1、1 .英文事有名春司介貂2 . General 一般事有名箭J 3 .英文事有名春司4.中文明數(shù)字表本有辭言主5. LCD (Liquid Crystal Display)6.液日日小而巨主.7. Glass, substrate or glass substrate8.玻璃基版*旨主.9. TFT(Thin Film Transistor)10.薄膜重晶主.11.Panel12.面板13.Array14.排列,指在玻璃基板上做TFT的裂程15.LCD-Array16.Cell17 .液晶填充裂程.分為18 .LCD-FEOL (Cell前段)19 .LCD-BEOL (Cell接段含Cell

2、 Tester)20.Module21.模1,指彳爰段裝裝程22.LCM23.Monitor24.整:視器25.Pixel26.XGA:eX tendedGraphicsArray=1024*768Pixels27.SXGA : Super XGA=1280*1024Pixels28 .像素土主.29 .PS.像素越多表示解析度越高30.Computer31宛月曾32.Notebook33.肇言己型重月皆ffiW NB34.RGB (Red, Green, Blue)35.指缸條錄疊三原色36.PM (Preventive Maintenance)37.IS防保餐38.Quality39.品

3、H40.Standard41.襟津指作巢襟品ST指襟42.Material43.材料44.Yield45.良率46.CIM(ComputerIntegrationManufacturing)47.11整合裂造指以系統(tǒng)整合裂造流程48.FA (Factory Automation)49.工自勤化50.Exit51.出口52.Precaution53.IS防舉措54.Warning55.警告56.Emergency57累急58.Alarm59.警幸艮60.Clean Room (9(浮室事有名箭J )61.英文事有名春司62.中文明63.Clean room64,縈浮室* t±.65.P

4、article66.微粒子* t±.67.HEPA (High Efficient Particulate Air)filter68.高效能粒子空氟遇濾69.Contamination70.污染71.Temperature (TEMP)72湍度73.Humidity74渥度75.Pressure76厘力77.UPW (Ultra-Pure Water)78.超觸水79.DIW (De-Ionized Water)80.去雌子水81.IPA (Isopropyl Alcohol)82具丙醇83.Sticky mat84肺踏黏塾* ®.85.Cleanliness86,縈浮度8

5、7.ESD (Electro-static Discharge)88.青酎電破塌*官主.89.Laminar flow90.眉流流醴力名春司91.Turbulent flow92.援流流醴力名春司93.Alcohol94.酒精95.Acetone96.內(nèi)酮97.Particle98.微粒子99.Dust100.灰 H101. Gowning room102. 換衣W *!£.103. Raised floor (grating floor)104.局架地板*官主.105. Air shower106. 氟浴室* ®.107. Prohibit108. 禁止109. Clea

6、n suit (bunny suit, dust-freegarment)110.瓢11 衣 *!£.111. Glove112.手套113. Hairnet114.余罔帽115. Hood116. !罩117. Mask118. 口罩119. Clean shoes (dust-free shoes, boots)120. 瓢座鞋121. Factory Automation (工Ji® 自勤化事有名箭J )122.英文事有名春司123.中文明124. Vehicle125.建WJ工具或載具126. AGV (Automatic Guided Vehicle)127.自勤

7、搬通隼128. MGV (Manual Guided Vehicle)129.人力搬建隼130. Clean lifter131.天井停送隼132. LIM (Linear Induction Motor) Carrier133. 性感鷹®逵傅送載具134. OHS (Overhead Shuttle)135.天隼或稚Wl道隼136. Stocker (clean depot)137. 存放Casse也架子的暫存ES138. Battery139. 雷池140. Bay141.作H顯142. Bumper143.保 irt!144. Charger145. 充重器146.Contro

