世界半導(dǎo)體生產(chǎn)機臺安全設(shè)計驗收標(biāo)準(zhǔn)英文模板資料內(nèi)容僅供您學(xué)習(xí)參考，如有不當(dāng)或者侵權(quán)，請聯(lián)系改正或者刪除。世界半導(dǎo)體生產(chǎn)機臺安全設(shè)計驗收標(biāo)準(zhǔn) Client-Confidential保密合約TheinformationusedtopreparethisreportwasbasedoninterviewswithAppliedMaterials’engineers.TheinformationwasalsobasedoninspectionsoftheChemicalMechanicalPolishingSystem,Model:MirraTrak.ThisinformationwasgatheredovertheperiodbetweenFebruary2,1998andFebruary4,1998,andduringare-inspectionofthesystemonJune3,1998.ApreliminaryassessmentofthesystemwasalsoperformedonSeptember25,1996throughSeptember26,1996andtheresultsofthisevaluationwerealsoused.AllobservationsandrecommendationsarebasedonconditionsanddescriptionsoftheChemicalMechanicalPolishingSystem,Model:MirraTrak,duringthetimeofdatacollectionanduponinformationmadeavailabletoGlobalSemiconductorSafetyServices.Thisreport'ssignificanceissubjecttotheadequacyandrepresentativecharacteristicsoftheChemicalMechanicalPolishingSystem,Model:MirraTrak,andtothecomprehensivenessofthetests,examinationsand/orsurveysmade.ReferencetoGlobalSemiconductorSafetyServices,includingreproductionofGlobalSemiconductorSafetyServices’servicemark,inpromotionalmaterials,ispermittedonlywithGlobalSemiconductorSafetyServices’expresswrittenconsent.Theserviceperformedhasbeenconductedinaccordancewiththestandardscurrentlyacceptedinourprofession,andatthehighlevelofskillandcareexercisedbyGlobalSemiconductorSafetyServices’staff.Lastly,thisreporthasbeenpreparedasaClient-Confidentialdocument,intendedfortheexclusiveuseofAppliedMaterialsandforthepurposeofdocumentationtoSEMIS2-93A.Therefore,nooutsidedistributionwilloccurunlesswrittenauthorizationisprovidedbytheclient. TABLEOFCONTENTS目錄Section PageNo.5.1PURPOSE(目的) GOTOBUTTON_Toc95.2SCOPE(適用范圍) GOTOBUTTON_Toc105.3SAFETYPHILOSOPHY(安全體系) GOTOBUTTON_Toc115.4GENERALGUIDELINES(指導(dǎo)方針) GOTOBUTTON_Toc135.5SAFETY-RELATEDINTERLOCKS(安全互鎖) GOTOBUTTON_Toc185.6CHEMICALS(化學(xué)品) GOTOBUTTON_Toc225.7IONIZINGRADIATION GOTOBUTTON_Toc255.8NON-IONIZINGRADIATION GOTOBUTTON_Toc265.9NOISE(噪音) GOTOBUTTON_Toc275.10VENTILATIONANDEXHAUST(通風(fēng)與排鳳) GOTOBUTTON_Toc285.11ELECTRICAL GOTOBUTTON_Toc335.12EMERGENCYSHUTDOWN(緊急停機) GOTOBUTTON_Toc415.13HEATEDCHEMICALBATHS GOTOBUTTON_Toc455.14HUMANFACTORSENGINEERING GOTOBUTTON_Toc465.15ROBOTICAUTOMATION GOTOBUTTON_Toc525.16HAZARDWARNING(危險警告) GOTOBUTTON_Toc535.17EARTHQUAKEPROTECTION(地震警告) GOTOBUTTON_Toc545.18DOCUMENTATION(文件) GOTOBUTTON_Toc575.19FIREPROTECTION(消防保護) GOTOBUTTON_Toc605.20ENVIRONMENTALGUIDELINES(環(huán)境方針) GOTOBUTTON_Toc62ILLUSTRATION1-MirraTrakSystemLayout GOTOBUTTON_Toc77Section1.0MANAGEMENTSUMMARYAfollow-upsafetyassessmentoftheAppliedMaterials’ChemicalMechanicalPolishingSystem,Model:MirraTrak(hereafterreferredtoastheMirraTrak),wasperformedfromFebruary2,1998throughFebruary4,1998.Afurtherre-inspectionofthesystemwasperformedonJune3,1998.ApreliminaryevaluationofthesystemwasalsoperformedonSeptember25,1996throughSeptember26,1996,andtheresultsofthisevaluationwerealsoutilizedinthisreport.Notethatthisreportcoversonlytheconcernsraisedbyintegratingthreeseparatesystems,theAppliedMaterialsFABSandMirraCMP,andtheOnTrakSynergyIntegra,whichtogetherformtheMirraTraksystem.Forfurtherinformationconcerningtheindividualcomponents,referencetheindividualSEMIS2-93Areportsfortheseunits.