生產(chǎn)力促進組CreatedBy:luckfang1SMTTrainingMaterial

生產(chǎn)力促進組CreatedBy:luckfang1SMT生產(chǎn)力促進組CreatedBy:luckfang2內(nèi)容簡介WHAT’SSMT???常用術(shù)語電子元件知識工藝流程介紹焊錫膏基礎(chǔ)知識助焊劑介質(zhì)(Fluxmedium)金屬顆粒

印刷回流溫度曲線故障分析使用注意事項生產(chǎn)力促進組CreatedBy:luckfang2內(nèi)容簡介生產(chǎn)力促進組CreatedBy:luckfang3WHAT’SS.M.T???What’sS.M.T.????SurfaceMountingTechnologyS.M.DevicesS.M.AssemblyS.M.Machine生產(chǎn)力促進組CreatedBy:luckfang3WHAT生產(chǎn)力促進組CreatedBy:luckfang4電子元件知識片式電阻-ChipResistor片式電容-ChipCapacitorSOT.:SmallOutlineTransistorSOD.:SmalloutlineDiode鉭電容-Solidtantalumcapacitorschips

圓柱體二級管-MELF排阻-ChipArrayResistor鋁電容-AluminiumelectrolyticSMDcapacitors

電感-chipsInductors

電源TR-PowerTransistor生產(chǎn)力促進組CreatedBy:luckfang4電子元件生產(chǎn)力促進組CreatedBy:luckfang5電子元件知識微調(diào)器SOP.:SmallOutlinepackageQFP.:QuadFlatPackageTQFP.:ThinSmallOutlinePackagePLCC.:PlasticleadedChipCarrierTSOP.:ThinSmallOutlinePackageCSP.:ChipScalePackageBGA.:BallGridArrayCONNECTOR生產(chǎn)力促進組CreatedBy:luckfang5電子元件生產(chǎn)力促進組CreatedBy:luckfang6Chipoutlinedescription-元件尺寸SizeL*W(inch)SizeL*W(mm)02010.02*0.0105030.5*0.2504020.04*0.0210051.0*0.506030.06*0.0316081.5*0.7608050.08*0.0520122.0*1.2512060.12*0.0632163.2*1.612100.12*0.132253.2*2.5生產(chǎn)力促進組CreatedBy:luckfang6Chip生產(chǎn)力促進組CreatedBy:luckfang7SMDComponentsShape-元件外形Chip0603SolidtantalumcapacitorschipsAluminiumelectrolyticSMDcapacitorsSOT23SOT143SOT223SOIC’sSOJIC’sPLCCIC’sQFPIC’sBGAIC’s生產(chǎn)力促進組CreatedBy:luckfang7SMD生產(chǎn)力促進組CreatedBy:luckfang8Humiditycontrollevel-濕度控制等級(LEVELdefinedbyIPC/JEDECJ-STD-020)LevelTemp./Humidity

Exposuretime

1<=30degree/85%Unlimited

2<=30degree/60%1Year

2a

<=30degree/60%

4Weeks

3<=30degree/60%1Week

4<=30degree/60%

72Hrs.(3d.)

5<=30degree/60%

48Hrs.

5a <=30degree/60% 24Hrs.

