratesamongX86vendorsProblemsatInstallationProblemsafter1WeekReference:IDCJapan“CY2012ResearchforJapanesex86servervendor’ssupport”

IDC#J12220104

2012.3Note:Problemoccurrencerateincludestheproblemsofhardware,OS,drivers,applicationandinteroperability.可靠性證明BETTERBETTERRACKMOUNTHDS全系列服務(wù)器一覽BLADESYSTEMS優(yōu)化的橫向擴展平臺虛擬化平臺的適合之選.CB500優(yōu)化的縱向擴展平臺–巨大的帶寬以及CPU核數(shù).從UNIX向x86遷移的最佳平臺，另外比較大規(guī)模的應(yīng)用.CB2000主要用于需要額外的網(wǎng)絡(luò)連接的架構(gòu)服務(wù)器（例如：管理/備份/防火墻/DMZ服務(wù)器)CR210典型應(yīng)用主要針對的是用戶需要大硬盤服務(wù)器(例如.HadoopHDFSnodes)CR220HDS刀片服務(wù)器產(chǎn)品家族

關(guān)鍵業(yè)務(wù)計算平臺高性能及高擴展性

(高可用性,故障隔離)

云計算平臺服務(wù)器虛擬化

(資源共享

事務(wù)性能)CB2000高擴展性,高可用性和高效率最大8個處理器高IO擴展能力滿足關(guān)鍵任務(wù)需求可熱插拔的組件物理和虛擬服務(wù)器整合的性能和功能，是云基礎(chǔ)設(shè)施最佳選擇CB500大內(nèi)存容量1.5TB/4CPU高IO帶寬及端口共享能力靈活的虛擬化環(huán)境內(nèi)置的硬件虛擬化功能HDS高性能刀片服務(wù)器CB2000簡介基于模塊化的架構(gòu)設(shè)計提供高靈活性19”標準機柜最大配置8個刀片服務(wù)器10U刀箱高度無源Mid-planeHDS刀片服務(wù)器CB2000簡介企業(yè)級性能IntelXeon5600/7500/E7-8800系列CPU增強的I/O處理能力關(guān)鍵業(yè)務(wù)高IO吞吐能力內(nèi)置的LPAR邏輯分區(qū)功能企業(yè)級擴展性單刀片1~2

WayCPU單CPU支持2,4,6,8,10,12核單機柜支持8個刀片單SMP處理節(jié)點支持80核和3TB內(nèi)存企業(yè)級可靠性全冗余設(shè)計背板和IO高可靠性設(shè)計可熱插拔

組件設(shè)計N+M主備模式企業(yè)級

靈活性Intel

Xeon,Windows?,Linux?單刀箱192core處理能力單刀箱16個獨立PCI-eI/O插槽PCIe擴展單元，單刀片可擴展到16個PCI-eIO插槽CB2000配置介紹FeatureCB2000ComputeBladesAX55-R3BladeAX55-S3BladeAX55-R4BladeMPX57-A2(SMPMode)Sockets1-2222-8CPUXeonE5-2600XeonE5-2600XeonE5-2600v2XeonE7-8800Cores4-168-168-2420-80DIMMSlots24242432,64,128MaxMemory512GB(2-socket)1024GB(2-socket)1536GB(2-socket)

(using64GBLRDIMMs)758GB(2-socket)1.5TB(4-socket,SMP)

3.0TB(8-socket,SMP)LPARSupport60606060PCIe/MezzanineSlots2/22/22/22/2,4/4,8/8HotPlugSASDisks4-4-Internal1GbEPorts2222,4,8CB2000服務(wù)器針對傳統(tǒng)刀片服務(wù)器的提升刀片服務(wù)器機架式服務(wù)器UNIX服務(wù)器/Mainframes優(yōu)勢

模塊化I/O資源的整合統(tǒng)一管理

I/O吞吐量I/O多樣性(PCI插槽)CPU擴展性

內(nèi)存容量I/O吞吐量LPAR邏輯分區(qū)HDSCB2000刀片服務(wù)器刀片服務(wù)器架構(gòu)混合I/O架構(gòu)多刀片SMP節(jié)點LPAR邏輯分區(qū)I/O擴展模塊40年企業(yè)級計算市場的領(lǐng)導(dǎo)地位，引領(lǐng)企業(yè)級刀片服務(wù)器走向新的極致CB2000服務(wù)器——SMP多刀片聚合功能4-BladeSMP計算/內(nèi)存/IO性能平衡擴展1Blade2Blades4BladesSockets248Cores204080MemorySlots3264128MemorySize758GB1.5TB3TBMezzanineSlots248PCIeSlots2484CPUSMP計算節(jié)點——Nehalem-EXQPI互聯(lián)技術(shù)SMP內(nèi)存擴展單個刀片節(jié)點:758GB2刀片SMP:

1.5TBB4刀片SMP:>3TBSMP

IO擴展

PCIe2.0x8lanes:8slots/2blades16slots/4bladesSMPCPU擴展單個刀片:2路CPU2刀片SMP:4路CPU4刀片SMP:8路CPUICHCPUNehalem-EXCPUNehalem-EXCPUNehalem-EXPCIeOnBoardNICICHI/OHubBoxboro-EXCPUNehalem-EXGbEGbEI/OHubBoxboro-EXPCIeMezzanineMezzanineBlade0Blade1SMP計算節(jié)點聚合架構(gòu)分析獨有SMP功能/優(yōu)于Xeon機架式服務(wù)器的IO擴展能力CB2000服務(wù)器的技術(shù)特點——LPAR邏輯分區(qū)HDS刀片服務(wù)器——LPAR邏輯分區(qū)HitachiLogicalPartitioningFeature(LPAR)更好的性能對操作系統(tǒng)透明更好的安全性內(nèi)置硬件虛擬化技術(shù):HVM通過LPAR進行服務(wù)器虛擬化提高刀片服務(wù)器利用率LPAR邏輯分區(qū)架構(gòu)分析專用模式共享模式

專用模式ModePCIPCIPartition1NICNICMemoryCPUCPU共享模式PCIPCIPCINICNICNICMemoryMemoryCPUCPUCPUPartition2Partition3內(nèi)置硬件虛擬化:HVM2GB8GB10GB35%65%LPAR#1LogicalPartitioningCPUMemI/OVirtualI/OSharedDynamicCPUAllocation#34GBCoreCoreCoreCoreDedicatedModeSharedMode6GB#4#2#5OS1OS4OS3OS2OS5DedicatedI/OShared更好的性能/對操作系統(tǒng)透明/更好的安全性

兩種LPAR邏輯分區(qū)介紹專有模式CPU的分配方式共享模式CPU的分配方式SR%TimeLPAR110025%750LPAR210025%750LPAR320050%1500Total400100%3000VNIC的分配模式LPAR邏輯分區(qū)網(wǎng)卡分配方式HBA端口的分配模式LPAR邏輯分區(qū)HBA卡配置方式可擴展的PCIe插槽

對單個刀片進行IO自定義IO模塊擴展專業(yè)的、直接的單刀片IO資源擴展快速的新技術(shù)支持集成的交換機模塊

所有刀片共享資源

減少物理連接和電纜模塊化設(shè)計提高管理能力和擴展性CB2000服務(wù)器技術(shù)特點——混合IO架構(gòu)通過混合IO模塊的設(shè)計，同時利用機架式服務(wù)器和刀片服務(wù)器的I/O設(shè)計優(yōu)勢，可以在統(tǒng)一計算平臺上進行不同應(yīng)用的IO整合業(yè)務(wù)價值

在單一平臺上同時支持通用和特殊的分層次IO負載統(tǒng)一IO資源以減少多平臺管理成本在統(tǒng)一計算平臺上整合更過應(yīng)用類型2SlotsperBlade2SlotsperBlade2SlotsperBlade2SlotsperBlade2SlotsperBlade2SlotsperBlade2SlotsperBlade2SlotsperBlade單個刀片最大支持2~16個PCIe插槽單個SMP刀片節(jié)點最大支持8~64個PCIe插槽混合IO架構(gòu)結(jié)構(gòu)分析+16PCIExpressSlots+16PCIExpressSlots4BladeSMPCPU插槽8CPU核數(shù)80內(nèi)存插槽128內(nèi)存容量1,5TB夾層卡插槽8PCIe