(GS3ReportNo.970668TF,datedJanuary30,1998fortheFABSsystem;GS3ReportNo.7-0100,datedSeptember2,1997fortheMirraCMPsystem;andGS3ReportNo.980094F,fortheOnTrakSynergyIntegra.)ThisreviewwasperformedusingthecriteriaestablishedbytheSemiconductorEquipmentandMaterialsInternationalSafetyGuidelinesforSemiconductorManufacturingEquipment(SEMIS2-93AGuidelines).GS3hasusedtheSEMIS10-1296GuidelineMethodologytoperformaRiskAssessmentofanyIssuesremainingafterthereviewoftheinformationprovidedbyAppliedMaterials.NotethattheseveritywasrankedbyGS3;theLikelihood(expectedrateofoccurrence)wasprovidedbyAppliedMaterials.Itemswhichwererankedonlyasa揕ow”or揝light”riskassessmentcategorymaybeconsideredasacceptablewithoutcorrectiveaction,baseduponcriteriaintheSEMIS10-1296Guidelines.DuringthesafetyassessmentofMirraTrak,GS3identifiedseveralpositiveengineeringdesigns,aswellasseveralissuesthatwillneedtobeaddressedinordertoachievefullcompliancewithSEMIS2-93AGuidelines.Thisdescriptionofbothpositiveengineeringdesignandnon-conformanceissuesarecomprehensivelydescribedinSection5.0ofthisreport.ReferenceSection6.0forasummaryoftheoutstandingitems.Section2.0SCOPEGS3wascontractedbyAppliedMaterialstoconductaSEMIS2-93AProductSafetyAssessmentoftheMirraTrak.NotethatthisreportcoversonlytheadditionalconcernsraisedbyintegratingtheAppliedMaterialsFABSandMirraCMPandtheOnTrakSynergyIntegratogethertoformtheMirraTraksystem.Forfurtherinformationconcerningtheindividualcomponents,referencetheindividualSEMIS2-93Areportsfortheseunits.(GS3ReportNo.970668T3F,datedJanuary30,1998fortheFABS;GS3ReportNo.7-0100,datedSeptember2,1997fortheMirraCMP;andGS3ReportNo.980094FfortheOnTrakSynergyIntegra).GS3isajointventurepartnershipbetweenIntertekTestingServices,N.A.,(ITS)andEnvironmentalandOccupationalRiskManagement,Inc.(EORM?).GS3isfocusedonprovidingriskmanagement-basedequipmentsafetyconsultingandtestingservicestosupportabroadrangeofsafetyneedsspecifictosemiconductormanufacturingequipmentanddevicemanufacturers.TheMirraTrakwasevaluatedforcompliancewiththeapplicablecodesandrequirementsoftheUnitedStates.There-inspectionassessmentwasperformedbyMr.AndrewKileyandMr.MichaelVargaofGS3andreviewedbyMr.PavolBrederandMr.AndrewMcIntyre,CIH,alsoofGS3.Thesafetyassessmentwasbasedonanin-plantinspectionoftheMirraTrak,discussionswithMs.LisaPowellofAppliedMaterials,aswellasareviewofthesystem'smanuals.2.1STANDARDSUSEDTheassessmentwasconductedinaccordancewiththeapplicableportionsofthefollowingcodesandstandards: A) SEMIS2-93A,SafetyGuidelinesForSemiconductorManufacturingEquipment(1996Edition) B) ANSIS1.13-1971,MethodsfortheMeasurementofSoundPressureLevels(1986Edition) C) ANSI/UL1262,SafetyStandardforLaboratoryEquipment(ThirdEdition) D) ANSI/NFPA79,ElectricalStandardforIndustrialMachinery(1994Edition) E) ANSI/NFPA70,NationalElectricalCode(1996Edition) F) UL50,SafetyStandardforEnclosuresforElectricalEquipment(TenthEdition) G) SEMIDoc.S8-95,SafetyGuidelineforErgonomics/HumanFactorsEngineeringofSemiconductorManufacturingEquipment.