6Devicesrequiredbakingbeforeuse,oncebaked,mustbereflowedwithin6Hrs.生產(chǎn)力促進組CreatedBy:luckfang8Humi生產(chǎn)力促進組CreatedBy:luckfang9SMTprocessflowchart-工藝流程生產(chǎn)力促進組CreatedBy:luckfang9SMT生產(chǎn)力促進組CreatedBy:luckfang10SMT常用術(shù)語PCB-PrintCircuitBoard印刷電路板ESD-ElectrostaticSensitiveDevices靜電放電PPM-DefectsperMillion每百萬的壞點SPC-StatisticProcessControl-過程統(tǒng)計分析Iron-電烙鐵HotAirReflowingNoozle-熱風嘴TinExtractor-吸錫器SolderingWick-吸錫帶Post-SolderingInspection-焊后檢驗VisualInspection-目視檢驗生產(chǎn)力促進組CreatedBy:luckfang10SMT生產(chǎn)力促進組CreatedBy:luckfang11SMT常用術(shù)語AOI-AutomatedOpticalInspection自動光學檢查AXI,AutomatedX-rayInspection-自動X射線檢查SolderingJointQuality-焊點質(zhì)量SolderingJointDefect-焊點缺陷SolderWrong-錯焊SolderSkips-漏焊PseudoSoldering-虛焊ColdSoldering-冷焊SolderBridge-橋焊Opensoldering-脫焊生產(chǎn)力促進組CreatedBy:luckfang11SMT生產(chǎn)力促進組CreatedBy:luckfang12SMT常用術(shù)語Solder-Off-焊點剝離SolderNonwetting-不濕潤焊點SolderingBalls-錫珠Icicle/SolderProjection-拉尖Void-孔洞SolderWicking-焊料爬越OverheatedSolderConnection-過熱焊點生產(chǎn)力促進組CreatedBy:luckfang12SMT生產(chǎn)力促進組CreatedBy:luckfang13SMT常用術(shù)語InsufficientSolderConnection-不飽和焊點ExcessSolderConnection-過量焊點FluxResidue-助焊劑剩余SolderCrazeing(Tearing)-焊料裂紋Fillet-Lifting,Lift-Off-焊角翹離Loader-上板機Unloader-下板機Dispenser-滴涂器,點膠機生產(chǎn)力促進組CreatedBy:luckfang13SMT生產(chǎn)力促進組CreatedBy:luckfang14SMT常用術(shù)語VacuumPick&PlaceTool-真空吸筆PlaceMachine,Pick&PlaceMachine,ChipMounter,ChipShooter-貼片機WaveSolderingSystems-波峰焊機ReflowSolderingSystems,ReflowOven-再流焊爐Self-Alignment-自定位Skewing-位移生產(chǎn)力促進組CreatedBy:luckfang14SMT生產(chǎn)力促進組CreatedBy:luckfang15SMT常用術(shù)語TombStone-立碑Flying-掉片ICT,InCircuitTesting-在線測試FT,FunctionalTesting-功能測試ReworkStation-返工工作臺CleaningSystems-清洗機生產(chǎn)力促進組CreatedBy:luckfang15SMT生產(chǎn)力促進組CreatedBy:luckfang16焊錫基本知識助焊劑介質(zhì)(Fluxmedium)金屬顆粒生產(chǎn)力促進組CreatedBy:luckfang16焊錫基生產(chǎn)力促進組CreatedBy:luckfang17

合金:合金是兩種或兩種以上的金屬形成的化合物,焊錫膏技術(shù)中所含的金屬成份通常為:錫(Sn),鉛(Pb),銀(Ag),銅(Cu)生產(chǎn)力促進組CreatedBy:luckfang17合生產(chǎn)力促進組CreatedBy:luckfang18軟焊接

無金屬熔融結(jié)合金屬鍵化合物(intermetalliclayer)Cu3SnTin/lead63/37alloyCu3SnandCu6Sn5IntermetallicFluxlayer生產(chǎn)力促進組CreatedBy:luckfang18軟焊接生產(chǎn)力促進組CreatedBy:luckfang19普通的焊盤材料銅及其合金電鍍銅,黃銅,青銅有機鍍膜焊盤(OSP)鎳及其合金鐵鎳鈷合金銀和金生產(chǎn)力促進組CreatedBy:luckfang19普通的生產(chǎn)力促進組CreatedBy:luckfang20CU焊盤Goldovernicklepads阻焊膜典型多層FR4PCBSnorAgpads生產(chǎn)力促進組CreatedBy:luckfang20CU生產(chǎn)力促進組CreatedBy:luckfang21PCBrawmaterial-PCB原材料MaterialBrandreferencePCBtechnologyUtilizationThickness

(mm)PhenolicpaperlaminateFR1,FR2*Standard

(Singleordoublesided)TVchassis

Simplemodules1.6±0.14

1.5±0.14

1.2±0.1PolyesterglasslaminateCEM3'T

Standard

(Singleordoublesided)Tuners1.2±0.1

1.0±0.1Epoxypaper/glasslaminateCEM1Standard

Singleordoublesided

SPTHHighendTVchassis

Modules1.6±0.14

1.5±0.14EpoxyglasslaminateFR4DSPTH

Multilayers(4to6)Tuner

Highendmodules&TVchassis,chassisfordigitalproducts

Chassis&modules

fordigitalproducts1.0±10%

1.5±10%

1.6±10%

1.6±10%生產(chǎn)力促進組CreatedBy:luckfang21PCB生產(chǎn)力促進組CreatedBy:luckfang22

基材金屬鍵化合物

CuCu6Sn5 Ag Ag3Sn Au AuSn4 Ni Ni3Sn4

焊接:生產(chǎn)力促進組CreatedBy:luckfang22生產(chǎn)力促進組CreatedBy:luckfang23焊點的截面圖(Sn63/Pb37錫膏與銅)生產(chǎn)力促進組CreatedBy:luckfang23焊點的生產(chǎn)力促進組CreatedBy:luckfang24錫膏是將錫粉顆粒與介質(zhì)(Fluxmedium)充分混合所形成的一種膏狀物質(zhì),這種膏狀物質(zhì)具有可印刷或點滴的能力.什么是錫膏??生產(chǎn)力促進組CreatedBy:luckfang24錫膏是生產(chǎn)力促進組CreatedBy:luckfang25