8、ller147.限制器148.Conveyor149.WJ送帶150.Crane151.吊隼(在Stocked)152.FFU (Fan Filter Unit)153.凰扇遇濾器154.Host155.156.I/O (Input / Output)157.It入倬俞出158.Inter-bay159.作ft展和作ft展之160.Intra-bay161.作璨i展之內(nèi)162.IR (Infra-Red)163.164.IRIF(Infra-Red InterFace)165.缸外介面166.Load167.迤料168.Unload169.卸K170.Magnetic tape171.AGV路

9、彳?chē)?guó)所使用的磁修172.POSEIDON173.海神生店作渠系統(tǒng)174.Retrieve175.mm檢索,擷取修料176.RTM (Rotary Transfer Machine)177.旋醇傅送械178.SCARA arm179.AGV之傅送手臂180.Reset181.重新定182.Transportation183.184.嵋主.OPI(Operation POSEIDON Instruction)海神生jS作It系統(tǒng)事有名春司介貂185.英文事有名春司186.中文明187. Recipe188.程式矍程參數(shù)189. Stock out190. JCassett敬出191. Reques

10、t192.吉青求,要求193. Transfer194.傅送,建送195. Instruction196. 命令,指令197. Select198.圜f199. Cancel200. 取消201. Operation202. 作H,操作203. Support204.支援205. Process206.裂程207. Start208. 始209. Comp.210. Completion的縮U,息指元成211. Batch212.批量213. Lot214.指生上的在裝品或品,曾«喟215. ID (Identity)216. 別礁(如Lot ID or Chip ID)217. S

11、heet218.片Array顯玻璃基版位* ®.219. Chip220.片(Cell顯玻璃trtOT位)* S.221. Inspection222. aw223. Defect224. 缺陷225. Production226.生 fg227. Hold228.留置在常站裂程如有品51冏題日寺229. Release230. Jhol施的K放行濯出231. Equipment232.到#EQP)233. Tool234. 工具樵臺(tái)235. WIP (Work In Process)236.在裂品裂程在裂品237. Maintenance238.雉修保餐239. Cassette2

12、40.裝在裂品的架子*言主.241. Empty242. 空的243. Reserve244. 資勺245. Report246.幸皓247. Scrap248.耦盛249. Rework250. 重工251. Log on252.登幅253. Log off254.除幅255. Note256.得主解257.258.259.260.261.262.263.264.265.266.267.268.269.270.271.272.273.274.275.276.277.278.279.280.281.282.283.284.285.286.287. Array段裂程事有名春司介貂288.英文事有

13、名春司289. 中文明290. Material291. 材料292. Metal293. 金腐294. Target295.靶296. MoW (Moly-tungsten)297.金昌化金目298. Mo (Molybdenum)299.金目300. ITO (Indium Tin Oxide)301.金因金易氧化物302. Al (Aluminum)303.金呂304. AlNd(AluminumandNeodymium Alloy)305.金日和斂的合金以上皆:金JS靶的材料之一306. Reticle or Mask307. 光罩308. Detergent (LH-300)309.

14、界河活性粵J的 桎清洗械用來(lái)清洗玻璃表回用LH-30潟供鷹商型虢310. LAL-50311.含NH4F典HF,懸清洗械用來(lái)清洗玻璃外表氧化唇的化溶液312. O3 (Ozone)313.臭氧,主要懸各裝程用來(lái)去除有械物的污染或殘留314. NBA (1-butyl Acetate)315.乙酸正丁酯,主要用來(lái)清洗旋輔It偉光阻日寺殘 留在玻璃的光阻液316.Resist or Photo Resist317.光阻曾耦PR318. HMDS319.Hexamethyldisilazanefi勺S1 化 中 fW用以增加光阻It怖晚封晶片外表之附著力320. AC-1321. 馴T重預(yù)防剜ESD

