1、 PE Production Engineer TE: Test Engineer .IE: Industry Engineer .AE: Automatic Engineer .R&D: Research Development Engineer .MFG: Manufacturing. .QE: Quality Engineer .Pilot Run: .SPC: Statistic Process Control. .R&D: Research & Development RMA:Return Material Audit VQA:Vender Quality Assurance QA

2、:Quality Assurance MIS :Management Information System OQC :Output Quality Control IQC :Incoming Quality Control IPQC :In Process Quality Control ME :Mechanical Engineer SOPSOPStandard Operation Procedure SOP1. SOP2. 3. SOP4. SOP5. SOP6. SOP7. SOPSOPSOPSOPERPSOP1. SOP2. SOPSOP1. SOP2. 3. SOP4. SOP5.

3、SOP6. SOP7. SOPSOPSOPSOPERPSOP1. SOP2. SOPSOPSOPSOPSOPSOPSOPSOPSOPSOPSOPSOPISO9000SOPSOPSOPSOPSOPSOPSOPSOP,.SOP12SOP SOP SOP SOP SOP SOP SOP SOP SOPSOP1. ,2. 3. 4. 5. ISO()6.pSOPSOP1)SOP8SOPSOPSOP2)SOPSOPSOPSOPSOPSOPSOP1)SOPSOPSOPSOP2) SOPSOP3) SOPSOPSOPSOP4) SOPSOPSOP23CPU: central processing unit(

4、)IC: Integrated circuit()Memory IC: Memory Integrated circuitRAM: Random Access MemoryDRAM: Dynamic Random Access MemorySRAM: Staic Random Access MemoryROM: Read-only MemoryEPROM:Electrical Programmable Read-only MemoryEEPROM: Electrical Erasbale Programmable Read-only MemoryCMOS: Complementary Meta

5、l-Oxide-SemiconductorBIOS: Basic Input Output SystemTransistorLED:ResistorVariatorCapacitor:Capacitor arrayDiodeTransistorTransformerADPOscillator0scCrystalXTAL/OSC:XRelaySensorBead coreFilter:Flat CableInductorBuzzerSocketSlotFuseCurrentSolder ironMagnifying glassCaliperDriverOvenTFT:OscilloscopeCo

6、nnectorPCB:printed circuit boardPCBA: printed circuit board assemblyPP:HDD:FDD:PSU:power supply unitSPEC:Attach:Case: CoverBaseBazelpanelBracketLableGuideManualCardSwitchHubRouterSampleGapSpongePalletFoamFiberDiskPROG:BarcodeSystemSystem BarcodeM/B:mother boardCD-ROM:FAN:CableAudioK/B:KeyboardMouseR

7、iser cardCard readerScrewThermal padHeat sinkRubberRubber footBagWasherSleeveConfigLabel hi-potFirmware labelMetal coverPlastic coverTape for packingBar codeTrayCollectoHolder,LConnecterIDE:SCSI:GasketAGP:PCI:LAN:USB:SlimCOM:LPT:Power cordI/O:SpeakerEPE:CartonButtonFoot standQS:Quality systemCS:Cout

8、omer Sevice QC:Quality controlIQC:Incoming quality control LQC:Line Quality Control ? IPQC:In process quality control FQC:Final quality control OQC:Outgoing quality control QA:Quality assurance SQA:Source(supplier) Quality Assurance (VQA)CQACustomer Quality AssurancePQArocess Quality Assurance QE:Qu

9、ality engineer CE:component engineeringEE:equipment engineeringME:manufacturing engineeringTE:testing engineeringPPEroduct Engineer IE:Industrial engineer ? ADM: Administration DepartmentRMA:CSDI:PC:producing controlMC:mater controlGAD: General Affairs DeptA/D: Accountant /Finance DeptLAB: Laborator

10、yDOE:HR:PMC:RD:W/H:SI:PD: Product DepartmentPA:(PUR: Purchaing Dept)SMT:Surface mount technology MFG:Manufacturing ? MIS:Management information system DCC:document control center QT:Quality targetQP:Quality policyQI:Quality improvementCRITICAL DEFECT:CRMAJOR DEFECT:MAMINOR DEFECT:MIMAX:MaximumMIN:Mi

11、nimumDIAiameterDIMimensionLCL:Lower control limitUCL:Upper control limitEMI:ESD:EPA:ECN:ECO:Engineering change orderECR:CPI:Continuous Process Improvement CompatibilityMarkingDWGrawingStandardizationConsensusCodeZD:Zero defectToleranceSubject matterAuditorBOM:Bill of materialReworkIDidentification,P

12、ILOT RUN: ()FAI:FPIRFirst Piece Inspection ReportFAA:SPCCP: capability indexCPK: capability index of process()PMP:MPI:DASefects Analysis System ? PPBFluxP/N:L/NLot NumberVersionQuantityValid dateMIL-STDMilitary-StandardICT: In Circuit Test ()ATEAutomatic Test EquipmentMO: Manafacture OrderT/U: Touch