錫膏主要成分

錫粉顆粒金屬(合金)助焊劑介質(zhì)(FluxMedium)

活性劑松香,樹脂粘度調(diào)整劑溶劑生產(chǎn)力促進組CreatedBy:luckfang25錫膏生產(chǎn)力促進組CreatedBy:luckfang26合金選擇指南PCBA常用錫膏合金

合金 代號 熔點 備注Sn/Pb Sn63 183* 通用型 Sn/Pb/Ag Sn62 179* 通用型含銀錫膏Sn/Pb/Ag 63S4 179-183 防立碑特色錫膏 Sn/Ag Sn96 221* 無鉛,LeadFree Sn/Ag/Cu 99C 227* 無鉛,LeadFree Sn/Ag/Cu 96Sc 217* 無鉛,LeadFree

*最低共熔點(eutectic) 生產(chǎn)力促進組CreatedBy:luckfang26合金選生產(chǎn)力促進組CreatedBy:luckfang27液相圖共熔點生產(chǎn)力促進組CreatedBy:luckfang27液相圖生產(chǎn)力促進組CreatedBy:luckfang28助焊劑生產(chǎn)力促進組CreatedBy:luckfang28助焊劑生產(chǎn)力促進組CreatedBy:luckfang29

介質(zhì)選擇指南介質(zhì)系列 特性描述

CR系列:標準通用型,殘留物透明,高活性,印刷速度100mm/secRP系列:高速印刷,高活性,印刷速度150-200mm/secMP系列:高速印刷,可飛針測試,可用于封閉式印刷,免清洗RM系列:標準通用型,已被逐步替代

RMA系列:中度天然樹脂,活性極高,殘留較嚴重

生產(chǎn)力促進組CreatedBy:luckfang29介質(zhì)生產(chǎn)力促進組CreatedBy:luckfang30介質(zhì)類型合金類型顆粒尺寸金屬含量CR32Sn62,Sn63,63S4AGS,Type389.5%96SC,96S,97SC(Pb-free)AGS,Type388%,88.5%CR37Sn62,Sn63AGS,Type390%,89.5%63S4(Anti-tombstone)DAD,Type489.5%MP100Sn62,Sn63AGS,Type389.5%,90%63S4(Anti-tombstone)ACS,Type489.5%90%MP200Sn62,Sn63,63S4AGS,Type390%RP11Sn60,Sn62,Sn63AGS,Type389%,89.5%,90%RP15Sn60,Sn62,Sn63AGS,Type389%,90%63S4(Anti-tombstone)ACS,Type489.5%

介質(zhì)選擇指南生產(chǎn)力促進組CreatedBy:luckfang30介質(zhì)類生產(chǎn)力促進組CreatedBy:luckfang31助焊劑介質(zhì)的功能錫粉顆粒的載體.提供合適的流變性和濕強度.

有利于熱量傳遞到焊接區(qū).降低焊料的表面張力.防止焊接時焊料和焊接表面的再氧化.去處焊接表面及錫粉顆粒的氧化層.在焊接點表面形成保護層和安全的殘留物層.生產(chǎn)力促進組CreatedBy:luckfang31助焊劑生產(chǎn)力促進組CreatedBy:luckfang32助焊劑決定的焊錫膏特性活性流變性印刷和濕強度的特性殘留的特性生產(chǎn)力促進組CreatedBy:luckfang32助焊劑生產(chǎn)力促進組CreatedBy:luckfang33助焊劑介質(zhì)的組成天然樹脂(Rosin)/合成松香(Resin)溶劑(Solvents)活性劑(Activators)增稠劑(Rheologymodifiers)生產(chǎn)力促進組CreatedBy:luckfang33助焊劑生產(chǎn)力促進組CreatedBy:luckfang34助焊劑（Fluxmedium）通常松香含量-50-70%活性劑（通常是鹵素）–1-5%溶劑–20–30%增稠劑–3-6%生產(chǎn)力促進組CreatedBy:luckfang34助焊劑生產(chǎn)力促進組CreatedBy:luckfang35