15、-Preventer,在上光阻械內(nèi)使用,預(yù)防靜甯羥生,破壤玻璃元件322. TMAH (供所型的 KTM-25)323. Tetra-Methyl Ammonium Hydroxide 的UMI,內(nèi)所使用之IE影液324. Oxalic Acid (H 2c2O4)325.草酸,漏食蟲(chóng)刻械中用來(lái)食蟲(chóng)刻5PEP中的a-ITO膜326. DHF327.成份懸49%氫氟酸HF,主要懸漏觸刻械中用來(lái)食蟲(chóng)亥U7PEP中的SiNx膜328. ITO-Etchant329.成份中含亶酸HCl及硝酸HNO3,主要用來(lái)做刻7PEP中的 Poly-ITO330. BHF331.成份中含氟化NH4F及HF,主要用來(lái)

16、做刻7PEP 中的 SiON332. Al-Etchant333. 成份中含乙酸 CH3COOH、磷酸H3P.4及硝酸HNO3,主要用來(lái)觸刻Mo/Al/Mo的沈稹1334. IPA335. 昇丙醇Isopropyl Alcohol的曾耦,主要用來(lái)作擦拭液,在去光阻裂程中亦用來(lái)去除玻璃基板上的有殘留物如光阻或去光阻液336. N-300337.去光阻液,N-300懸航商型虢,成份懸罩乙醇軍酷的混合物338. (Process) Gas339.裂程101目前大多數(shù)槿的多懸提供CVD, Sputte吸乾食蟲(chóng)刻重源之用340.SiH4341.矽甲烷裂程io! a曳漏有爆炸危342. NH3343.氨裂

17、程344. N2O345.笑氟裂程346. PH3347.磷化氫裂程348. N2349.氮氟裂程常用懸破真空 Ven或吹乾的媒介350. H2351.裂程352. NF3353.氟化氮裂程IOI,常用懸去除CVD反鷹室壁沈稹矽Si媒介354. Kr355.氟氯裂程氟H,用來(lái)期艘械上的金JS靶356. Ar357. MM裂程氟H,用來(lái)期艘械上的金JS靶或常用懸加熱t(yī)H#的都傅媒介358. O2359.常用來(lái)作的根本成,360. BCI3361.氯化硼裂程氟,在乾做刻中用以傳融蟲(chóng) 刻AlNd的源362. SF6363.氟化硫裂程,常用的主要乾觸刻源以懸提供做刻主原料氟的漆源364. He365.

18、 MM裂程混合在其它集程氯醴中,共同形成源,使成分偉均勻366. CI2367.氯氟裂程368. HCl369.氯化氫裂程IOI,觸刻n+日寺的雷源之一370. CF4371.四氟化碳裂程,常用的主要乾觸刻H源以懸提供做刻主原料氟的來(lái)源372. Equipment373.械臺(tái)侑!器374. Vender375. J敞商376. Cleaner377.清洗械* t±.378. CVD(ChemicalVaporDeposition)379.化氟相沉稹*1£.380. Sputter381.械* S.382. Coater383. 上光阻械*!£.384. Pre-b

19、ake385. H烘* t±.386. Stepper387.步迤式曝光械*江388. Exposure389. 曝光390. Backside-Exposure391.反面曝光392. Titler393.刻虢械,內(nèi)局部的K影械具有此功能,符玻璃基板的 Chip ID, Glass ID 及Veri-Code曝出,以人H及械臺(tái)翔嗑S之用394. Edge Remover395.曾耦ER,指在施傅It偉光阻彳爰,用NBA洗凈殘留在玻璃的光阻396. Edge Exposure397.曝光,指在K影前符玻璃基板遏阻敕厚的局部再曝光,以防曝光量缺乏,造成光阻在K影彳爰?xì)埩?98. Dev

20、eloper399. IE影械* t±.400. Hard bake401. 硬烤*得主.402. Etcher403.食帔廉404. Wet Etch405.漏觸刻* t±.406. Dry Etch407.乾做刻* a.408. Plasma409. *1£.410. RIE (Reactive ion etching)411.反鷹性高隹子觸刻* t±.412. PE (Plasma Etch)413.雷食蟲(chóng)刻械* S414. ICP (Inductive Coupled Plasma)415.重感偶式重食蟲(chóng)刻械* S416. Stripper417

