PAGE第40頁，共40頁文件編號：文件版本：V1.0密級：最高高中低頁數(shù)：共40頁植球機(jī)(SBM371SBI371)操作維護(hù)保養(yǎng)作業(yè)指導(dǎo)書BallDropmachineOperationandmaintenanceOperatinginstructions擬制審核批準(zhǔn)修訂記錄版本修訂內(nèi)容修訂日期修訂者備注V1.0首次正式發(fā)布

1.Purpose/目的Standardizetheoperationmethodofballdropstationoperatorandmaintenancemethodofequipmenttechnician./規(guī)范植球機(jī)崗位操作員作業(yè)方法和設(shè)備技術(shù)員維護(hù)保養(yǎng)方法。2.Range/范圍Suitableforballdropmachine(SBM371SBI371)./適用于植球機(jī)(SBM371SBI371)植球設(shè)備應(yīng)用。Duties/職責(zé)3.1Techniciansperformcorrectoperationandmaintenanceofequipmentasrequired/技術(shù)員按要求對設(shè)備進(jìn)行正確的操作維護(hù)保養(yǎng)3.2Theoperatorcorrectlyoperatedtheballdropmachineandcompletedtheworknormally/作業(yè)員正確操作植球機(jī)，正常完成作業(yè)3.3Familiarwiththesafetysignsontheequipmentandsafeoperation/熟知設(shè)備上面的安全標(biāo)識，安全操作Operationcontentorstep/操作內(nèi)容或步驟4.1Mainswitches,buttons,devices：/主要開關(guān)、按鈕、裝置:4.1.1Equipmentfrontintroduction/設(shè)備正面介紹 4.1.2Internalstructure/內(nèi)部構(gòu)造Controlpanel/控制面板（SBM）Pressthebuttontopoweronthedevice/按下按鈕設(shè)備通電Pressthebuttontopoweroffthedevice/按下按鈕設(shè)備斷電Pressthebuttontostartthedevice/按下按鈕設(shè)備開始運(yùn)轉(zhuǎn)Pressthebuttontostopthedeviceafteracertainperiodofaction/按下按鈕設(shè)備某個周期動作完成后停止運(yùn)轉(zhuǎn)Pressthebuttontoresetoreliminatetheerrormessage/按下按鈕復(fù)位或消除錯誤提示Theselectedaxiscanbemovedduringmanualoperationbypressingabutton/按下按鈕手動操作時可以移動被選擇的軸Pressthebuttonand(6)canmovetheaxisathighspeed/按下按鈕配合（6）可以高速移動軸Buzzer/蜂鳴器Controlpanel/控制面板（SBI）Pressthebuttontopoweronthedevice/按下按鈕設(shè)備通電Pressthebuttontopoweroffthedevice/按下按鈕設(shè)備斷電Pressthebuttontostartthedevice/按下按鈕設(shè)備開始運(yùn)轉(zhuǎn)Pressthebuttontostopthedeviceafteracertainperiodofaction/按下按鈕設(shè)備某個周期動作完成后停止運(yùn)轉(zhuǎn)Pressthebuttontoresetoreliminatetheerrormessage/按下按鈕復(fù)位或消除錯誤提示Buzzer/蜂鳴器4.2Bootsteps/開機(jī)步驟：4.2.1Boot/開機(jī)（SBM/SBI）TurnontheSBMequipmentpowerswitch/打開SBM設(shè)備電源開關(guān)TurnonthepowerswitchoftheSBIdevice/打開SBI設(shè)備電源開關(guān)PresstheSBMPOWERONswitch/按下SBMPOWERON開關(guān)PresstheSBIPOWERONswitch/按下SBIPOWERON開關(guān)4.3Equipmentoperation(returntoorigin)andprogramcall：/設(shè)備運(yùn)轉(zhuǎn)（歸原點(diǎn)）和程序調(diào)用：4.3.1Homing/歸原點(diǎn)（SBM）①ConfirmthatboththePOWERONandSTOPbuttonsarelit/確認(rèn)POWERON和STOP按鈕都亮燈②Confirmthattheservopowerison,thecomputerison,andthevacuumpumpisworking/確認(rèn)伺服電源開啟，計算機(jī)開啟，真空泵工作③SelectINITIALIZEtoHOMEALLAXIS,untilallbuttonschangefromdarkgreentolightgreen,andreturntozero./選擇INITIALIZEHOMEALLAXIS,直至所有按鈕由暗綠變?yōu)榱辆G，歸零OK.4.3.2Homing/歸原點(diǎn)（SBI）①ConfirmthatboththePOWERONandSTOPbuttonsarelit/確認(rèn)POWERON和STOP按鈕都亮燈②Makesuretheservopowerisonandthecomputerison/確認(rèn)伺服電源開啟，計算機(jī)開啟③SelectINITIALIZEtoHOMEALLAXIS,untilallbuttonschangefromdarkgreentolightgreen,andreturntozero./選擇INITIALIZEHOMEALLAXIS,直至所有按鈕由暗綠變?yōu)榱辆G，歸零OK.4.3.3SBMsoftwareoperationandprogramcallingsteps：/SBM軟件運(yùn)行和程序調(diào)用步驟：①Clicktoenterthecallingprograminterface,selecttheprogram,click,theprogramhasbeendownloadedtoSBM/點(diǎn)擊，進(jìn)入調(diào)用程序界面，選擇程序，點(diǎn)擊，程序已下載到SBM②Aftercallingtheprogram,youneedtoclickreturntotheorigin/調(diào)用程序后需要?dú)w原點(diǎn)，點(diǎn)擊歸原點(diǎn)③Pressthecontrolpanel"START",thedevicewillrunautomaticallyafter4beeps/按下控制面板“START”，響4聲后設(shè)備自動運(yùn)轉(zhuǎn)4.3.4SBIsoftwareoperationandprogramcallingsteps:/SBI軟件運(yùn)行和程序調(diào)用步驟：①Clicktoenterthecallingprograminterface,selecttheprogram,click,theprogramhasbeendownloadedtoSBI./點(diǎn)擊，進(jìn)入調(diào)用程序界面，選擇程序，點(diǎn)擊，程序已下載到SBI。②Pressthecontrolpanel"START",thedevicewillrunautomaticallyafter4beeps./按下控制面板“START”，響4聲后設(shè)備自動運(yùn)轉(zhuǎn)。4.3.5Shutdownsteps:/關(guān)機(jī)步驟：Allaxesreturntotheorigin/所有軸歸原點(diǎn)PressthePOWEROFFbutton/按下POWEROFF按鈕（SBM/SBI）Turnoffthepowerswitch,turnoffSBIfirst,thenturnoffSBM/關(guān)閉電源開關(guān)，先關(guān)閉SBI，再關(guān)閉SBM4.3.6SBMmanualdippingoperationsteps(forSBMfirstarticledipping)：/SBM手動蘸膠操作步驟（用于SBM首件蘸膠）：①CheckthePCBballdropsurfaceforforeignmatter,oilpollution,etc.TheMARKpositionmustnotbesmeared.Ifthereisany,pleasereportittothetechnicianimmediately/檢查PCB植球面是否有異物、油污等不良，MARK位置不能贓污，如有立即反饋技術(shù)員②PutthePCBintothefixturecorrectlyaccordingtothedirectionoftheprogramintotheboard,andputthefixtureintothetrackentranceinthecorrectdirection/將PCB按照程序進(jìn)板方向正確放入夾具，將夾具按照正確方向放入軌道入口③SelecttheTESTinterface,selecttheMODEinterface,andclicktheCARRYbuttontwicetomovethefixturetothejackingposition/選擇TEST界面，選擇MODE界面，點(diǎn)擊CARRY按鈕2次，讓夾具移動到植球平臺頂起位置=4\*GB3④Observewhetherthevacuumvalueofthevacuumsensorisabovethesetvalue,clickFLUXSQUEEZE,andpresstheSTARTkeyonthecontrolpaneltoallowthescrapertoscrapeafewcyclestoensureuniformflux/觀察真空傳感器真空值是否在設(shè)定值之上，點(diǎn)擊FLUXSQUEEZE，按下控制面板上的START鍵，讓刮刀循環(huán)刮幾個，保證助焊膠均勻。SelecttheMANAULinterface,selecttheFLUXinterface,selecttheXYθinterface,andclickPICKUPtomovethedispensingheadtothedippingposition/選擇MANAUL界面,選擇FLUX界面，選擇XYθ界面，點(diǎn)擊PICKUP,讓點(diǎn)膠頭移動到蘸膠位置SelecttheZ/SQUEEZEinterface,clickDOWN,andthenclickUP,sothatthePINpinisdippedinflux/選擇Z/SQUEEZE界面，點(diǎn)擊DOWN，再點(diǎn)擊UP，讓PIN針蘸上助焊膠ReturntotheXYθinterface,enterthepositionofthepuzzleintheDEVICENOdialogbox,clickMARK1inFLUXXYSUPPORTθ,andclickMARK1inVISIONINSPECTION.MARK2operatesinthesamewayasMARK1tocorrectthepositionofthedippingglueonthePCB./返回XYθ界面，DEVICENO對話框中輸入拼板位置，點(diǎn)擊FLUXXYSUPPORTθ中的MARK1,點(diǎn)擊VISIONINSPECTION中的MARK1，MARK2同MARK1操作，校正PCB上的蘸膠位置ClickTRANS(VISON)inFLUXXYSUPPORTθtomovethedispensingheadtothedippingposition/點(diǎn)擊FLUXXYSUPPORTθ中的TRANS(VISON),將點(diǎn)膠頭移動到蘸膠位置ReturntotheZ/SQUEEZEinterface,clickDOWN,andthenclickUP/返回Z/SQUEEZE界面，點(diǎn)擊DOWN，再點(diǎn)擊UPReturntotheXYθinterface,clickPICKtomovethedispensingheadbacktothedispensingposition/返回XYθ界面，點(diǎn)擊PICK，將點(diǎn)膠頭移回點(diǎn)膠位置ReturntotheTESTinterfaceandclicktheCARRYbuttontotransferthedispensedPCBtotheexitposition/返回TEST界面，點(diǎn)擊CARRY按鈕，將點(diǎn)膠的PCB傳到出口位置SelecttheBALLinterface,clicktheXYθinterface,andclickMOUNT(VISION)tomovetheballdropaxistothemiddlepositionforeasyPCBremoval/選擇BALL界面，點(diǎn)擊XYθ界面，點(diǎn)擊MOUNT(VISION)，將植球軸移到中間位置，便于取出PCBRemovethePCBmanuallyfromthetrackexit/手動從軌道出口取出PCB，注意清拿輕放PutthedippedPCBunderthemicroscopeandobservewhetherthedippedpositionandtheamountofdippedareOK.Ifitfails,youneedtoadjusttheparametersandmakethefirstpieceagain/將蘸膠的PCB放到顯微鏡下觀察蘸膠位置和膠量是否OK，如不合格，需要調(diào)整參數(shù)再次做首件。