錫粉顆粒生產(chǎn)力促進組CreatedBy:luckfang35生產(chǎn)力促進組CreatedBy:luckfang36錫粉顆粒直徑代碼:代碼 直徑BAS 75-53umAAS 53-38umABS 53-25umAGS(AGD) 45-20um(Type3)DAS 38-25umDAD 38-20um(Type4)ACS 45-10um--- 20-10um(Type5)生產(chǎn)力促進組CreatedBy:luckfang36錫粉顆生產(chǎn)力促進組CreatedBy:luckfang37錫粉的生產(chǎn)（舊技術(shù)）溶融的合金N2N2過大的尺寸過小的尺寸有用的錫粉噴霧頭篩網(wǎng)（渦輪絲網(wǎng)）生產(chǎn)力促進組CreatedBy:luckfang37生產(chǎn)力促進組CreatedBy:luckfang38錫粉的生產(chǎn)（新技術(shù)）溶解的合金N2N2過大的尺寸過小的尺寸有用的錫粉篩網(wǎng)（超聲波型）超聲波噴霧器生產(chǎn)力促進組CreatedBy:luckfang38錫粉的生產(chǎn)力促進組CreatedBy:luckfang39錫粉尺寸分布(AGS)45-20microns=AGS生產(chǎn)力促進組CreatedBy:luckfang39錫粉尺生產(chǎn)力促進組CreatedBy:luckfang40球形錫粉顆粒WidthLength球形長/寬比

<1.5

Multicore規(guī)格:球形顆粒=95%minimum生產(chǎn)力促進組CreatedBy:luckfang40球形錫生產(chǎn)力促進組CreatedBy:luckfang41非球形錫粉顆粒DistortedSpheres“Dogbones”orirregular生產(chǎn)力促進組CreatedBy:luckfang41非球形生產(chǎn)力促進組CreatedBy:luckfang42stencilPCBbaseSolderPowderIrregularShapePowder生產(chǎn)力促進組CreatedBy:luckfang42ste生產(chǎn)力促進組CreatedBy:luckfang43小顆粒錫粉優(yōu)點提高細間距焊盤的印刷性能提高耐坍塌性能提高濕強度增加潤濕/活化面積局限錫粉顆粒被氧化的幾率增加錫珠缺陷的發(fā)生幾率增加生產(chǎn)力促進組CreatedBy:luckfang43小顆粒生產(chǎn)力促進組CreatedBy:luckfang44顆粒的大小與印刷間距生產(chǎn)力促進組CreatedBy:luckfang44顆粒的生產(chǎn)力促進組CreatedBy:luckfang45顆粒的大小與印刷間距MetalmaskSolderPowder75~53μm/0.625mm38~53μm/0.4~0.5mm20~45μm/0.3mm10~38μm/0.3mm生產(chǎn)力促進組CreatedBy:luckfang45顆粒的生產(chǎn)力促進組CreatedBy:luckfang46金屬含量選指南金屬含量增高錫珠濺出可能性降低粘度增加,印刷性能降低方式

金屬含量刮板印刷 88%--90% 針筒式點膏 83%--86% 移針印 83%--85% 生產(chǎn)力促進組CreatedBy:luckfang46金屬含生產(chǎn)力促進組CreatedBy:luckfang47錫膏測試每個批號的錫膏和其組成部分，在供給客戶前都經(jīng)過20至30次的測試可以確保任何一種錫膏的每個批號的所有組成部分都可追述性錫膏，錫粉和助焊劑媒體的留樣期為兩年生產(chǎn)力促進組CreatedBy:luckfang47錫膏測生產(chǎn)力促進組CreatedBy:luckfang48