21、.去光阻械*418. O3 Asher419.懸去光阻械的模之一,用來(lái)去除裂程的有檄殘留*7主420. Tester421.422. Anneal423.回火 *!£.424. AMSR (Sheet Resistance)425.沈稹膜的H阻值測(cè)426. ATOS (Open/Short Tester)427.新短路測(cè)428. ATTG (TEG Tester or TFTDevice Measurement)429. TFT的霞性測(cè)430. ATAR (Array Tester)431. Array Defect 的測(cè)借432. ALSR (Laser Repair)433.雷射

22、修禱械434. ANNI (Anneal Oven)435.回火掰！436. AMGI (Particle Counter)437.微粒子偵測(cè),偵測(cè)玻璃外表微粒子數(shù)目及大小分傣f438. AMOR;AMKL(PatternInspection)439.圈案或路椀康TtH# ;主要在椀嗡i沈稹膜彳爰、 曝光彳爰、做刻彳爰及去光阻彳爰外表的路圈案it查前者曾H Orbo,彳爰者曾If KLA440. AMSP (Surface Profiler)441.外表翰廓檢查械,測(cè)量路圈案的上下分偉狀 泳 亦可藉此求得做刻速率曾耦KLA-Tencor442. AMOV (CD/Overlay)443.量測(cè)t

23、H#用以測(cè)量CD,及藉量測(cè)Box 重疊狀況來(lái)橫視Steppe的精度*E主444. AMSH (Microscope)445.高倍K微主要在椀嗡i曝光彳爰、做刻彳爰及去 光阻彳爰外表的路圈案查曾lfOlympu9446. AMEL; AMOT (Film Thickness)447.膜厚量測(cè)倭前者曾耦Sopra,彳爰者葡W Nano448. AMVI (Visual Inspection)449.目視檢查械,Array段裂程的最彳爰出K前檢查450. CJ452. MS451.指高屋水洗453.指超音波水洗454. Conveyor455. 傅送456. Spin457. 旋串摩如Spin Dr

24、yer：身速旋乾器458. Chamber459. 反鷹室如CVD, Sputter或靶刻460. Load Lock 曾耦 LL461.懸大氯迤入真空或真空迤入大氟的媒介462. Heat464. Cool463.加熱465.冷郤466. Probe467.械的探金十468.469.470. Process471.裂程472. Spec473.裂程的品與票型474. Pin-Hole475.金十黑占小凹陷476. PEP (photo engraving process)477.完成次黃光裂程叫做彳固PEP478. MI479.第一次沈稹的闡趣金JS膜如 MoW480. MII481.第二次

25、沈稹的源趣和汲趣金JS膜如MoAlMo482. a-Si (amorphous silicon)483.非余吉晶矽,TFT沈稹眉之一484. n+ 或 n+a-Si485.攙親隹磷的非余吉晶矽,TFT沈稹眉之一486. SiON Wte SiOxNy 因 O,N的比例不一定487.氮氧化矽,TFT沈稹眉之一488.SiNx xSi 典 N 的比例489. 氮化矽,TFT沈稹眉之一490. Cleaning491.清洗Cleaner!勺童!J作箱Cleaning492. Brush493.清洗械所使用之軟刷494. DI; DI water; Deionized Water496. UPW495

26、.去Pt子水497. 超觸水498. Vent499.破真空,真空璟境下的玻璃送至LoadLock朗H 日寺,通入氮氟平衡屋力,以預(yù)防UU烈的1m燮化造 成破片500. Purge501.用C或NF系列的氯醴通入CVD去除器壁累稹的矽502. Rinse503. 水洗504. Veri-Code505.光勇赭Sm*®506. Vacuum507. 真空508. Deposition509.沉稹510. Wet etching511. 7瓷蟲(chóng)刻512. Dry etching513. 乾做刻514. Plasma515.516. RIE Reactive Ion Etching517.