(1995Edition) H) SEMIS1-90,SafetyGuidelineforVisualHazardAlerts(1993Edition) I) ANSI/UL73,SafetyStandardforMotor-OperatedAppliances(EighthEdition) J) ANSI/S1.4-1984,SpecificationsforAcousticalCalibrators K) 21CFR,CodeofFederalRegulations,Part1000to1050. L) ANSI/UL3101-1,SafetyStandardforElectricalEquipmentforLaboratoryUse(FirstEdition) M) SEMIS10-1296,SafetyGuidelinesforRiskAssessment(1996Edition)2.2TESTSPERFORMEDInordertoverifycompliancewithSEMIS2-93AGuidelinesandtheotherapplicablestandards,thefollowingtestswereperformed: A) SurfaceLeakageCurrentTest B) GroundingResistanceTest C) VerificationofEMOs D) SoundPressureLevelSurveyNotethatonlythetestsnotedabovewererepeated,asthetestingoftheindividualassemblies(FABS,Mirra,andOnTrakSynergyIntegra)wasperformedasapartoftheindividualevaluationsforeach.Referencetheindividualreportsforeachfortestresults.Section3.0SYSTEMDESCRIPTIONTheMirraTrakconsistsofaFABSwaferhandlingmodule,aMirraChemicalMechanicalPolisher(CMP),andanOnTrakSynergyIntegra.Anoperatorcanloaduptofour8”wafercassettesatthefrontoftheFABSmoduleatonetime.CassettesmaybemovedintopositionforhandlingbytheFABSusinganoptionalergoloaderorbymanualrotationofthecassette.TheFABSrobotthenpicksupthewafersfromthecassettes,placestheminanalignmenttool,andthenpassesthewaferstotheCMP抯extendedrobotwaferhandlingmoduleforconveyancetotheCMP.TheCMPsystemismodularandconsistsofawaferhandlingmodule(whichmovesbetweentheFABS,SynergyIntegra,andCMP),apolishingmodule,aslurrydeliverymodule,andacontrolsystemmodule.Thesystemusesde-ionizedwater,cleandryair(CDA),nitrogen,vacuum,andslurry.Theslurryisprovidedbytheend-usertothesystemthroughabulkheadfacilityconnection.TheCMPisdesignedforoxideetchingandmetaletchingandisintendedforusewithavarietyofslurrychemistries,includingbasicandacidicslurries,butthissystemwasdesignedonlyfortheuseofapotassiumhydroxide(KOH)slurry,eventhoughotherchemistriescouldbeused.Thewaferhandlingmoduleisanexternalrobotictoolthatmanipulatesthewafercassettesfordeliverytothepolishingmodule.Thepolishingmoduleconsistsofthreepolishingheadsarrangedonamechanicalpositionercalledacarrousel.Apolishingheadpicksupawaferanddeliversittoapolishingpadwhereitispolished.Asthewaferispolished,theslurrydeliverymoduledispersesameasuredflowofslurry.Whenallpolishingstepsarecomplete,thecarouseltransfersthewaferbacktotheexternalCMProbotwhereitisdeliveredtotheOnTrakSynergyIntegra.TheOnTrakSynergyIntegraisadoublesidedwafercleanerusingoptionsforavarietyofchemicalprocesseswhichoperateinconjunctionwiththemechanicalprocesses.TheSynergyIntegrausesCDA,nitrogen,orargon.ItalsousesD.I.waterandammoniumhydroxide(NH4OH)ata2%or29%concentration.WhiletheSynergyIntegraisabletousehydrofluoricacid(HF)inoneofitsprocesses,thecurrentMirraTrakconfigurationisnotdesignedtouseHFandwasnotevaluatedforitsuse.TheSynergyIntegraconsistsofaninputstation,twobrushstations,aspinstation,anunloadhandler,andanoutputstationwhichpassesthewafersbacktotheFABSwhichreturnsthewaferstotheiroriginalcassetteswheretheyareunloadedbytheoperator.FacilitiesRequirements:ElectricalPower: 208VAC,200A,3phase,60Hz.ExternalFluids: Cleandryair: 90-110psi,1.2cfm Nitrogen: 90-110psi,1cfm Vacuum: 25inch.Hg DIwater: 75psi,6gpm Slurry: 0-5psi,0.25lpm Section4.0ASSESSMENT&TESTINGMETHODOLOGIESThecriteriaforthisevaluationwasbasedupontheSemiconductorEquipmentandMaterialsInternationalSEMIS2-93AGuidelines.SEMIS2-93AGuidelinesareperformance-basedguidelinesdesignedtoidentifypotentialhazardsduringtheoperationandmaintenanceofequipment,sothattheeffectivenessoftheengineeringcontrolsandfail-safesystemscanbemaximized.Theguidelinesaddressthefollowingaspects: APPLICABLESECTIONS NON-APPLICABLESECTIONS Safety-RelatedInterlocks IonizingRadiation Chemicals Non-IonizingRadiation AudioNoise HeatedChemicalBaths VentilationandExhaust RoboticsandAutomation Electrical EmergencyShutdown Ergonomics/HumanFactors HazardWarning EarthquakeProtection Documentation FireProtection Environmental Thenon-applicablesectionsaresupportedbyengineeringrationaleprovidedwithinthisreport.Toverifycompliancewiththeapplicableguidelinesandstandards,thefollowingtestswereperformed.Thetestdatasheetsareincludedintheattachmentstothisreport.SurfaceLeakageCurrentTest(Section11.3.3ofS2-93AandSection6.7ofUL1262)-Surfaceleakagecurrentmeasurementsweremadebetweenallaccessiblemetalpartsandground,toverifycompliancewiththemaximumacceptablesurfaceleakagecurrentof3.5milliamperes.(AttachmentOne)GroundingResistanceTest(Section11.3.3ofS2-93AandSection6.4.2ofUL1262)-Groundingresistancemeasurementsweremadebetweenallaccessiblemetalpartsandground,toverifycompliancewiththemaximumacceptablegroundpathresistanceof0.1ohm.(AttachmentTwo)VerificationofEMO/Interlocks(Sections5.6and12.1)-Withthesystemrunningatmaximumnormalload,theemergencyoffbuttonswereactivatedtoverifyproperoperation.(AttachmentThree)SoundPressureLevelSurvey(Section9.1)-SoundpressurelevelsweremeasuredperANSIS1.13-1971(R1986),"MethodsfortheMeasurementofSoundPressureLevels."Soundpressurelevelswererecordedwiththesystemrunningatmaximumnormalloadtoverifycompliancewiththemaximumacceptablenoiselevelof80dB(A).(AttachmentFour)Notethatonlythetestsnotedabovewererepeatedasthetestingoftheindividualassemblies(FABS,MirraandOnTrakSynergyIntegra)wasperformedasapartoftheindividualevaluationsforeach.Referencetheindividualreportsforeachfortestresults.Section5.0SAFETYASSESSMENTAnassessmentoftheMirraTrakwasperformedinaccordancewiththeSEMIS2-93AGuidelinesandotherapplicablestandardsnotedinSection2.0(Scope). EXPLANATIONOFREPORTFORMATUnlessotherwisespecified,allreferencedsectionsbelowrefertotheSafetyGuidelinesforSemiconductorManufacturingEquipment(SEMIS2-93AGuidelines).ThereportstructureismodeledafterthedocumentationrequirementsofSEMIS2-93AGuidelines.EachparagraphoftheSEMIS2-93AGuidelinesiseitherpresentedverbatimorparaphrasedinaboxontheleftofthepage.TheparagraphsfromtheSEMIS2-93AGuidelinesarepresentedwiththeircorrespondingnumbersfromtheGuidelines,withtheexceptionthatthesenumbersareproceededbya"5.".DirectlytotherightofthisboxisasecondboxwhichisusedtoindicatethestatusoftheequipmentwithrespecttothegivenrequirementoftheGuidelines.PRIVATESEMIS2-93AParagraphNo.(precededby"5.")Statementoftherequirement.MEETS[]ISSUE[]INFOREQUIRED[]RESPONDED[]N/A[]ADD[]REF[]Belowtheseboxes,anexplanationisgivenwhichexplainswhythatparticularstatusboxwaschecked.Thisexplanationtakesoneofthefollowingnineformswhichcorrespondtotheninestatusboxesabove. MEETS Asectionmarked"MEETS"withrespecttoagivenparagraphoftheGuidelinessignifiestheconstructionfeaturescriticaltocompliancewiththeSEMIS2-93Acriteriaweredirectlyobservedbytheengineerduringtheevaluation.Thesecriticalfeaturesareidentifiedanddescribed.Ifaconstructionfeaturedoesnotmeetthespecifiedparagraph,thewayinwhichitdeviatesfromtheGuidelinescriteriaisdescribed. INFORMATIONREQUIRED(INFOREQUIRED) Ifinadequateinformationisavailabletodeterminecomplianceornon-compliance,then"INFORMATIONREQUIRED"ismarked.Theadditionalinformationwhichisneededtoevaluatethesystemisalsoidentified. RESPONDED