焊錫膏印刷工藝生產(chǎn)力促進組CreatedBy:luckfang48生產(chǎn)力促進組CreatedBy:luckfang49DEK260半自動印刷機生產(chǎn)力促進組CreatedBy:luckfang49DEK生產(chǎn)力促進組CreatedBy:luckfang50PressureSpeedPrint-gap(oncontact)印刷生產(chǎn)力促進組CreatedBy:luckfang50Pre生產(chǎn)力促進組CreatedBy:luckfang51SpeedRoll印刷生產(chǎn)力促進組CreatedBy:luckfang51Spe生產(chǎn)力促進組CreatedBy:luckfang52SeparationSpeedDrop-off印刷生產(chǎn)力促進組CreatedBy:luckfang52Sep生產(chǎn)力促進組CreatedBy:luckfang53印刷時錫膏形成滾動印刷生產(chǎn)力促進組CreatedBy:luckfang53印刷時生產(chǎn)力促進組CreatedBy:luckfang54刮刀聚氨脂,橡膠不銹鋼二者有什么不同?生產(chǎn)力促進組CreatedBy:luckfang54刮刀聚生產(chǎn)力促進組CreatedBy:luckfang55刮刀生產(chǎn)力促進組CreatedBy:luckfang55刮刀生產(chǎn)力促進組CreatedBy:luckfang56不同的刮刀效果不同生產(chǎn)力促進組CreatedBy:luckfang56不同的生產(chǎn)力促進組CreatedBy:luckfang57

材料黃銅不銹鋼鎳塑料材料

網(wǎng)孔化學蝕刻激光切割電鍍縮小10%網(wǎng)板生產(chǎn)力促進組CreatedBy:luckfang57材料生產(chǎn)力促進組CreatedBy:luckfang58蝕刻后凹凸不平上下開口不一致有唇的錐形開口,表面光滑錐形開口網(wǎng)板開孔化學腐蝕法激光切割激光切割并電鍍生產(chǎn)力促進組CreatedBy:luckfang58蝕刻后生產(chǎn)力促進組CreatedBy:luckfang59激光切割并電鍍化學蝕刻激光切割不同網(wǎng)板的效果不同生產(chǎn)力促進組CreatedBy:luckfang59激光切生產(chǎn)力促進組CreatedBy:luckfang60使用環(huán)境溫度：22C－－28C濕度：40％－－60％

Why?溫度過高,過早失去活性溫度過低,粘度過大,不利于印刷濕度過高,吸潮,濺錫濕度過低,溶劑揮發(fā)環(huán)境生產(chǎn)力促進組CreatedBy:luckfang60使用環(huán)生產(chǎn)力促進組CreatedBy:luckfang61添加錫膏的方法生產(chǎn)力促進組CreatedBy:luckfang61添加錫生產(chǎn)力促進組CreatedBy:luckfang62添加錫膏的方法錫漿開蓋手工攪拌30秒,每秒2圈,方向一致每次添加量以半小時生產(chǎn)用量為準生產(chǎn)力促進組CreatedBy:luckfang62添加錫生產(chǎn)力促進組CreatedBy:luckfang63印刷參數(shù)控制速度（Speed）壓力（Pressure）印刷間隙（Printgap）分離速度（Separationspeed）網(wǎng)板底部的清潔頻率溫度和濕度生產(chǎn)力促進組CreatedBy:luckfang63印刷參生產(chǎn)力促進組CreatedBy:luckfang64平行度(Parallel)PCB與網(wǎng)板接觸(contact)將網(wǎng)板刮干凈的最小壓力即可，取決于刮刀速度焊錫膏流變性和新鮮度刮刀類型,角度和鋒利程度刮刀速度優(yōu)化設(shè)置參數(shù)設(shè)置生產(chǎn)力促進組CreatedBy:luckfang64平行度生產(chǎn)力促進組CreatedBy:luckfang65使用注意事項冷藏儲存于5-10℃Why?保持助焊劑活性-低溫避免錫膏結(jié)晶-不可冷凍

