1、手機(jī)的基本結(jié)構(gòu)介紹,內(nèi)容提要,一. 手機(jī)基本結(jié)構(gòu)介紹; 二. 手機(jī)零件介紹; 三.手機(jī)設(shè)計(jì)開發(fā)流程簡介; 四.手機(jī)測試驗(yàn)證簡介,手機(jī)基本結(jié)構(gòu)介紹,手機(jī)結(jié)構(gòu)魚骨圖介紹; 手機(jī)結(jié)構(gòu)爆炸圖分析; . 翻蓋型手機(jī) (Clam Phone) . 直板型手機(jī) (Candy bar ),天線模組,連接器模組(I),電路板模組,IML機(jī)殼,多媒體卡連接器,Shielding Can,電路板(PCB),SIM卡連接器,天線組件,振動(dòng)器,按鍵模組,顯示模組,塑膠機(jī)殼模組,遮蔽模組,手機(jī)機(jī)構(gòu)組件,EMI 墊片,開關(guān)/接鍵,IMD機(jī)殼,EMI處理,多色異材設(shè)出,鏡片,防塵墊,單色烤漆,雙色烤漆,電鍍處理,IML ke

2、y Pad,Plastic+Rubber,Multi-point molding,Laser刻字,LCD連接器,Rubber,SD卡連接器,電池連接器,電源插口,語音插口腔,輸入輸出端口,多色射出(異材),主動(dòng)元件,被動(dòng)元件,Camera,其子電子元件,LCD,Touch Screen,陣列天線,EMI Form IN Place,麥克風(fēng),Speaker,面型天線,線型天線,Shielding Strip,EMI Sputtering,EMI housing,EMI Gasket,反射薄膜,光源,Light guide,Metal dome,振動(dòng)器連接器,連接器模組(I),麥克風(fēng)連接器,觸摸開

3、關(guān),Volume連接器,Speaker連接器,7,手機(jī)機(jī)構(gòu)組件魚骨圖,手機(jī)結(jié)構(gòu)爆炸圖分析-翻蓋型,專案名稱: ZUMA 市場定位 : High tier 自動(dòng)翻蓋手機(jī) (2.0M CameraMP3AGPS BLUTOOTH) 產(chǎn)品客戶: Spring Nextel / Boost Mobile,Ant_launch_holder,Ant_launch,Baker_Side_button_ (with adhesive),Side Button,Top Button,Speak_grill_left,vibrator,Main_PCB,SD_connector,AGPS_carrier,AGP

4、S element,Housing_front,Speaker Felt Right,Speaker Felt Left,Main_keypad,Speaker Grill_ right,Switch_PTT Button Mylar-,Antenna_Blue_tooth,Antenna_Blue_tooth_carrier,Latch_SIM Door,Door_SIM Connector,Base Screw Plug Left,Antenna,Backer_TOP Button(with adhesive),Hinge,Hinge Push Button (with adhesive)

5、,Hinge Push Button Cap,Switch_Buttons TOP Mylar,SD_Baker(with ADH),Backer_SIM(with adhesive),Base_flex,Speaker-HSG,Seal_ Back Acoustic,Battery Floor,Pin_SIM Connector,ADH_speaker_HSG,Base Screw Plug Right,Base Screw (4),Antenna_screw,Spring_Battery Door Latch,Battery_cover_HSG,Audio jack seal,Seal_A

6、ccessory Connector,Latch_Battery Cover,Battery,Housing_back,Speaker(with adhesive),Housing_Audio jack connector,Battery bumper-,Main_keypad_Mylar,ZUMA_bottom_view,ZUMA_top_view,Lens_ Inner,ADH_Lens_ Inner,Screw_flip(4),Transducer_felt,magnet,Flip_inner_HSG,Camera_shield,Transducer,camera,lens Flip_o

7、uter,Flip_outer_HSG,Mp3_Button_down,Boost logo light guide,Felt_ Flip outer(with_adhesive),Grill_flip_outer,Lens_flash,Outer_Lens_ADH,Camera_ PORON_ pad(with adhesive)(2),Camera _lens_adhesive,LCD_bezel,Super_flex_bare,Transducer_Grill,Camera _lens,PORON_CID(with adhesive),Bushing_screw_insert(4),_H

8、OS_pad(with adhesive),Mp3_Button_down_Mylar,Mp3_Button_up_Mylar,Mp3_Button_up,CID-LCD_ASS,LCD_bezel_poron(with ADH),手機(jī)結(jié)構(gòu)爆炸圖分析-直板機(jī),專案名稱: Kingfisher II 市場定位 : Low Tier (帶AGPS功能) 產(chǎn)品客戶: Boost Mobile,lens,Front housing,Side key,Mic_asm,Key pad,Transducer asm,Lcd gasket,Main PCB,Jack seal,Acoustic seal,sp

9、eaker,Vibrator asm,Antenna cap,GPS antenna,Back housing,Battery door,Sim_tray,Bump,GPS stopper,Antenna Coil,Antenna cushion,Felt speaker,LCD module,LCD frame,Kingfisher 2 master assembly,手機(jī)零件介紹,Unique parts -Plastic parts; -Metal parts ; -Die cut parts; -Rubber parts; Common parts -Electric Module,P