27、反財(cái)?shù)蝨子做刻械*7主518. ICP (Inductive Coupled Plasma)519.重感偶式霜食蟲(chóng)刻械*t±520. PE (Plasma Etch)521.雷食蟲(chóng)刻械*t±522. Uniformity523.均勻性IS似大-小/平均值的概念524. Etching Rate525.食蟲(chóng)刻速率做刻厚度/日寺526. Anneal527. 回火528. Laser repair529. 雷射修禱530. Inspection531.旅視532. Pre-bake533. IS烤534. Coating535. 上光阻536. Exposure537. 曝光5

28、38. Develop539. IE影540. Alignment541. 封舉542. CD (critical dimension)543.皆封筵尺寸路皆封筵慮的寬或距544. Overlay545. 重疊546. Cure547.烘烤548. Bake549. 烘烤550. Cell段裂程事有名春司介貂551.英文事有名春司552.中文明553.Material554.材料555.PI (polyimide)556.聚生醯胺557.CF (Color Filter)558.彩色濾光片559. Detergent560.洗剜561.- - Butyrolactone562. 丫 -丁內(nèi)酯,

29、曾稀丫液,用於清除APR版上的PI563. Rubbing cloth564.配向布,懸棉材51,用於 rubbing械臺(tái),使基板西生配向,使 用前須先挑除親隹ST , H懸挑布565. Seal566.框JT,功能在於圉住液晶不外漏及預(yù)防水氟迤入,使用前須先配,567. Spacer 或 MP(Micro Pearl)568. 隙球,功能在於雉持CF典IFI麗鬼玻璃之隙距離隹569. PS (Photo Spacer)570.功能典普通的Space相同,一般 用於大尺寸崖品,且可得到敕好的 cell gap571. Transfer 或 Conductive Paste 或Ag paste5

30、72.金艮或H醇血醪573. UV sealant574. UV B,用於麗鬼玻璃基板合日寺假固定用575. Polyfron576.均屋余氏,基板屋合日寺使用,用於分隔基板,可使屋力均勻分布以及減少親隹ST所造成的損害577. LC (Liquid Crystal)578.液晶579. Polarizer580.偏光膜581.582.583. Equipment584.到#585. CDA (Compressed Dry Air)586. 屋縮高屋乾燥空氟587. DIW, DI water588.去Pt子水,觸水589. Control box590.雷源限制箱591. Valve592.

31、限制593. Breaker594.雷源,畿雷器595. Chamber596.梢597. Clean booth598.瀑浮工作臺(tái)599.600.601.602.603. Process604.裂程605. FEOL (Front End of Line)606. cell 前段607. BEOL (Back End of Line)608. cell 接段609. Scribe (1st scribe, 2nd scribe)610.切割有一次切割及二次切割611. Break (1st break, 2d break)612.裂片有一次裂片及二次裂片613. Grind614.研磨615

32、. PI Print , PI coater616. PI印刷617. PI Prebake618. PI IS烤619. PI Post-bake620. PI接烤621. Rubbing622.配向623. Seal Pattern, Seal dispense624.框壅布625. Spacer Sprayer626. Spacer 散佛627. Jig Press628. Jig 屋合629. Alignment630.封位,631. Cure632.吉硬化633. Seal Pre-bake634. Seal IS烤635. Vacuum Anneal636. 真空回火637. In

33、jection638. 注射LC-Injection:注入液晶639. End Seal640. 封口醪641. Polarizer Lamination642.偏光片貼合643.644.645. Module模段裂程事有名春司646. 英文事有名需司647.中文明648. Cell649. cell完成彳爰的在裂品®650. Backlight651.背光板652. Bezel653.外框654. Driver IC655. 勤稹H雷路656. Soldering657.焊接658. Assembly659. Big660. Aging661.老化662.Packing663.包裝664.Chip665.晶片666.Tape667.668.Screw669.螺670.FPC (Flexible Printed Cable)671.可攜性印刷路672.PCB (Printed Circu