1、面向企業(yè)級(jí)SSD的統(tǒng)一架構(gòu)設(shè)計(jì)技術(shù)創(chuàng)新，變革未來專注企業(yè)級(jí) PCIe SSD 10年2020 面對(duì)疫情，我們更加努力 2X銷售額 3X部署量2億元D輪融資PBZB1 EBPBlaze5 NVMe SSD部署量互聯(lián)網(wǎng)通信金融服務(wù)垂直行業(yè)企業(yè)級(jí)功能的多樣化1.0a2013 1月127頁1.1b2014 7月172頁1.22014 11月205頁1.32017 5月282頁1.42019 6月403頁市場(chǎng)需求的多元化需求A需求B需求C形態(tài)U.2U.2EDSFF主控PCIe GEN4 16CH國產(chǎn)主控PCIe GEN4 8CH數(shù)據(jù)安全無國家商密TCG, Security BootDebug Metho

2、dDeep Dive TelemetryVU LogDeep Dive TelemetryQoS要求High無NAAdvanced FeaturesMNS, Trim,一鍵銷毀，寬溫Streams, VirtualizationInterfaceBLK, ZNSBLK InterfaceKey-Value, BLK閃存處理復(fù)雜度持續(xù)增加SLC2D MLC3D MLC3D TLC3D QLCRead RetrySuspend Error HandlingBCH DecodeData ScramblingGarbage CollectionBackground ScanLPDC Soft Deco

3、deLPDC Hard DecodingPartial Page ReadWear LevelingAI Based ECCProgramming Voltage CheckDynamic Read Voltage CalibrationPartial Block Read XORRead Disturb HandlingRef-Tag Check企業(yè)級(jí)SSD本身的積累成為創(chuàng)新的瓶頸It looks goodSupport Hot PlugRDTDoneOEM QualDe-buggingAdvanced Management New NANDOS Supports面向企業(yè)級(jí)SSD的統(tǒng)一架構(gòu)設(shè)

4、計(jì)A ServicesFunction ModulesData ManagementAbstraction Layer of AComplex A DriversChip AA ServicesFunction ModulesData ManagementAbstractionLayer of AComplexA DriversChip BNew Unified Service APIChip ADriver / HAL of Chip AData PathUnified FTL / Meta / GCExisted NVMe FeaturesChip BChip CDriver / HAL of Chip BDriver / HAL of Chip CNew InnovationUnified MI and Debug InterfaceData PathHW API統(tǒng)一架構(gòu)，我們持續(xù)演進(jìn)統(tǒng)一架構(gòu)下的產(chǎn)品路線圖2020PBlaze5 PCIe Gen3傳統(tǒng)架構(gòu)2 Firmware 2 Chips2021PBlaze6 PCIe Gen4第一代統(tǒng)一架構(gòu)1 firmware 2 chips2022P