2.0插槽最多64個+16PCIExpressSlotsExpansion+16PCIExpressSlotsupto8PCIeLanes混合IO架構(gòu)配置方式介紹HDS刀片服務(wù)器的技術(shù)特點——N+M主備模式ActiveServerActiveServerActiveServerActiveServerActiveServerActiveServerActiveServerActiveServerActiveServerActiveServer自動化刀片故障識別和故障切換功能ActiveServerActiveServerActiveServerActiveServerActiveServerActiveServerActiveServerOSCRASHActiveServerActiveServerBackupServerBackupServerBackupServerActiveServerActiveServerActiveServerActiveServerActiveServerActiveServerActiveServerActiveServerBackupServerActiveServerActiveServerActiveServerActiveServerOSCRASHActiveServerActiveServerActiveServerFAIL-OVERFAIL-OVERN+M主備模式LPAR方式介紹HDS刀片服務(wù)器的技術(shù)特點——綠色節(jié)電減少電源消耗~1.0kW傳統(tǒng)電源模塊7%reduction~5.3kW~5.3kW~0.5kWServerpowerconsumptionConversionloss高效率電源模塊節(jié)能省電:ThinkingGREEN!行業(yè)領(lǐng)先的電源轉(zhuǎn)換效率–94%電源轉(zhuǎn)換率80PLUS白金認證最小的AC/DC轉(zhuǎn)換損失HDS刀片服務(wù)器CB500簡介高計算密度

6U高度/8個刀片/128Cores高性能支持Intel最新E5-2600系列CPU最大內(nèi)存可擴展到512GB更好的IO吞吐及網(wǎng)絡(luò)高可用性及高可靠性N+MFailover全冗余架構(gòu)及無緣背板靈活性自帶LPAR邏輯分區(qū)功能全萬兆以太網(wǎng)交換機模塊易于管理和運維HitachiComputeBlade500LCDtouchconsoleHDS刀片服務(wù)器CB500簡介企業(yè)級性能最新Intel處理器大內(nèi)存尋址空間更高的IO帶寬企業(yè)級擴展性每個機箱支持1-16個處理器插槽(128內(nèi)核)增加刀片進行刀箱內(nèi)部擴展增加刀箱進行橫向擴展企業(yè)級可靠性可熱插拔的,全冗余組件,N+M故障切換模式Mainframe級別的內(nèi)存管理及可用性企業(yè)級

靈活性內(nèi)置的LPAR邏輯分區(qū)功能提高效率和利用率內(nèi)置BrocadeVDX交換機網(wǎng)絡(luò)支持IP和FCoE滿足不同應(yīng)用負載的配置選項CB500配置簡介FEATURECB500ComputeBladesCB520AbladeCB520Hv2bladeCB540AbladeFormfactorStandardwidthStandardwidthDoublewidthSockets224cpuXeonE5-2400XeonE5-2600v2XeonE5-4600CoresMaximum16Maximum24Maximum32DIMMslots122448Maximummemory384GB(32GBDIMMs)1536GB(64GBLRDIMMs)1536GB(32GBDIMMs)LDOMsupportMaximum30Maximum30Maximum30Mezzanineslots*224InternalUSBflashYesYesYesHot-plugSASdisks222InternalLANports2x1GbE2x1/10GbE4x1/10GbECB500存儲擴展刀片Addsupto6hot-swappable2.5-inchHDD/SSDperserverbladeExternalSASportOptionalsupportforPCIeFlashCapacity:Max.5.4TBrawSASwithsix900GBSASHDDRAID0,1,10,5,6SupercapacitorforRAIDcacheprotectionDirectattachedstorageonlyFRONTVIEWCB500PCI-E擴展刀片UsedinconjunctionwithCB520HorCB520Hv2(half-width)bladeConnectionbandwidthis40PCIelanesAccommodatesupto6PCICardsand1mezzanineUpto4xlow-profileand2xfull-heightcardsBayscanbeconfiguredfordifferentslotcombinationsAccommodateupto300WPCIcardinX16slotRAID0,1,10,5,6PCIeGen3ready(InitiallyGen2)FRONTVIEWCB500MEZZANINE配置選項LANmezzanine#ofportsVendor1Gb4-port4Broadcom1Gb8-port8Broadcom10Gb4-port4EmulexFCmezzanine#ofportsVendor8Gb2-port2Hitachi8Gb4-port4Hitachi8Gb2-port2EmulexI/OmezzanineLAN+RAID

combocard#ofportsVendor1Gb4-portLAN+RAID4Broadcom1Gb8-portLAN+RAID8BroadcomCNAmezzanine#ofportsVendor10Gb4-portCNA4EmulexIO交換模塊Lineup1GbLAN-SW