10、lastic parts - uniques,常用材料:一般採用PC, PC+ABS, IXEF, Thermotuf, PMMA, ABS 等等; 主要應(yīng)用零件: 殼體類零件, 支架類零件, 導(dǎo)光件, 鏡片等等; 製造工藝: 主要是模具射出成型; 表面處理一般用烤漆,電鍍,電鑄,IML/IMD,燙印,水轉(zhuǎn)印,移印等等; 尺寸型狀要求:形狀較複雜, 尺寸精度較高.,Metal parts - uniques,常用材料: 不鏽鋼板材,鎂合金,鋁合金,線材,鍍鋅板等等; 主要應(yīng)用零件:殼體類零件, 支架類零件, 屏蔽罩,彈簧,軸類以及螺絲等等; 製造工藝: 沖壓成型,壓鑄成型,機(jī)加工等等;表面處理

11、一般用電度,陽極,拋光,拉絲,蝕刻,移印,鑽雕等等; 尺寸形狀要求:形狀可以較複雜,尺寸精度較高.,Rubber parts - uniques,常用材料:Silicon rubber, TPU等等; 主要應(yīng)用零件: 按鍵, 密封件,緩衝件,以及用於雙色成型等等; 製造工藝: 注射成型,模壓成型 等等;表面處理一般用烤漆,鐳雕等等; 尺寸形狀要求:形狀可以較複雜,但尺寸精度一般.,Die cut parts - uniques,常用材料:泡棉,背膠,貼紙,薄塑膠板材,保護(hù)膜,Film 等等; 主要應(yīng)用零件: 密封件,緩衝件, 外觀貼紙標(biāo)簽, 表面保護(hù)膜等等; 製造工藝:模具沖切,鐳射切割; 尺

12、寸形狀要求:形狀簡單;模具沖切的尺寸精度較低,鐳射切割的精度高,但成本也高,不具備量產(chǎn)性能.,Electrical module - common parts,EM 零件-電子機(jī)構(gòu)件,電子和結(jié)構(gòu)同時(shí)管控的零件.具體如下:,Audio Jack-音頻接口,Battery connector-連結(jié)電池和主板,電池給主板供電,Battery charge connector-充電器和數(shù)據(jù)線接口.,Electrical module - common parts,Keypad Mylar Dome-Keypad switch, 按鍵開關(guān),Mylar+,Adhesive+,Dome,Mic-麥克風(fēng),El

13、ectrical module - common parts,Flex-軟板,起柔性連結(jié)作用.,SD connector-SD卡基座,Electrical module - common parts,SIM connector-SIM 卡連接器.,Vibrator-震動(dòng)馬達(dá), 手機(jī)震動(dòng) 時(shí)動(dòng)力來源.,Speaker-喇叭,Electrical module - common parts,Camera Flash-攝相頭閃光燈,Camera socket-攝相頭基座,Hinge Flex-軟板,起柔性連 結(jié)作用.,Electrical module - common parts,CID-(Cal

14、l Indicator Display) 外部顯示屏,Camera-攝相頭,Transducer-(Receiver) 音蘋 轉(zhuǎn)換器.,Electrical module - common parts,LCD-(Liquid crystal display) 主顯示屏,手機(jī)設(shè)計(jì)開發(fā)流程簡介,Pre _ Master file received from Motorola,Feasibility study/ Concept design,Refine / Complete ID master file,AAR (Architecture Acceptance Review),Concept d

15、esign review,ID master lockdown,ID Rendering,ID Rendering lockdown,CMF,CMF Sign off,Detail design,Analysis (Interference check, TA, simulation, etc),CDR (Critical design review),Final design review,Tooling release,Process check (SOP / fixture check,Mock up samples,ID master lockdown,FOT,Assemble (LV

16、/LX),ABC/ALT TEST,Pilot build,Ramp up,SA,database changes,ECN,DMAIC/ANALYSIS,Process check (SOP / fixture check,手機(jī)可靠性驗(yàn)證,可靠性驗(yàn)證是手機(jī)設(shè)計(jì)開發(fā)過程中必不可 少的環(huán)節(jié), 它是通過在惡劣環(huán)境下加速老化來 檢測手機(jī)和零件的性能.,手機(jī)可靠性驗(yàn)証簡介,溫濕度,鹽霧,滴水,輻射,砂塵,按鍵,轉(zhuǎn)軸耐久性測試,跌落,彎曲, 振動(dòng),通訊信號(hào)參數(shù)檢驗(yàn),手機(jī)驗(yàn)証項(xiàng)目(環(huán)境應(yīng)力驗(yàn)證),高溫試驗(yàn) 低溫試驗(yàn) 高溫高濕試驗(yàn) 溫濕度循環(huán)試驗(yàn) 冷熱沖擊試驗(yàn) 陽光老化試驗(yàn),冷凝試驗(yàn) 鹽霧試驗(yàn) 雨淋試驗(yàn) 砂塵試驗(yàn) 紫外光試驗(yàn) 抗化學(xué)試驗(yàn),手機(jī)驗(yàn)証項(xiàng)目(機(jī)械應(yīng)力驗(yàn)證)