13、 Up ()I/N:P/T:F/T: Function Test (-)ASP/K:TQM:Total quality controlMDA:manufacturing defect analysis(ICT)RUN-IN:HI-potFMIFrequency Modulation InspectDPPM: Defect Part Per Million() 1000PPM0.1%Corrective Action: (CAR)ACCREJ:S/SSample sizeSI-SIVSpecial I-Special IVCONConcession / WaiveISO:ISAIndustry

14、Standard ArchitectureOBA:FIFO:PDCA:Plan do check actionWIP:S/O: Sales Order ()P/O: Purchase Order ()P/R: Purchase Request ()AQL:acceptable quality levelLQL;Limiting quality levelQVL:qualified vendor listAVL (Approved Vendor List)QCD: Quality cost deliveryMPM:Manufacturing project managementKPI:Key p

15、erformance indicateMVT:Manufacturing Verification TestQ/R/SQuality/Reliability/Service/STL:ship to lineNTF:No trouble foundCIP:capacity improvement planMRB:material review boardMRB:Material reject billJIT:just in time5S:seiri seiton seiso seiketsu shitsukeSOP:standard operation processSIP:Specificat

16、ion inspection processTOP: Test Operation Process ()WI: working instructionSMD:surface mounting deviceFAR:failure aualysis reportCAR:Corrective action reportBPR (Business Process Reengineering)ISAR (Initial Sample Approval Request)-JIT (Just In Time)QCC (Quality Control Circle)Engineering Department

17、 ()TQEM: Total Quality Environment Management()PD: Production Department ()LOG: Logistics ()Shipping: ()AOQAverage Output QualityAOQLAverage Output Quality LevelFMEAfailure model effectiveness analysisCRB: Change Review Board ()CSACustomer Simulate AnalysisSQMSSupplier Quality Management SystemQIT:

18、Quality Improvement Team QIPQuality Improvement PlanCIPContinual Improvement PlanM.Q.F.S: Material Quality Feedback Sheet ()SCAR: Supplier Corrective Action Report ()8D Sheet: 8 Disciplines sheet ( 8D)PDCAPDCA (Plan-Do-Check-Action) ()MPQ: Material Packing Quantity ()DSCN: Delivery Schedule Change N

19、otice ()QAPS: Quality Assurance Process Sheet ()DRP (Distribution Resource Planning)DSS (Decision Support System)EC ? (Electronic Commerce)EDI (Electronic Data Interchange)EIS (Excutive Information System) (Enterprise Resource Planning)FMS (Flexible Manufacture System)KM ? (Knowledge Management)4L (

20、Lot-for-Lot)LTC (Least Total Cost)LUC (Least Unit Cost)MES (Manufacturing Execution System)MPS (Master Production Schedule)MRP (Material Requirement Planning)MRP (Manufacturing Resource Planning)OEM (Original Equipment Manufacture)ODM (Original Design & Manufacture)OLAP (On-Line Analytical Processin

21、g)OLTP (On-Line Transaction Processing)OPT (Optimized Production Technology)PDCAPDCA (Plan-Do-Check-Action)PDM (Product Data Management)RCCP (Rough Cut Capacity Planning)SCM (Supply Chain Management)SFC (Shop Floor Control)TOC (Theory of Constraints)TQC (Total Quality Control)FYI/R:for your informat

22、ion/referenceASAP:S/T:Standard timeTPM:total production maintenanceESD Wrist strapIT:information technologyCEOChief Executive OfficerCOOChief Operaring OfficerSWOTStrength,Weakness,Opportunity,ThreatoooCompetenceCommunicationCooperationVibration TestingIDPIndividual Development PlanMRPMaterial Requi

23、rement PlanningMATSMaterialLRRLot Rejeet RateATINAttention3CComputer ,Communication , Consumer electronic5W1HWhen , Where , Who , What , Why , Ho5M: Man , Machine , Material , Method , Measurement,4MIE: Man,Material,Machine,Method,Environment,()7M1I: Manpower , Machine , Material , Method, Market ,

24、Management , Money , Information , 1. Accuracy 2. Action 3. Activity 4. Analysis Covariance 5. Analysis of Variance 6. Approved 7. Attribute 8. Average 9. Balance sheet 10. Binomial 11. Brainstorming Techniques 12. Cause and Effect Matrix ()13. CL:Center Line 14. Check Sheets 15. Complaint 16. Confo

25、rmity 17. Control 18. Control chart ()19. Correction 20. Correlation Methods 21. CPI: continuouse Process Improvement 22. Cross Tabulation Tables 23. CS: Customer Sevice 24. DSA: Defects Analysis System 25. Data ? ? ? Description:26. DCC: Document Control Center 27. Decision 28. Defects per unit 29. Description 30. Device 31. Do 32. DOE: Design of Experiments 33. Element 34. Engineering recbnology 35. Environmental 36. Equipment 37. Estimated accumulative frequency 38. E Equipment Variation 39. External Fa