1、NB ME Lesson LearnCase 1Issue: Hinge boss crackCase 1Root cause/Solution:Case 1Root cause/Solution:Case 2Issue: Hinge Bracket brokenCase 2Root cause/Solution:Case 2Root cause/Solution:Case 3Issue: E-sata Jack InterferanceCase 3Root cause/Solution:For strength concerned to EC hinge supportCase 3There

2、 are different type Jack Root cause/Solution:Case 3Root cause/Solution:Case 4Issue: Smile gapRoot cause/Solution:1.Refer to the picture, the dimension of the center of the axis to the iron surface is 15.55mm0.1mm.2.Old hinge actual date for 5 units as below:ST: Reduce rubber heightLT: Add height of

3、AxisCase 5鐳雕區(qū)域非鐳雕區(qū)域Issue: Power button UV coating peel offCase 5Root cause:ProcessCoating thicknessSubstrateBlack base coatingPrimer (Base coating)PlatingUV coating15 m8 m1.01.5 m815 m鐳雕Colory一般控制在1012 m中 制 程 雷雕工藝為整個(gè)工藝的最后一道，UV層破壞后沒有保護(hù)動(dòng)作。 鐳雕機(jī)功率設(shè)定過高，鐳雕后周邊區(qū)域碳化； 鐳雕機(jī)功率設(shè)定為額定功率的80%，約78W，頻率為1200HzCase 5Solu

4、tion: 降低鐳雕機(jī)功率 鐳雕機(jī)功率降為額定功率的60%，約56W，頻率不變 變更工藝流程，雷雕工藝放在UV coating之前，雷雕后通過UV保護(hù)Black base coatingPrimer (Base coating)PlatingUV coating15 m8 m1.01.5 m815 m鐳雕中 制 程Case 6Issue: Noise at K-lock location機(jī)器做open/close 時(shí)，hinge的搖擺帶動(dòng)K-lock BKT運(yùn)功，其噴漆面與base摩擦產(chǎn)生異音.Root cause:1.K-lock BKT與base的gap設(shè)計(jì)值為0;2.K-lock BKT

5、與base接觸面為噴漆光面;3.K-lock BKT與hinge有鎖附關(guān)係;Case 6Solution:1.Short term :K-lock BKT噴漆面打磨為粗糙面/K-lock與base的結(jié)合面 加點(diǎn)酒精.2.Long term :Base 偷肉0.2mm,增加base與K-lock的GAP的GAP, 避免面對(duì)面的摩擦.Case 7gap max 1.1-1.2mm( spec0.8mm )Issue: Gap between Top and BaseCase 7Root cause:ME StructureCase 7Root cause:top shielding結(jié)構(gòu)薄弱， sc

6、rew鎖附時(shí)產(chǎn)生一個(gè)反向的力，導(dǎo)致卡勾瞬間脫離影響會(huì)微量的下陷；Case 7Root cause:base 上卡勾的support rib 在卡合面以下，且為斜面卡合 ，卡合受力後base卡勾向內(nèi)變形，導(dǎo)致卡合量丟失；Case 7在top shielding兩個(gè)鎖screw位置的中間加1pcs rubber，rubber Z軸干涉量，形成一個(gè)蹺蹺板的支點(diǎn)；Solution:Case 7此位置的卡勾卡合方式由斜面卡合改平面卡合，並將BASE 卡勾背面的support rib 加高到卡合面以上1mm的位置；Solution:Case 8Issue: UV Coating peel off from

7、 TP panel Nissha IMR already be with hard coat, and another Akzo UV coating is on the IMR. But Akzo UV coating cannot be good to mix with IMR hard coat. So UV coating is easy to peel off on TP PlateRoot Cause:Case 8Solution:Case 8ST: Change to use Nissha IMR foil which is without hard coat.LT:Move I

8、MR foil back to PMMACase 9Issue: Hook of Battery Latch brokenCase 9Root Cause:link 卡勾後側(cè)base 上的support 面積太小且為R 角結(jié)構(gòu)，導(dǎo)致對(duì)卡勾配合面的support不夠；Case 9Link與battery配合的卡勾根部及卡勾轉(zhuǎn)角處加0.5mm 的R角後Solution:Case 10Issue: Thermal Block interference with CPUSpring PlateCu BaseHeat spreaderInterferenceThermal module interfer

9、ence with CPU. Cause system shut-down. Case 101.Thermal Team do not request thermal vendor to use what kind of assembly method to fix spring plate, Cu-base and heat spreader. (Thermal team side)2.Thermal vendor Auras used wrong method (雞眼釘 Copper rivet) to fix contact structure, resulting 雞眼釘 interf

10、ere with CPU capacitor. (Vendor side)FixRoot Cause:Case 10Root Cause:雞眼釘干涉Copper rivet 雞眼釘 pit is mmMylar thickness is mmTotal thickness is 0.45 mm2D Dimension of AMD the Gap between CPU die and capacitor is only about mmCase 10Solution 1:抽拉銅柱固定方式製程方式： Cu heat spreader 先抽拉出銅柱，之後再放入一個(gè)鉚合模鉚合彈片，銅塊。此方式可確

11、保 heat spreader 面限高為零！限高 0 mmSolution:Case 10Solution:製程： Cu heat spreader 先經(jīng)一套鉚合模，鉚入實(shí)心銅柱，接下來在進(jìn)另外一套鉚合模，鉚合彈片及銅塊。此方式需用到兩套鉚合模，故成本較高。但此方式亦可確保 heat spreader 面限高為零！限高 0 mmSolution 2:鉚接實(shí)心銅柱固定方式Case 11Issue: RAM door rib short to RAM capacitance as press the door Root Cause:Case 11Solution:1. Add mylar on r

12、am door rib to prevent this risk. 2. Have ec to cancel this rib to enlarge gap. Case 12Issue:1. No post or No power 2. MB can power on when press N.Bridge by fingerCase 12FA:Case 12FA: Dye-PryCase 12FA: Dye-PryCase 12FA:Cross SectionCase 12FA:Cross SectionCase 12FA:Cross SectionBased on above analysis (crack location