ICS81.060.30

CCSQ30

中華人民共和國國家標準

GB/T46583—2025

微波介質(zhì)陶瓷介電性能測試方法

開腔法、閉腔法

Testmethodsfordielectricpropertiesofmicrowavedielectricceramics—

Opencavitymethodandclosedcavitymethod

2025?10?31發(fā)布2026?05?01實施

國家市場監(jiān)督管理總局

國家標準化管理委員會發(fā)布

GB/T46583—2025

目次

前言··························································································································Ⅲ

引言··························································································································Ⅳ

1范圍·······················································································································1

2規(guī)范性引用文件········································································································1

3術(shù)語和定義··············································································································1

4測試原理·················································································································2

5測試條件·················································································································4

6儀器設備·················································································································5

7測試樣品·················································································································5

8測試步驟·················································································································6

9測量不確定度···········································································································7

10測試報告···············································································································7

附錄A（資料性）開腔法的計算過程················································································9

附錄B（資料性）閉腔法的計算過程···············································································12

附錄C（資料性）測試示例···························································································15

參考文獻····················································································································16

Ⅰ

GB/T46583—2025

前言

本文件按照GB/T1.1—2020《標準化工作導則第1部分：標準化文件的結(jié)構(gòu)和起草規(guī)則》的規(guī)

定起草。

請注意本文件的某些內(nèi)容可能涉及專利。本文件的發(fā)布機構(gòu)不承擔識別專利的責任。

本文件由中國建筑材料聯(lián)合會提出。

本文件由全國工業(yè)陶瓷標準化技術(shù)委員會（SAC/TC194）歸口。

本文件起草單位：浙江大學、江蘇燦勤科技股份有限公司、嘉興佳利電子有限公司、武漢佰力博科

技有限公司、浙江嘉康電子股份有限公司、廣東速聯(lián)科技術(shù)股份有限公司、清華大學、電子科技大學、

同濟大學、南方科技大學、華中科技大學、陜西師范大學、桂林理工大學、中國科學院上海硅酸鹽研究

所、齊魯工業(yè)大學（山東省科學院）、華中科技大學溫州先進制造技術(shù)研究院。

本文件主要起草人：李雷、朱匯、胡元云、方輝、胡善良、喬全寶、岳振星、陳湘明、張樹人、翟繼衛(wèi)、

汪宏、呂文中、劉鵬、方亮、劉志甫、唐斌、石鋒、雷文。

Ⅲ

GB/T46583—2025

引言

微波介質(zhì)陶瓷是微波通信技術(shù)中的關(guān)鍵材料之一，廣泛應用于微波介質(zhì)諧振器、濾波器、雙工器、

基板、天線、電容器等核心元器件。相對介電常數(shù)、損耗角正切值（或Qf值）及諧振頻率溫度系數(shù)等介

電性能參數(shù)是微波介質(zhì)陶瓷最重要的技術(shù)指標，這些參數(shù)的精確測試對微波介質(zhì)陶瓷的開發(fā)、應用及

相關(guān)元器件的設計都具有非常重要的意義。

與其他微波介質(zhì)材料相比，微波介質(zhì)陶瓷具有相對介電常數(shù)覆蓋范圍寬、損耗角正切值低、溫度穩(wěn)

TE

定性要求高等突出特點，因此對介電性能測試方法的要求也更高?；谖⒉ń橘|(zhì)諧振原理、采用011

諧振模式的開腔法與閉腔法，由于諧振的激勵與測試受樣品相對介電常數(shù)影響小、金屬壁品質(zhì)因數(shù)高、

電能集中于樣品內(nèi)等，因而能夠適應微波介質(zhì)陶瓷的性能特點，被廣泛應用于微波介質(zhì)陶瓷介電性能

的測試。本文件采用開腔法與閉腔法，提出了微波介質(zhì)陶瓷相對介電常數(shù)、損耗角正切值及諧振頻率

溫度系數(shù)的測試方法。兩種方法相比較，閉腔法測試相對介電常數(shù)與損耗角正切值的不確定度更小、

損耗角正切值的測試范圍更寬，開腔法則可用于諧振頻率溫度系數(shù)的測試。將兩種方法結(jié)合起來使

用，能充分滿足各種微波介質(zhì)陶瓷介電性能的測試需求。

Ⅳ

GB/T46583—2025

微波介質(zhì)陶瓷介電性能測試方法

開腔法、閉腔法

1范圍

本文件描述了微波介質(zhì)陶瓷介電性能測試方法（開腔法與閉腔法）的測試原理、測試條件、儀器設

備、測試樣品、測試步驟、測試報告、計算過程及測量不確定度。

本文件適用于均勻的圓柱形微波介質(zhì)陶瓷。開腔法中，測試頻率范圍為2GHz~24GHz，相對介

電常數(shù)的測試范圍為3~300，損耗角正切值的測試范圍為10-4~6×10-3，諧振頻率溫度系數(shù)的測試范

圍為-1500×10-6/℃~1500×10-6/℃。閉腔法中，測試頻率范圍為1GHz~32GHz，相對介電常數(shù)的

測試范圍為3~300、損耗角正切值的測試范圍為2×10-5~10-2。本文件也適用于其他低損耗、無磁性

固體電介質(zhì)微波介電性能的測試。

2規(guī)范性引用文件

下列文件中的內(nèi)容通過文中的規(guī)范性引用而構(gòu)成本文件必不可少的條款。其中，注日期的引用文

件，僅該日期對應的版本適用于本文件；不注日期的引用文件，其最新版本（包括所有的修改單）適用于

本文件。

GB/T1216—2018外徑千分尺

3術(shù)語和定義

下列術(shù)語和定義適用于本文件。

3.1

微波介質(zhì)陶瓷microwavedielectricceramics

用于各類微波器件中，通過陶瓷塊體與微波的相互作用實現(xiàn)各種器件功能，如濾波、導波、微波反

射與接收等的陶瓷介質(zhì)材料。

注1：微波介質(zhì)陶瓷一般為復合氧化物，如鈦酸鹽、鈮酸鹽、鉭酸鹽等。一般要求微波介質(zhì)陶瓷在微波頻段具有合適

的相對介電常數(shù)、低損耗角正切值（或高Qf值）和較小的諧振頻率溫度系數(shù)。

注2：微波介質(zhì)陶瓷是移動通信、衛(wèi)星通信等的關(guān)鍵材料。

[來源：GB/T17991—2009，2.1.28，有修改]

3.2