4.3.7SBMmanualballdropsteps(forthefirstarticleballdropofSBM)/SBM手動植球操作步驟（用于SBM首件植球）：PutthedippedPCBintothefixturecorrectlyaccordingtothedirectionoftheboardintotheprogram,andputthefixtureintothetrackentranceinthecorrectdirection/將蘸膠PCB按照程序進(jìn)板方向正確放入夾具，將夾具按照正確方向放入軌道入口SelecttheTESTinterface,selecttheMODEinterface,andclicktheCARRYbuttontwicetomovethefixturetothejackingposition/選擇TEST界面，選擇MODE界面，點(diǎn)擊CARRY按鈕2次，讓夾具移動到植球平臺頂起位置SelecttheMANAULinterface,selecttheFLUXinterface,selecttheXYθinterface,andclickPICKUPtomovethedispensingheadtothedippingposition/選擇MANAUL界面,選擇FLUX界面，選擇XYθ界面，點(diǎn)擊PICKUP,讓點(diǎn)膠頭移動到蘸膠位置SelecttheFLUXinterface,XYθinterface,enterthelocationofthepuzzleintheDEVICENOdialogbox,clickMARK1inFLUXXYSUPPORTθ,andclickMARK1inVISIONINSPECTION.MARK2operatesinthesamewayasMARK1tocorrectthedippingpositiononthePCB.Aftertheballplantingposition,itisnecessarytoidentifytheMARKcorrectionballplantingpositionbeforetheballdrop.Ifthisisnotremoved,thisstepisnotrequired.)/選擇FLUX界面，XYθ界面，DEVICENO對話框中輸入拼板位置，點(diǎn)擊FLUXXYSUPPORTθ中的MARK1,點(diǎn)擊VISIONINSPECTION中的MARK1，MARK2同MARK1操作，校正PCB上的蘸膠位置(粘膠板排出植球位置后，植球前需要再次識別MARK校正植球位置，如不移除，則不需此步驟)SelecttheBALLinterface,selecttheXYθinterface,andclickthePICKbuttontomovethebumpertothepositionwherethesolderballissucked/選擇BALL界面，選擇XYθ界面，點(diǎn)擊PICK按鈕，將植球吸盤移到吸取錫球的位置SelecttheZ/TRAYinterface,clickPICKUPinBALLZ1CYCLE,suckthesolderballintothesuctioncupnozzle,andclickDOUBLE/選擇Z/TRAY界面，點(diǎn)擊BALLZ1CYCLE中的PICKUP，將錫球吸入吸盤吸嘴，點(diǎn)擊DOUBLE(7)ReturntotheXYθinterfaceandclickREJECTtocheckiftherearemoreballsonthenozzleplate/返回XYθ界面，點(diǎn)擊REJECT,檢查吸嘴盤上是否多球(8）IickMOUNT(VISION),movethenozzleplatetotheballdropposition,returntotheZ/TRAYinterface,andclickMOUNTinBALLZ1CYCLEtocompletetheballpntheDEVICENOdialogbox,enterthepuzzlecorrespondingtothedippingposition,cllantingaction/DEVICENO對話框中輸入與蘸膠位置對應(yīng)的拼板，點(diǎn)擊MOUNT(VISION)，將吸嘴盤移動到植球位置，返回Z/TRAY界面，點(diǎn)擊BALLZ1CYCLE中的MOUNT,完成植球動作ClickFEEDinBALLZtomovetheZaxisoftheballtothetransportheight,returntotheXYθinterface,clickREJECTtomovetheheadtothethrowingposition/點(diǎn)擊BALLZ中的FEED，將植球Z軸移動到搬運(yùn)高度，返回XYθ界面，點(diǎn)擊REJECT，將頭部移動到拋料位置ReturntoZ/TRAYinterface,clickonREMAIN,returntoXYθinterface,clickonPICK,andcheckifthereisaresidualball/返回Z/TRAY界面，點(diǎn)擊REMAIN,返回XYθ界面,點(diǎn)擊PICK，檢測是否有殘球SelecttheTESTinterfaceandclicktheCARRYbuttontotransferthedispensedPCBtotheexitposition/選擇TEST界面，點(diǎn)擊CARRY按鈕，將點(diǎn)膠的PCB傳到出口位置ReturntotheBALLinterface,clicktheXYθinterface,andclickMOUNT(VISION)tomovetheball-plantingaxistothemiddleforeasyremovaloftheballdropboard/返回BALL界面，點(diǎn)擊XYθ界面，點(diǎn)擊MOUNT(VISION)將植球軸移動到中間便于取出植球板Removetheballdropplatefromtheexitposition,payattentiontoholdingyourbreath,clearandgently,andtakeitouthorizontally/將植球板從出口位置取出，注意屏息、清拿輕放，水平取出(14)PuttheballdropplateunderthemicroscopetoseeifitisOK.Ifitfails,youneedtoadjusttheparametersandmakethefirstpieceagain./將植球板放入顯微鏡下觀察是否OK，如不合格，需要調(diào)整參數(shù)再次做首件。