module1GbLAN-SW

module(40

ports）1Gb/10Gb

LAN-SWmodule10GbDCB-SW

module1GbLANpassthroughmodule10GbLANpassthroughmodule8GbFC-SW

module*2#ofportsInter.16321616161616Exter.486

(Incl.210Gbports)816166CharacteristicsIdealforcost-savingstandardLANconfigurationIdealformulti-portLANconfigurationsrequiredinvirtualizationIdealforconfigurationsrequiringabroad-bandwidthexternalconnectionswithstandardLANsIdealforusinglatestnetworktechnologies*2suchasportpartitioningandFCoEIdealfornetworkconfigurationsusingexternalLANswitchesIdealfornetworkbroad-bandwidthconnections,whichuseexternalLANswitchesIdealforhigh-speed,high-reliabilitySANstorageconnectionsHitachiComputeBlade交換模塊*1:ThisuserequiresaCNAontheserverblade.

(ConvergedNetworkAdapter)*2:12-portmodelsareavailableaswellas22-

portmodels.Switchmoduleslots(4slotsmax.)HDS刀片服務(wù)器部署管理——多管理刀片服務(wù)器自帶管理功能WebConsole(刀片/刀箱)CLIIPKVMLCDConsole(CB500)HDS刀片服務(wù)器統(tǒng)一部署管理——HCSMHDS刀片服務(wù)器統(tǒng)一部署管理——HCSMHDS刀片服務(wù)器統(tǒng)一部署管理——HCSM部署管理N+1/N+M

冷備刀片及故障切換網(wǎng)絡(luò)管理刀片配置和管理刀片服務(wù)器性能監(jiān)控刀片服務(wù)器電源管理HDS刀片服務(wù)器統(tǒng)一部署管理——ServerConductor傳統(tǒng)刀片服務(wù)器的優(yōu)勢與局限性傳統(tǒng)刀片服務(wù)器的優(yōu)勢高密度計算環(huán)境簡化布線與管理更好的TCO傳統(tǒng)刀片服務(wù)器局限性處理能力偏低，CPU擴展性有限I/O性能以及擴展性較差不具備靈活劃分資源的虛擬化能力優(yōu)勢一:合——SMP最高計算性能及擴展能力SMP多刀片聚合唯一支持到8處理器的刀片服務(wù)器平臺(IBM可以支持類似功能，但是只能擴到4CPU)計算能力ScaleUp，并實現(xiàn)投資保護聚合以后再虛擬化提高靈活性及利用率為什么性能直線提升？HDS優(yōu)勢二：分——LPAR高性能內(nèi)置硬件虛擬化技術(shù)LPAR邏輯分區(qū)靈活進行資源分配并提高資源利用率相對于其它服務(wù)器虛擬化方案提供更好性能免費的入門級許可最大化投資回報率典型應(yīng)用場景No用途CPUMemoryHDD1生產(chǎn)機(PROD)8Core*2128G300GB*22備份機4Core*264GB300GB*23開發(fā)機(DEV)4Core*116G300GB*24測試機(QAS)4Core*116G300GB*25SolutionManager2Core*18GB300GB*4用途HDS生產(chǎn)機(PROD)1刀片備份機LPAR#1開發(fā)機(DEV)LPAR#2測試機(QAS)LPAR#3SolutionManagerLPAR#4更低投資成本減少功耗提高整合度HDS優(yōu)勢三：混——高速IO模塊及擴展能力PCIeIO擴展能力4刀片SMP本刀箱可以支持>8TB高速IO模塊4刀片SMP通過IO擴展單元可以支持>64TB高速IO模塊提高>1,500,000IOPS的IO性能典型應(yīng)用場景HDS優(yōu)勢四：跨刀箱的N+M高可用技術(shù)N+M高可用技術(shù)減少停機時間及運維成本相對于OS/應(yīng)用集群技術(shù)更高的投資回報率更少的硬件成本，例如:20+1主備不需要集群軟件成本，例如:RAC許可更少的部署和管理成本O/S等級的集群技術(shù)Win2008server故障轉(zhuǎn)移集群(FailoverCluster)Win2008server網(wǎng)絡(luò)負載均衡（NLB)Redhat企業(yè)集群解決方案(RHCS)SUSEEnterpriseHAextension數(shù)據(jù)庫等級的HA解決方案SQL2008故障轉(zhuǎn)移SQL2008數(shù)據(jù)庫鏡像OracleRealApplicationCluster(RAC)更高的硬件成本一般集群都為1+1的模式，意味著1個主機就要配置1個備機更高的軟件成本軟件的支持（OS集群軟件、應(yīng)用軟件集群）更高的管理和運維成本復(fù)雜的設(shè)計和配置專業(yè)的培訓Hitachi機架服務(wù)器CR210HCompactandflexibleserverplatformtosatisfyavarietyofsolutionworkloadandconnectivityneedsIndustryleadingperformancefromthelatestIntelXeonprocessorsHighavailabilityfeaturesforthedatacenter,suchasredundantpowerandcooling,hot-swapHDDs,andintegratedmanagementOptimizedprice\performanceforapplicationsolutionsandclouddeployments.HitachiComputeRACK210HComputeRack210H參數(shù)表Formfactor1URackProcessorFamilyIntel?Xeon?E5-2600seriesprocessorsupto8coresNumberofprocessors(std/max)1/2MemoryUpto384GBvia24slotsDiskbaysSix2.5"harddiskdrivesRAIDsupportRAID-0,-1,-5,-6,-10,JBODRAIDCacheOptions6GbpsSASController512MBcachewithoutcacheprotection6GbpsSASController1GBcachewithcacheprotection(SuperCap)DVD-ROMDVD-ROM8xHot-swapcomponentsPowersupplies