IftheoriginalevaluationrevealedthatthesystemdoesnotmeetaparticularrequirementoftheGuidelinesandthemanufacturerhascommittedtomakingsuitablechangeswhichwillbringthesystemintocompliance,thenthisparticularrequirementoftheGuidelinesismarked"RESPONDED."The"RESPONDED"designationrequiresthatthemanufacturer'scorrectiveactionadequatelyaddresstheissuesraisedintheoriginalevaluation.Also,themanufacturermustcommittoanactiondatebywhichtheconstructionchangeswillbefullyimplemented.All"RESPONDED"sectionswilldescribetheoriginalissuesraised,theconstructionchangesproposedbytheequipmentmanufacturer,andthedatebywhichthosechangeswillbeimplemented. NON-APPLICABLE(N/A) AnyrequirementsoftheGuidelineswhichdonotapplytoaparticularsystemareidentifiedas"NON-APPLICABLE." ADDRESSED(ADD) IftherequirementsstatedinagivenparagraphoftheGuidelinesaremoreappropriatelydiscussedindetailunderanothersection,thenthissectionoftheGuidelinesisidentifiedas"ADDRESSED."Theparagraphunderwhichtheseissuesarediscussediscitedforreferencepurposes. REFERENCEONLY(REF) SomeparagraphsoftheGuidelinespresentdefinitionsonsafetyorphilosophyandareforreferenceonly.Therearenospecificrequirementsdesignatedbytheseparagraphs.Allsectionsofthistypearemarked"REFERENCEONLY."5.1PURPOSEPRIVATE5.1-Theseguidelinesareintendedasaminimumsetofperformancebasedenvironmental,healthandsafetyconsiderationsforequipmentinsemiconductormanufacturing.MEETS[]ISSUE[]INFOREQUIRED[]RESPONDED[]N/A[]ADD[]REF[X]REFERENCEONLYAnassessmentofAppliedMaterials‘MirraTrak,wasconductedinaccordancewiththeSafetyGuidelinesforSemiconductorManufacturingEquipment(SEMIS2-93AGuidelines)basedonsoundengineeringanddesignpractices.ReferenceswerealsomadetoanyknownapplicableIndustrySafetyStandards,Building,Fire,andElectricalCodes,aswellasanyGovernmentRegulatoryRequirements.PRIVATE5.2SCOPE25.2SCOPE025.2SCOPEtc\l0"025.2SCOPE"PRIVATE5.2-Theseguidelinesapplytoequipmentinthemanufacturing,metrology,assemblyandtestingofsemiconductorproducts.MEETS[]ISSUE[]INFOREQUIRED[]RESPONDED[]N/A[]ADD[]REF[X]REFERENCEONLYTheintegrationoftheindividualmodules(FABSwaferhandlingmodule,aMirraChemicalMechanicalPolisher(CMP),andanOnTrakSynergyIntegra)wasevaluatedagainsttheSEMIS2-93AGuidelinesandotherapplicablestandards.PRIVATE5.3SAFETYPHILOSOPHY25.3SAFETYPHILOSOPHY025.3SAFETYPHILOSOPHYtc\l0"025.3SAFETYPHILOSOPHY"PRIVATE5.3.1-Theseguidelinesshouldbeusedtohelpeliminateknownsafetyandhealthhazardsinherentintheoperationandmaintenanceofprocessequipment.Industrystandards,building,electricalandfirecodes,governmentregulatoryrequirements,andgoodpracticeshouldbeconsideredinallequipmentdevelopmentprograms.MEETS[]ISSUE[]INFOREQUIRED[]RESPONDED[]N/A[]ADD[]REF[X]REFERENCEONLYTheintentofSEMIS2-93AGuidelinesistominimizeoreliminateknownsafetyandhealthhazardsbyhavingthemanufacturerdesigntheequipmentwiththeapplicableindustrialsafetystandards,codes,andregulatoryrequirementsinmind.Aspartofthissafetyassessment,GS3hasevaluatedtheMirraTrakagainstseveralapplicablestandards,codes,andregulatoryrequirements,asnotedinSection2.0"SCOPE"ofthisreport.ResultsofourfindingsaresummarizedinthisS2-93AEngineeringReport.PRIVATE5.3.2-Nosinglepointfailureoroperationalerrorshouldallowimmediateexposuresituationofpersonnel,facilitiesorcommunitytohazardsordirectlyresultininjury,deathorequipmentloss.Allequipmentshouldbefail-safeorofafault-tolerantdesign.MEETS[]ISSUE[]INFOREQUIRED[]RESPONDED[]N/A[]ADD[X]REF[]ADDRESSEDThereviewofpotentialhazardsasaresultofsinglefailureoroperationalerrorisaddressedinSection5.4,Paragraph5.4.5.