4.3.8SBImanualoperationsteps(forSBImanualtesting)：/SBI手動操作步驟（用于SBI手動測試）：Puttheballdropboardintotheentranceofthetrackinthecorrectdirection/將植球板按正確方向放入軌道入口SelecttheTESTinterfaceandclickINPUTtomovetheballdropplatetothedetectionposition/選擇TEST界面，點(diǎn)擊INPUT，將植球板移動到檢測位置ClickontheY-AXISINSPECTIONdrop-downlistaboveandselectthepositiontobedetectedintheYdirection/點(diǎn)擊上面Y-AXISINSPECTION下拉列表，選擇Y方向需要檢測的位置ClickMARKINSPECTIONtoidentifyallMARKsintheselectedpartof(3)/點(diǎn)擊MARKINSPECTION，識別(3)中選擇部分的所有MARKClicktheY-AXISINSPECTIONdrop-downlistbelow,selectthepositiontobedetectedintheYdirection,(3)(5)TheYdirectionneedstobeconsistent,andclicktheDEVICENOdrop-downlisttoselectthedetectionpuzzle/點(diǎn)擊下面Y-AXISINSPECTION下拉列表，選擇Y方向需要檢測的位置，(3)(5)Y方向需一致，點(diǎn)擊DEVICENO下拉列表選擇檢測的拼板ClickBALLINSPECTION,thedialogboxontheleftwilldisplaythedetectionscreen/點(diǎn)擊BALLINSPECTION，左邊的對話框會顯示檢測畫面ClickOUTPUTPOSITIONtoselectthepositionwherethesubstrateisdischarged(selectOUTPUT1,dischargetotheexitposition,selectREJECT,dischargetotheabnormalplatedischargeposition),clickOUTPUT,andpressSTARTonthecontrolpaneltoexcludetheplate/點(diǎn)擊OUTPUTPOSITION選擇基板排出的位置（選擇OUTPUT1，排出到出口位置，選擇REJECT，排出到異常板排出位置），點(diǎn)擊OUTPUT，按下控制面板上的START，將板排除SelectMANUALinterface,selectTRANSFER,andclickREJECTPOSITIONinSHUTTLEMOTOR/選擇MANUAL界面，選擇TRANSFER，點(diǎn)擊SHUTTLEMOTOR中的REJECTPOSITIONClickONinREJECTCONVEYORandBACKWARDinSHUTTLECONVEYOR/點(diǎn)擊REJECTCONVEYOR中的ON，點(diǎn)擊SHUTTLECONVEYOR中的BACKWARDClickinREJECTUNIT,clickSEND/點(diǎn)擊REJECTUNIT中的，點(diǎn)擊SEND(11)OpentheprotectivecoverandremovethePCB/將保護(hù)罩打開，取出PCB4.3.9SoftwareInterface(SBM)Introduction/軟件界面（SBM）簡介Thebootinterfaceisasfollows:/開機(jī)界面如下：Initialization,thedevicereturnstotheorigin(mustbereturnedtotheoriginafterstartingupandcallingtheprogram)/初始化，設(shè)備歸原點(diǎn)（開機(jī)和調(diào)用程序后必須歸原點(diǎn)）Automaticoperation,usedinnormalcontinuousoperation/自動運(yùn)行，正常連續(xù)運(yùn)轉(zhuǎn)時使用Manualsingle-stepoperation,usedwhenconfirmingthefirstitemorcheckingequipment/手動單步動作，確認(rèn)首件或檢查設(shè)備時使用Themechanicaldevicecanbemovedtoacertainposition,andtheentiresetofactionsofacertaindevicecanbecompleted/可將機(jī)械裝置移動到某個位置，可以完成某個裝置的整套動作Historyrecordtoqueryallerrororwarningrecordsduringtheoperationofthedevice/歷史記錄，可查詢設(shè)備運(yùn)行期間的所有錯誤或警示記錄Usedtodisplaycallableprograms,makeprograms,debugprograms,modifyequipmentparameters,etc/顯示可調(diào)用的程序，制作程序，調(diào)試程序，修改設(shè)備參數(shù)等用到Theautomaticoperationinterfaceisasfollows：/自動運(yùn)轉(zhuǎn)界面如下：Showcurrentproductionstatus/顯示當(dāng)前生產(chǎn)狀況Displaythecurrentoperationmode(automaticoperationordryoperation)/顯示當(dāng)前運(yùn)行模式（自動運(yùn)轉(zhuǎn)或空運(yùn)轉(zhuǎn)）Displaythecurrentcameraidentificationscreen/顯示當(dāng)前相機(jī)識別畫面Manualmainoperationmaininterfaceisasfollows：/手動主操作主界面如下：Cameradisplay/相機(jī)顯示畫面Single-stepoperationsuchasgluesupply,detection,scrapingspeed,dippingaction,etc/膠量供應(yīng)，檢測，刮膠速度，蘸膠動作等單步操作Single-stepoperationofsolderballsuction,inspection,placement,supplydeviceoperation,etc/錫球吸取，檢測，貼裝，供應(yīng)裝置動作等單步操作Motorrunningstatus,unlocking,locking,moving,etc/馬達(dá)運(yùn)行狀態(tài)，解鎖、鎖定、移動等操作I/Osignalinterface/I/O信號界面Manualoperationinterfaceforeachaxiscarryingaction/各軸搬運(yùn)動作手動操作界面Operationinterfaceforengineers/為工程師操作界面Displaythecurrenterrorlistandcommandresponse/顯示當(dāng)前的錯誤列表和命令回應(yīng)Selecttheinformationinthelist/選中會自動跳出list中的信息TESToperationinterfaceisasfollows:/TEST操作界面如下：Completeacompletesetofrailhandlingactions/完成一個整套軌道搬運(yùn)動作Completeacompletesetofdispensingactions/完成一個整套點(diǎn)膠動作Completeacompleteballdropaction/完成一個整套植球動作Displaythenumberofmulti-ballboards/顯示多球板數(shù)Displaythenumberofmissingboards/顯示缺失球板數(shù)Completeasetofscraperscrapingoperations/完成一個刮刀刮膠整套動作Thenumberfilledinisthenumberofscrapingcycles/填寫的數(shù)字為刮膠循環(huán)的次數(shù)Startautomaticgluesupply/啟動自動供膠Completeacompletesetofmovementsandacompletesetofballs/完成一個搬運(yùn)整套動作和一個植球整套動作Repeatsuctionandreturnthesolderballtothedevice/重復(fù)吸球和將錫球放回裝置Displaythecurrenterrorlistandcommandresponse/顯示當(dāng)前的錯誤列表和命令回應(yīng)Checkingwillautomaticallypopouttheinformationinthelist/選中會自動跳出list中的信息Themaininterfaceofparameteradjustmentisasfollows：/參數(shù)調(diào)整主界面如下：ListfilesinSBMlocaldisk/列表中顯示SBM本地磁盤中的文件ListfilesinexternalUSBflashdrive/列表中顯示外接U盤中的文件Sortbydate/按日期排序Sortbyfilename/按文件名稱排序Filedisplaylist/文件顯示列表Callingprocedure/調(diào)用程序Saveorsaveanewprogram(Note:thenewprogramisautomaticallycalledwhentheprogramnameischanged)/保存或另存新的程序（注意：更改程序名保存時會自動調(diào)用新程序）RemoveProgram/刪除程序UnmountUdisk(mustclickbeforeunpluggingUdisk)/卸載U盤（拔出U盤前必須點(diǎn)擊）Openlocaldisk/打開本地磁盤OpenUSBstick/打開U盤Selectanotherpositiondisk/選擇其他位置盤Closetheinterface/關(guān)閉界面TheinputinterfaceofsubstratesizeandMARKcoordinatesareasfollows:/基板尺寸，MARK坐標(biāo)等輸入界面如下：Thedistancebetweenthepiecesandtheoriginpositionissetasfollows:/拼板間距，原點(diǎn)位置設(shè)定如下：ThefoolproofMARKcoordinateinputinterfaceisasfollows：/防呆MARK坐標(biāo)輸入界面如下：ThefoolproofMARKloginandadjustmentinterfaceisasfollows：/防呆MARK登錄、調(diào)節(jié)界面如下：Camerascreen/相機(jī)畫面ON:Livescreenisdisplayedin(1),OFF:Livescreenisnotdisplayedin(1)/ON：（1）中顯示現(xiàn)場畫面，OFF:（1）中不顯示現(xiàn)場畫面LogintoMARK/登錄MARKShowlogineffect/顯示登錄效果FindtheloginMARK/查找登錄MARKSavethepicturetothedisklocation/保存圖片到磁盤位置Lightingdevice,whichcanbeturnedon,offandadjusted/照明裝置，可打開，關(guān)閉，調(diào)節(jié)照明ThepositionofthesubstrateMARKandthelogininterfaceareasfollows:/基板MARK位置和登錄界面如下：Whichpuzzletochoose/選擇哪個拼板Showpuzzleposition/顯示拼板位置ShowMARKcoordinates/顯示MARK坐標(biāo)FLUXaxisangularoffset/FLUX軸角度偏移Movetothespecifiedposition(MARKandplacementposition)/移到到指定的位置（MARK和貼片位置）FLUXshaftheadposition/FLUX軸頭部位置Cameradisplayscreen/相機(jī)顯示畫面MARKselection/MARK選擇Whethertodisplaythelivescreen/是否顯示現(xiàn)場畫面LogintoMARK/登錄MARKDisplayrecognitionstatus/顯示識別狀態(tài)FindtheregisteredMARK/尋找登錄的MARKThefollowingisanintroductiontosomeoftheoperatinginterfacesofSBIequipment/以下為SBI設(shè)備部分操作界面簡介Theinitializationinterfaceisasfollows:/初始化界面如下：Returntoorigin/歸原點(diǎn)Automaticoperationinterface/自動運(yùn)轉(zhuǎn)界面Manualoperationinterface/手動操作界面Testinterface/測試界面History/歷史記錄Callmodificationprogram,equipmentparametersettinginterface/調(diào)用修改程序，設(shè)備參數(shù)設(shè)定界面Theautomaticoperationinterfaceisasfollows:/自動運(yùn)轉(zhuǎn)界面如下：Manualoperationinterfaceisasfollows:/手動操作界面如下：Thebeltisturnedon/皮帶轉(zhuǎn)動開啟Adjustingtheheightofthesupportplatform/調(diào)整支撐平臺高度Afterclicking,themotorwillruntothecorrespondingposition/點(diǎn)擊后馬達(dá)運(yùn)轉(zhuǎn)到相應(yīng)位置Clicktocontrolthetransferdirection/點(diǎn)擊控制傳送方向Controlbafflelift/控制檔板升降Pushplateforcontrollingtrackexitforwardorbackward/控制軌道出口的推板前進(jìn)或后退Unloadingthesubstratestartsorstops/卸載基板開始或停止Controltheactionoftheoutletrowdevice/控制出口排板裝置動作TESTinterfaceisasfollows:/TEST測試界面如下：Cameradisplayinterface/相機(jī)顯示界面Completeasetofactionstotransferthesubstratetotheinspectionposition/完成一個傳送基板至檢測位置的整套動作Clicktest④partofthesubstrateMARK/點(diǎn)擊測試④的部分基板MARKChoiceofsubstrateMARKtestposition/基板MARK測試位置選擇SaveMARKpicture/保存MARK圖片Repeateddetection/多次重復(fù)檢測Test⑧partofthesubstrate/檢測⑧的部分基板Inspectionofsubstratebumptest/基板植球測試部分檢測Chooseapuzzlelocation/選擇拼板位置Showtheballdropdetectioninterface/顯示植球檢測界面Savetestpicture/保存檢測圖片Clicktoimportthesubstrateintothetrackexclusionposition/點(diǎn)擊將基板導(dǎo)入軌道排除位置Selectwhichexclusiondevicetoexcludesubstratesto/選擇將基板排除到哪個排除裝置Completeacompletesetofboardmoves,excludeto/完成一個整套的排板動作，排除到Theparameteradjustmentinterfaceisasfollows:/參數(shù)調(diào)整界面如下：Filecall,modify,saveinterface/文件調(diào)用，修改，保存界面Programproductioninterface/程序制作界面Calibrationinterface/校正界面Systemsettingsinterface/系統(tǒng)設(shè)置界面Machineparameterinterface/機(jī)器參數(shù)界面Displaythecurrentcamerainterface/顯示當(dāng)前相機(jī)界面Outputmachineparameters/輸出機(jī)器參數(shù)Thefollowingisthesolderballpatternmakinginterfaceofthedetectionprogram.Itmainlyuses2operations/以下是檢測程序錫球圖案制作界面，主要用到2個操作Boardediting,BGAgraphiceditinginterface/基板編輯、BGA圖形編輯界面Testparametersettinginterfaceafterballdrop/植球后檢測參數(shù)設(shè)置界面ThefollowingistheloginsettinginterfaceofthepuzzleOFFSETandthedaughterboardMARK:/以下為拼板OFFSET和子板MARK的登錄設(shè)定界面：Substrateschematic/基板示意圖Numberofjigsawpieces,coordinates,andboardsize/拼板數(shù)量、坐標(biāo)、基板尺寸ThereferencepositionandMARKcoordinatesselectedbythedaughterboardMARK/子板MARK選取的基準(zhǔn)位置、MARK坐標(biāo)Confirminputandexit/確定輸入并退出Thefollowingisthesettinginterfaceofthescanningmethod:/以下為掃描方式的設(shè)定界面：schematicdiagram/拼板示意圖Numberofboards/拼板數(shù)量ScansinXdirection/X方向掃描次數(shù)NumberofscansinY/Y方面掃描次數(shù)Xspacing,thisspacingshouldbelessthanthepanelspacingsetinBOARD/X間距，此間距需小于BOARD中設(shè)置的拼板間距Yspacing,thisspacingshouldbelessthanthepanelspacingsetinBOARD/