andharddiskdrivesNetworkinterfaceDualPort1GbEBroadcomBCM5718embeddedcontrollerNetworkExpansionOptionsDualPortGigEBroadcomBCM5718mezzanineoptioncardDualPort10GigEBroadcomBCM57810SmezzanineoptioncardExpansionslots1PCIex8Gen3.0slot(lowprofile)1PCIex16Gen3.0slot(fullheight/fulllength)Powersupply(std/max)1/2redundant800WA/CUSBports2front/4backVGAports1Energy-efficiencycomplianceCompliantwith80PLUS?PlatinumSystemsManagementHitachiBaseboardmanagement(BMC)HitachiComputeServerManager(integratedwithHitachiCommandSuite)OperatingsystemssupportedMicrosoftWindowsServer2008R2RedHatEnterpriseLinux5.7RedHatEnterpriseLinux6.2VMwarevSphereESXi5.0Update1Dimensions/Weight447.4Wx753.3Dx43.0H/18KgHitachi機架服務(wù)器CR220HCompactandflexibleserverplatformtosatisfyavarietyofsolutionworkloadandconnectivityneedsIndustryleadingperformancefromthelatestIntelXeonprocessorsHighavailabilityfeaturesforthedatacenter,suchasredundantpowerandcooling,hot-swapHDDs,andintegratedmanagementOptimizedprice\performanceforapplicationsolutionsandclouddeployments.HitachiComputeRACK220HComputeRack220H參數(shù)表Formfactor2URackProcessorFamilyIntel?Xeon?E5-2600seriesprocessorsupto8coresNumberofprocessors(std/max)1/2MemoryUpto384GBvia24slotsDiskbaysEight

2.5"harddiskdrivesRAIDsupportRAID-0,-1,-5,-6,-10,JBODRAIDCacheOptions6GbpsSASController512MBcachewithoutcacheprotection6GbpsSASController1GBcachewithcacheprotection(SuperCap)DVD-ROMDVD-ROM8xHot-swapcomponentsPowersupplies,fanmodulesandharddiskdrivesNetworkinterfaceDualPort1GbEBroadcomBCM5718embeddedcontrollerNetworkExpansionOptionsDualPortGigEBroadcomBCM5718mezzanineoptioncardDualPort10GigEBroadcomBCM57810SmezzanineoptioncardExpansionslots2PCIex4Gen3.0slot(lowprofile)3PCIex8Gen3.0slot(fullheight/fulllength)Powersupply(std/max)1/2redundant800WA/CUSBports2front/4backVGAports1Energy-efficiencycomplianceCompliantwith80PLUS?PlatinumSystemsManagementHitachiBaseboardmanagement(BMC)HitachiComputeServerManager(integratedwithHitachiCommandSuite)OperatingsystemssupportedMicrosoftWindowsServer2008R2RedHatEnterpriseLinux5.7RedHatEnterpriseLinux6.2VMwarevSphereESXi5.0Update1Dimensions/Weight447.4Wx753.3Dx86.2H/33KgHitachi機架服務(wù)器CR220SCompactandflexibleserverplatformtosatisfyavarietyofsolutionworkloadandconnectivityneedsIndustryleadingperformancefromthelatestIntelXeonprocessor