生產(chǎn)力促進組CreatedBy:luckfang65使用注生產(chǎn)力促進組CreatedBy:luckfang66使用注意事項錫膏從冰箱取出后回溫5-8小時至室溫才可使用Why?低溫時粘度過高,印刷性能差錫膏內(nèi)部吸潮生產(chǎn)力促進組CreatedBy:luckfang66使用注生產(chǎn)力促進組CreatedBy:luckfang67使用注意事項用塑料器具,手工攪拌30秒,每秒2圈,方向一致Why?防止助焊劑分層避免刮傷塑料儲存罐避免劃傷錫粉顆粒降低粘度生產(chǎn)力促進組CreatedBy:luckfang67使用注生產(chǎn)力促進組CreatedBy:luckfang68使用注意事項及時清除殘留錫膏,不可將新舊錫膏放在同一儲存罐中why?錫膏中溶劑會揮發(fā),導致粘度過高印刷質(zhì)量下降表面氧化可能性增加生產(chǎn)力促進組CreatedBy:luckfang68使用注生產(chǎn)力促進組CreatedBy:luckfang69回流焊工藝生產(chǎn)力促進組CreatedBy:luckfang69回流焊生產(chǎn)力促進組CreatedBy:luckfang70SEHO64403.6熱風對流式回流爐MachinelocatedinMSMIpohTech.Centre生產(chǎn)力促進組CreatedBy:luckfang70SEH生產(chǎn)力促進組CreatedBy:luckfang71貼片生產(chǎn)力促進組CreatedBy:luckfang71貼片生產(chǎn)力促進組CreatedBy:luckfang72回流焊生產(chǎn)力促進組CreatedBy:luckfang72回流焊生產(chǎn)力促進組CreatedBy:luckfang73回流焊生產(chǎn)力促進組CreatedBy:luckfang73回流焊生產(chǎn)力促進組CreatedBy:luckfang74回流焊生產(chǎn)力促進組CreatedBy:luckfang74回流焊生產(chǎn)力促進組CreatedBy:luckfang75回流焊生產(chǎn)力促進組CreatedBy:luckfang75回流焊生產(chǎn)力促進組CreatedBy:luckfang76錫膏的回流焊是實際的焊接過程通常使用爐子來完成回流爐一般是紅外型或者對流型回流爐環(huán)境有空氣和氮氣環(huán)境此外，溫度可編程的方法也可以使用生產(chǎn)力促進組CreatedBy:luckfang76錫膏的生產(chǎn)力促進組CreatedBy:luckfang77理想化的回流曲線生產(chǎn)力促進組CreatedBy:luckfang77理想化生產(chǎn)力促進組CreatedBy:luckfang78什么是理想的曲線？在大多數(shù)情況下回流曲線受限于PCB板和器件以及回流爐的能力現(xiàn)在的錫膏都能在不同的曲線下工作無論如何，確定一個理想的曲線可以便于分析錫膏的應用生產(chǎn)力促進組CreatedBy:luckfang78什么是生產(chǎn)力促進組CreatedBy:luckfang79為什么要使用回流曲線?焊接是一個化學反應過程為了得到一致的結(jié)果，過程必須被監(jiān)督不同的PCB類型有不同的導熱需求不同的回流爐的表現(xiàn)各不相同，并且可能時時刻刻都有所變化生產(chǎn)力促進組CreatedBy:luckfang79為什么生產(chǎn)力促進組CreatedBy:luckfang80為什么要使用回流曲線?分析過程實現(xiàn)過程控制確保一致發(fā)現(xiàn)變化趨勢適當?shù)恼{(diào)整可用的最大和最小曲線生產(chǎn)力促進組CreatedBy:luckfang80為什么生產(chǎn)力促進組CreatedBy:luckfang81操作窗口（舉例）生產(chǎn)力促進組CreatedBy:luckfang81操作窗生產(chǎn)力促進組CreatedBy:luckfang82如何做回流曲線？生產(chǎn)力促進組CreatedBy:luckfang82如何做生產(chǎn)力促進組CreatedBy:luckfang83如何做回流曲線？