PRIVATE5.3.3-Thefollowingareasofconcernintheoperationandmaintenanceoftheequipmentareaddressed:Chemicalshazards/Radiationhazards/Electricalhazards/Physicalhazards/Mechanicalhazards/Environmentalhazards/Fireandexplosions/Seismicactivityhazards/VentilationandErgonomics.MEETS[]ISSUE[]INFOREQUIRED[]RESPONDED[]N/A[]ADD[]REF[X]REFERENCEONLYThisS2-93AEngineeringReportdocumentsanyapplicablesafetyconcernsrelatingtothesemiconductormanufacturingequipment.Refertothespecificsectionsofthisreportfordetails.PRIVATE5.4GENERALGUIDELINES25.4GENERALGUIDELINES025.4GENERALGUIDELINEStc\l0"025.4GENERALGUIDELINES"PRIVATE5.4.1-Theseguidelinesshouldbeincorporatedbyreferenceinallstandardequipmentpurchasespecifications.Theintentisfortheendusertobuyasafedesign,notdesigntheequipment.Theuserandsuppliershoulddocumentwhenitisnecessarytodeviatefromthisguideline.MEETS[]ISSUE[]INFOREQUIRED[]RESPONDED[]N/A[]ADD[]REF[X]REFERENCEONLYTheguidelinesstatethattheequipmentistomeetthesegeneralsafetycriteria.Anydeviationfromtheseguidelinesshouldbedocumented.Thisreportwillservetoidentifyanyknowndeviationsatthetimeoftheinspectionoftheequipment.Documentationofacceptanceofanydeviationsbytheuseristheresponsibilityoftheuserandthesupplier.PRIVATE5.4.2-Thedesignofthecompletesystemanditsoptionsshouldbeexaminedandariskanalysisperformedanddocumentedbyaqualifiedproductsafetyprofessional.Anindependentlaboratoryorproductsafetyconsultingfirmmaybecommissionedtosupplyadditionaltesting,listings,evaluationsofconformancetothisdocument.Allhazardsthatcannotbeengineeredoutoftheproductshouldbeclearlyidentifiedandcontrolledtoreducepersonnelexposureand/orpropertydamage.Thesehazardsshouldbeaddressedspecificallyintheproductoperationsandmaintenancemanualorinanaccompanyingnotice.MEETS[]ISSUE[]INFOREQUIRED[]RESPONDED[]N/A[]ADD[]REF[X]ChemicalMechanicalPolishingSystem,ModelMirraTrakUntilthehazardsareadequatelycorrected,theyshouldbespecificallynotedintheproductionoperationsandmaintenancemanualorinanaccompanyingnotice.PRIVATE5.4.3-Theequipmentmanufacturershouldensurethatitsequipmentcomplieswithlawsandcodeswhichareineffectatthetimeofpurchase.Allequipmentrequiringcertificationorapprovalbygovernmentalagenciesshouldhavethiscertificationorapprovalnotedontheequipmentorinthemanualsasrequiredbyregulations.MEETS[X]ISSUE[]INFOREQUIRED[]RESPONDED[]N/A[]ADD[]REF[]AppliedMaterialshasrespondedthattheappropriatemeansofterminationandstrainreliefisprovidedfortheOnTrakpowersupplycordwhenthesystemisinstalledatthecustomersite.Duringthereinspection,GS3reviewedtheinstallationinstructionsprovidedbyOnTrak,whichclearlystatethatthepowerconnectionmustbeprovidedwithproperstrainrelief.AppliedMaterialsfollowstheseinstructionsduringinstallationofMirraTraksystemsatend-usersites.Asthisisthecase,thisitemhasbeenreclassifiedasMeets.PRIVATE5.4.4-Theequipmentmanufacturershouldmaintainaprogramofqualityassurancealongwithasafety,healthandenvironmentalprogramtoidentify,correctandinformtheenduserofpotentialhazards.Notificationshouldbedirectedtotheenduser'sequipmentengineer,environmentalhealthandsafetyofficer,andpurchasingagent.MEETS[X]ISSUE[]INFOREQUIRED[]RESPONDED[]N/A[]ADD[]REF[]MEETS