Y間距，此間距需小于BOARD中設(shè)置的拼板間距Thefollowingistheballplantingpatternsetting:/以下為植球圖案設(shè)定:Solderballpatterndisplay/錫球圖案顯示Solderballdiameter/錫球直徑Solderballpatternserialnumber(upto10patternscanbeset)/錫球圖案序號（最多可設(shè)置10種圖案）NumberofsolderballsinXdirection/X方向錫球個數(shù)NumberofsolderballsinYdirection/Y方向錫球個數(shù)X-directionspacing/X方向間距Y-directionspacing/Y方向間距Tinballcentercoordinates/錫球中心坐標(biāo)Adjustsolderballarrangement,deleteoneeveryother/調(diào)整錫球排列，隔一個刪除一個Thefollowingisthepatterncombinationsettinginterface/以下為圖案組合設(shè)定界面Displaysolderballpattern/顯示錫球圖案Solderballpatternnumber/錫球圖案序號Combineandnamedifferentpatterns/將不同的圖案組合并命名Combinationnamelistcolumn/組合名稱列表欄Determinethecombination/確定組合Deletecombination/刪除組合Show①Numberoftinballs/顯示①中錫球的個數(shù)ThefollowingisthescanrangeanddaughterboardMARKlogininterface/以下為掃描范圍和子板MARK登錄界面Displaythecurrentimageofthecamera/顯示相機(jī)當(dāng)前的影像DisplayselectedY-axisposition/顯示選擇的Y軸位置Startandendpositionsofthecamerascan/相機(jī)掃描的起點(diǎn)和結(jié)束位置CAPTURE:ClicktocaptureMARKgraphics/CAPTURE：點(diǎn)擊捕獲MARK圖形LoginandregisterMARK/登錄注冊MARKSelectthecorrespondingMARKregisteredin⑤fortheMARKsetinthepuzzle/為拼板中設(shè)定的MARK選擇⑤中登錄的對應(yīng)MARKThefollowingistheparameterinterfacefordetectingsolderballerror/以下為檢測錫球誤差參數(shù)界面Cameradisplay/相機(jī)顯示畫面Inputofparametersfordetectingsolderballpositionandquantity/檢測錫球位置，數(shù)量等項(xiàng)目的參數(shù)的輸入Clicktoselecttheitemsthatneedtobetestedforsolderballs(lessballs,abnormalsamples,position,size,spacing)/點(diǎn)擊可選擇錫球需要檢測的項(xiàng)目（少球、異樣、位置、大小、間距）SelectthepositionoftheY-axisscanningsurface/選擇Y軸掃面的位置Plantingpositiondisplayrange(largerthanthecomponentsizewhensetting,topreventmisidentification)/植球位置顯示范圍（設(shè)置時比元件尺寸稍大即可，防止誤識別）Capturesolderballdetectionscreen/LOADpictureorsavepicture/捕獲錫球檢測畫面/LOAD圖片或保存圖片Detectsolderballs,thelistontheleftwillshowtherecognitionresult/檢測錫球，左邊的列表會顯示識別結(jié)果Selectthesolderballtodetecttheselectedpuzzleposition/選擇檢測選擇的拼板位置的錫球5.Maintenancerequirements/維護(hù)保養(yǎng)要求Daymaintenancecontent/日保養(yǎng)內(nèi)容：Removedustfromequipmentsurface/清除設(shè)備表面灰塵.Whethertheemergencyswitchisnormal/緊急開關(guān)是否正常.Whetherthepowerindicatorisnormal/電源指示燈是否正常.Isthebarometerat0.5MPa/氣壓表是否在0.5MPa.Noabnormalnoiseduringequipmentoperation/設(shè)備運(yùn)行無異響.DispensedPINneedlewithoutdirtandbend/點(diǎn)膠PIN針無臟污及彎曲.Nodirtandscratchesonthesupplytray/供膠托盤無臟污、劃傷.Thescraperhasnodirtanddeformation,andthefluxspreadsevenly/刮刀無臟污變形，助焊劑攤開均勻.Thescraperhasnodirtanddeformation,andthefluxspreadsevenly/錫球供應(yīng)盤無臟污堵塞.Weekmaintenancecontent/周保養(yǎng)內(nèi)容：Checktheconveyorbeltforcracksandcreases/檢查傳送皮帶無裂紋、折痕.Checkthesensitivityofeachsensor/檢查各感應(yīng)器靈敏度.Cleansupportplatformsandtracks/清潔支撐平臺及軌道.Cleanthefans,Cleandustinsidethecase/清潔各風(fēng)扇，清潔機(jī)箱內(nèi)部灰塵.Checkforloosedeformationofthecontrolpanelbuttons/檢查控制面板按鈕有無松弛變形.5.3Monthmaintenancecontent/月保養(yǎng)內(nèi)容：Checkeachrefuelingpositionandaddlubricant/檢查各加油位置并加潤滑油.Checkthattheairintakefilteroftheequipmentisnotblocked/檢查設(shè)備進(jìn)氣過濾器無堵塞.theatomizationseparatorisnoclogged/霧化分離器無堵塞.thevacuumfilteroftheplacementheadisnoclogged/貼裝頭真空過濾器無堵塞.Belttensioncheck，noslackslip/檢查皮帶張力，無松弛打滑.Checkthebrightnessofeachsensor/檢查各感應(yīng)器亮度.Checkeachmovementaxisisnoexcessivelymoved/檢查各運(yùn)動軸無移動過度.Inspecttheairhosefordamageandcracks,andforairleakage/檢查氣路軟管有無破損和裂紋，有無空氣泄漏.Checktheconnectorofeachlineisnoloose/檢查各線路連接頭無松弛.Thelocationisasfollows:/位置如下圖：Note:dailymaintenanceshallbecompletedbyproductionlineoperatorsandconfirmedbytechnicians.Weeklyandmonthlymaintenanceshallbecompletedbythetechnicianandconfirmedbythetechnicalforeman./注：日保養(yǎng)由產(chǎn)線作業(yè)員完成，技術(shù)員監(jiān)督確認(rèn)；周、月度保養(yǎng)由技術(shù)員完成，技術(shù)領(lǐng)班確認(rèn).6.Safetyprotectionandprecautions/安全防護(hù)及注意事項(xiàng)Pleasenotifythetechnicianwhentheequipmentisabnormal;/設(shè)備發(fā)生異常時請第一時間通知技術(shù)員處理；Cleansolderballsupplydevice(maintainedbytechnicianswithin2Hafterproductioniscompleted);/清潔錫球供應(yīng)裝置（生產(chǎn)完成后2H內(nèi)由技術(shù)員完成保養(yǎng)）；CleanthedippedPINneedledevice(maintainedbyatechnicianwithin2Hafterproductioniscompleted);/清潔蘸膠PIN針裝置（生產(chǎn)完成后2H內(nèi)由技術(shù)員完成保養(yǎng)）；Cleanthenozzledeviceoftheplacementhead(maintainedbyatechnicianwithin2Hafterproductioniscompleted);/清潔貼裝頭吸嘴裝置（生產(chǎn)完成后2H內(nèi)由技術(shù)員完成保養(yǎng)）；Cleanthefluxtrayandscraperdevice(maintainedbyatechnicianwithin2Hafterproductioniscompleted);/清洗助焊膠托盤和刮刀裝置（生產(chǎn)完成后2H內(nèi)由技術(shù)員完成保養(yǎng)）；Continuousproductionof2Hrequirescleaningthedippindevice;/連續(xù)生產(chǎn)2H需要清潔蘸膠PIN針裝置；Whenmaintainingthedispensingneedle,takecaretopreventitfromdeformingduetoimpact;/保養(yǎng)點(diǎn)膠針時注意輕拿輕放，防止撞擊導(dǎo)致變形；Thesolderballsinthethrowingboxcannotbeusedforproductionagain;/拋料盒中的錫球不可再次用于生產(chǎn)；Iftheequipmentisnotusedformorethan12H,changethewire,youneedtocleanthesuctionnozzleandfluxtraywithalcohol-dust-freeclothtoreproduce;/如果設(shè)備超過12H不用后換線，需要用蘸酒精的無塵布清潔吸嘴和助焊膠托盤再生產(chǎn)；Thetypeoffluxusedandthethicknessofthescraperneedtobeperformedaccordingtotheprocessrequirementsontheveneerflowchart.Every100largeboardsneedtobeinspectedandaddedwithflux.Afteraddingnewflux,youneedtomanuallyoperatethescrapertomovebackandforth.Severaltimestoensureuniformthicknessandmaterial./使用的助焊膠種類和刮膠厚度需要按單板流程圖上的工藝要求執(zhí)行，每生產(chǎn)完100片大板需檢查并添加助焊膠，添加新助焊膠后，需要手動操作刮刀來回運(yùn)轉(zhuǎn)幾次，保證厚度、材質(zhì)均勻。Theremovalandmaintenancemethodsofeachdeviceareasfollows:/各裝置拆除保養(yǎng)方法如下：Ⅰ.Themethodofremovingandcleaningthedippingdeviceisasfollows:/蘸膠裝置拆除并清潔方法如下：Startthesoftwareandreturntotheorigin/啟動軟件并歸原點(diǎn)MovetheFLUXshaftheadtothePICKpositionandopenthebackdoor/將FLUX軸頭部移至PICK位置，打開后門Holdbothsidesofthedispensingtransferheadwithbothhandsandremovethetwoscrews(ScrewKnob)ontheheadasshownbelow:/兩手拖住點(diǎn)膠傳送頭兩邊，拆除頭部的兩顆螺絲（ScrewKnob）如下圖：Takeoutthedispensingneedletrayslowlyandinparallel(note:thedispensingneedlecaneasilyhitotherobjectsandcausedeformation)/緩慢平行取出點(diǎn)膠針盤（注意：點(diǎn)膠針極容易撞到其他物體造成變形）Placethewet,clean,dust-freeclothflatonahorizontal