使用專用的設(shè)備類似SoldaPro，SlimlineSoldaProOracle，ECD-SuperMOLE，DATApaq，KIC使用熱點偶測試不同器件和不同區(qū)域的溫度高密度或大器件低密度或小器件溫度敏感器件被測板和測試設(shè)備一起通過回流爐后，下載數(shù)據(jù)至計算機或者打印機上生產(chǎn)力促進組CreatedBy:luckfang83如何做生產(chǎn)力促進組CreatedBy:luckfang84SoldaPro小器件區(qū)域大器件區(qū)域溫度敏感型器件用高溫焊錫絲固定器件和熱電偶生產(chǎn)力促進組CreatedBy:luckfang84Sol生產(chǎn)力促進組CreatedBy:luckfang85經(jīng)過回流爐生產(chǎn)力促進組CreatedBy:luckfang85經(jīng)過回生產(chǎn)力促進組CreatedBy:luckfang86下載數(shù)據(jù)至計算機生產(chǎn)力促進組CreatedBy:luckfang86下載數(shù)生產(chǎn)力促進組CreatedBy:luckfang87典型的回流曲線生產(chǎn)力促進組CreatedBy:luckfang87典型的生產(chǎn)力促進組CreatedBy:luckfang88回流曲線手冊生產(chǎn)力促進組CreatedBy:luckfang88回流曲生產(chǎn)力促進組CreatedBy:luckfang89第一升溫區(qū)生產(chǎn)力促進組CreatedBy:luckfang89第一升生產(chǎn)力促進組CreatedBy:luckfang90第一升溫區(qū)目的是加熱溫度至預熱區(qū)受限于PCB和器件（熱沖擊）在區(qū)域的末端會有爆發(fā)性的氣體在錫膏內(nèi)產(chǎn)生（激光焊接）上升斜率一般為1~3oC/s生產(chǎn)力促進組CreatedBy:luckfang90第一升生產(chǎn)力促進組CreatedBy:luckfang91預熱區(qū)生產(chǎn)力促進組CreatedBy:luckfang91預熱區(qū)生產(chǎn)力促進組CreatedBy:luckfang92預熱區(qū)預熱區(qū)的作用是使得板上所有的區(qū)域和器件在回流前都達到相似的溫度。先進的爐子可以做到降低或減少回流曲線的“平臺”。焊錫膏沒有特別的活化溫度，然而…一旦活化劑在溶化的樹脂中融化或溶解，則其開始發(fā)生作用生產(chǎn)力促進組CreatedBy:luckfang92預熱區(qū)生產(chǎn)力促進組CreatedBy:luckfang93預熱區(qū)松香在70°-120°C之間開始變軟直到流體化學的一個簡單的規(guī)律：溫度升高使得反應速度加快在預熱區(qū)（有氧回流），氧化將發(fā)生在暴露的金屬表面生產(chǎn)力促進組CreatedBy:luckfang93預熱區(qū)生產(chǎn)力促進組CreatedBy:luckfang94回流區(qū)生產(chǎn)力促進組CreatedBy:luckfang94回流區(qū)生產(chǎn)力促進組CreatedBy:luckfang95回流區(qū)焊點形成過程.焊接區(qū)溫度超過合金的熔點.較高的溫度會降低焊點表面的張力.同時，較高的溫度也會增加表面氧化，使助焊劑變色。PCB和器件也可能因此而損壞理想的回流最高點應在液相線上加30-40°C（無鉛錫膏的液相線在210-220°C）并超過熔點30-60秒生產(chǎn)力促進組CreatedBy:luckfang95回流區(qū)生產(chǎn)力促進組CreatedBy:luckfang96冷卻區(qū)（焊料凝固）生產(chǎn)力促進組CreatedBy:luckfang96冷卻區(qū)生產(chǎn)力促進組CreatedBy:luckfang97冷卻區(qū)快速的冷卻能得到光亮的焊點慢速冷卻，焊點表面會粗糙無光。極端情況則可能導致強度降低在健康和安全的前提下，PCB的冷卻應盡可能的快。這樣可以確保熔化的同時沒有焊點被攪亂。生產(chǎn)力促進組CreatedBy:luckfang97冷卻區(qū)生產(chǎn)力促進組CreatedBy:luckfang98焊膏回流時的狀態(tài)室溫刷膠點穩(wěn)定-助焊劑連接著焊錫顆粒。90oC樹脂變?nèi)彳浫軇┳饔糜跇渲z裝結(jié)構(gòu)開始分解生產(chǎn)力促進組CreatedBy:luckfang98焊膏回生產(chǎn)力促進組CreatedBy:luckfang99常見故障分析生產(chǎn)力促進組CreatedBy:luckfang99常見故生產(chǎn)力促進組CreatedBy:luckfang100印刷缺陷生產(chǎn)力促進組CreatedBy:luckfang100印刷生產(chǎn)力促進組CreatedBy:luckfang101助焊劑外溢生產(chǎn)力促進組CreatedBy:luckfang101助焊生產(chǎn)力促進組CreatedBy:luckfang102壓力過大的壓力可能會導致助焊劑外溢成型不良錫珠