PRIVATE5.4.5Nosinglepointfailureorequipmentoperationalerrorshouldallowexposureofpersonnel,facilitiesorcommunitytohazardsordirectlyresultininjury,deathorequipmentloss.MEETS[X]ISSUE[]INFOREQUIRED[]RESPONDED[]N/A[]ADD[X]REF[]OnSeptember26,1996,a"WHATIF?"hazardanalysiswasconductedonthesystemtodeterminethepotentialfordeviationsfromsystemdesignintent,whichcouldposeincreasedhazardrisk.ThissessionwasconductedbyMr.JohnHatfieldandMr.SteveJumperofGS3,andMs.LisaPowellaswellasothersfromAppliedMaterials.The"WHAT-IF?"sessionwasperformedtodeterminesystemcompliancewiththerequirementofSEMIS2-93AGuidelinesthatstates,"nosinglepointfailureoroperationalerrorshouldallowimmediateexposureofpersonnel,facilities,orcommunitytohazardsordirectlyresultininjury,deathorequipmentloss."Therefore,theanalysisfocusedonlyonsinglepointfailures,andshouldnotbeconsideredacomprehensiveprocesshazardanalysis.Hazards,whichwereidentifiedasrequiringmorethanonefailuretooccur,werenotquestionedfurther(i.e.,todetermineconsequenceoractionsrequired).RefertoAttachmentSeven.The揥HATIF?”tablewasupdatedduringtheinspectiononFebruary3,1998whichwasperformedbyMr.AndrewKileyandMr.MichaelVargaofGS3andMs.LisaPowellofAppliedMaterials.Duringthe"WHAT-IF?"session,thefollowingsinglepointfailureswereidentifiedandarelistedbelow:TheOnTrakdoorislockedduringnormaloperationwithapneumaticcylinderwhichcanonlybeunlockedbyatrainedmaintenancepersonwithakeyorpasswordtoentermaintenancemodeontheOnTrakcomputerscreenwhichreleasesairpiston.Alabelhasbeenaddedtothedoorwarningofthepotentialmotionhazard.AppliedMaterialsshouldensurethatthemanualsforthecompletedsystemincludeadiscussionofthepotentialhazards.ItisfurtherrecommendedthatAppliedMaterialsalsoincludeadiscussionofthepotentialhazardsrelatedtotheCMProbotaccessiblewithintheOnTrackunit.Thisitemhasaseveritylevelof3(Moderate)basedonthepinchpointthatcouldoccurifthemaintenancepersonwasnotawareofthemovingFABSrobot.GS3hasreviewedupdatestothemanualfortheMirraTrakwhichincludeappropriatediscussionsofthehazardsassociatedwiththeintegrationoftheFABS,MirraandOnTraksystems.Therefore,thisitemhasbeenreclassifiedasMeets.Thisitemhasaseveritylevelof4(Minor)basedonthefactthattheswitcheffectivelyactstoensureasinglepointofcontrolbuttheremaybeminorconfusioniftheswitchisnotlabeled.AppliedMaterialshasupdatedthemanualfortheMirraTraksystemtoincludeadiscussionofthetwomonitors,andhasdesignatedthemainoperatorconsoleasTerminalAandthemaintenanceconsoleasTerminalB.ThisinformationwasdetailedinthemanualrevisionsreviewedbyGS3andlabeledterminalswerealsoinspected.Therefore,thisitemhasbeenreclassifiedasMeets.ADDRESSEDReferencetheindividualreportsfortheMirra,FABS,andOnTrakunitsforcompletediscussionsregardingthesinglefaultanalysesforeachoftheseunits.PRIVATE5.4.6-Theequipmentmanufacturershouldconsiderthetypeandquantityofhazardousprocessmaterialsthatmaybeusedintheoperationandmaintenanceofitsequipment.Themanufacturershouldstrivetoavoidorminimizetheuseofhazardousprocessmat