增加網(wǎng)板清洗頻率過低的壓力將導致網(wǎng)板印刷不干凈

成型不良少錫漏印生產(chǎn)力促進組CreatedBy:luckfang102壓力生產(chǎn)力促進組CreatedBy:luckfang103壓力過大Fluxbleed“Scooping”生產(chǎn)力促進組CreatedBy:luckfang103壓力生產(chǎn)力促進組CreatedBy:luckfang104壓力過小網(wǎng)板印刷不干凈“Dogears”生產(chǎn)力促進組CreatedBy:luckfang104壓力生產(chǎn)力促進組CreatedBy:luckfang105底部支撐不足底部支撐不足不能通過加大壓力來改善這樣做的結(jié)果將是印刷質(zhì)量不合格和網(wǎng)板的損壞增加底部的支撐點以確保PCB和網(wǎng)板的緊密的接觸生產(chǎn)力促進組CreatedBy:luckfang105底部生產(chǎn)力促進組CreatedBy:luckfang106底部支撐不足網(wǎng)板留在網(wǎng)上的錫膏生產(chǎn)力促進組CreatedBy:luckfang106底部生產(chǎn)力促進組CreatedBy:luckfang107刮刀損壞造成的問題生產(chǎn)力促進組CreatedBy:luckfang107刮刀生產(chǎn)力促進組CreatedBy:luckfang108印刷間隙問題印刷通常是0間隙降低印刷污染和助焊劑的外溢厚阻焊層或者絲印層會阻礙無縫隙印刷如果絲網(wǎng)設(shè)備沒有正確校準，印刷間隙可能大于0，這會導致印刷不好和網(wǎng)板的損害生產(chǎn)力促進組CreatedBy:luckfang108印刷生產(chǎn)力促進組CreatedBy:luckfang109阻焊膜層過厚Printgap<0印刷間隙生產(chǎn)力促進組CreatedBy:luckfang109阻焊生產(chǎn)力促進組CreatedBy:luckfang110常見印刷故障印刷壓力過高錫膏成形有缺口,助焊劑外溢印刷壓力過低網(wǎng)板刮不干凈,脫模效果差,印刷精度差印刷速度過快錫膏不滾動,網(wǎng)孔填充不量,錫膏漏印或缺損生產(chǎn)力促進組CreatedBy:luckfang110常見生產(chǎn)力促進組CreatedBy:luckfang111常見印刷故障印刷速度過低錫膏外溢,網(wǎng)板底部清潔頻率提高PCB/網(wǎng)板對位不良錫珠,短路,立碑網(wǎng)板松弛-張力過低PCB與網(wǎng)板間密封不良,搭橋,錫膏成形不良,錫膏移位污染生產(chǎn)力促進組CreatedBy:luckfang111常見生產(chǎn)力促進組CreatedBy:luckfang112常見印刷故障網(wǎng)板損壞變形密封不良,搭橋網(wǎng)板底部清潔不利錫珠,短路脫模速度設(shè)置不佳錫膏在焊盤上拖尾,脫模不良,錫膏成形不良生產(chǎn)力促進組CreatedBy:luckfang112常見生產(chǎn)力促進組CreatedBy:luckfang113常見印刷故障PCB與網(wǎng)板有間隙密封不良,錫膏成形不良環(huán)境條件溫度過低：影響滾動特性溫度過高：錫膏坍塌/外溢吸潮印刷間隔時間過長網(wǎng)孔堵塞,印刷不完全生產(chǎn)力促進組CreatedBy:luckfang113常見生產(chǎn)力促進組CreatedBy:luckfang114溫度&濕度溫度會改變錫膏的流變性印刷溫度建議為@20-25°C高濕度能導致吸潮并產(chǎn)生錫珠當心錫膏中含有氣穴生產(chǎn)力促進組CreatedBy:luckfang114溫度生產(chǎn)力促進組CreatedBy:luckfang115回流缺陷生產(chǎn)力促進組CreatedBy:luckfang115回流生產(chǎn)力促進組CreatedBy:luckfang116常見的回流問題濺錫錫珠器件中間的錫珠立碑QFP細小引腳上的橋接（短路）開路–多發(fā)于細小引腳的QFP黯淡或粗糙的焊接表面生產(chǎn)力促進組CreatedBy:luckfang116常見生產(chǎn)力促進組CreatedBy:luckfang117濺錫錫珠生產(chǎn)力促進組CreatedBy:luckfang117濺錫生產(chǎn)力促進組CreatedBy:luckfang118解決方案調(diào)節(jié)印刷設(shè)備調(diào)節(jié)回流曲線

（增加傳送帶速度或降低預熱區(qū)設(shè)置）使用新鮮的焊錫膏原因印刷錯位過分的預熱錫膏被氧化濺錫錫珠生產(chǎn)力促進組CreatedBy:luckfang118解決生產(chǎn)力促進組CreatedBy:luckfang119器件中間錫珠生產(chǎn)力促進組CreatedBy:luckfang119器件生產(chǎn)力促進組CreatedBy:luckfang120元器件中部錫珠生產(chǎn)力促進組CreatedBy:luckfang120元器生產(chǎn)力促進組CreatedBy:luckfang121解決器件間錫珠的方案設(shè)計改變焊盤的尺寸并/或形狀網(wǎng)板減薄工藝降低