1、開(kāi)料( Cut Lamination)裁板( Sheets Cutting)原物料發(fā)料(Panel)(Shear material to Size)鉆孔(Drilling)內(nèi)鉆(Inner Layer Drilling )一次孔(Outer Layer Drilling ) b-3 二次孔(2nd Drilling)b-4 雷射鉆孔(Laser Drilling )(Laser Ablation ) b-5 盲(埋)孔鉆孔(Blind & Buried Hole Drilling)干膜制程( Photo Process(D/F) c-1 前處理(Pretreatment)c-2 壓膜(Dry

2、Film Lamination) c-3 曝光(Exposure)c-4 顯影(Developing) c-5 蝕銅(Etching)c-6 去膜(Stripping) c-7 初檢( Touch-up)化學(xué)前處理,化學(xué)研磨( Chemical Milling )選擇性浸金壓膜(Selective Gold Dry Film Lamination) c-10 顯影(Developing )c-11 去膜(Stripping )Developing , Etching & Stripping ( DES )Laminationd-1 黑化(Black Oxide Treatment) d-2 微

3、蝕(Microetching)d-3 鉚釘組合(eyelet ) d-4 疊板(Lay up)壓合(Lamination)后處理(Post Treatment)黑氧化( Black Oxide Removal ) d-8 銑靶(spot face)d-9 去溢膠(resin flush removal)減銅(Copper Reduction)e-1 薄化銅(Copper Reduction)電鍍(Horizontal Electrolytic Plating)f-1 水平電鍍(Horizontal Electro-Plating) (Panel Plating) f-2 錫鉛電鍍( Tin-L

4、ead Plating ) (Pattern Plating)f-3 1 mil ( Less than 1 mil Thickness ) f-4 1 mil ( More than 1 mil Thickness) f-5 砂帶研磨(Belt Sanding)f-6 剝錫鉛( Tin-Lead Stripping) f-7 微切片( Microsection)塞孔(Plug Hole)g-1 印刷( Ink Print ) g-2 預(yù)烤(Precure)g-3 表面刷磨(Scrub) g-4 后烘烤(Postcure)防焊綠漆綠油): (Solder Mask) h-1 C面印刷(Prin

5、ting Top Side)h-2 S 面印刷(Printing Bottom Side) h-3 靜電噴涂(Spray Coating)h-4 前處理(Pretreatment) h-5 預(yù)烤(Precure)h-6 曝光(Exposure) h-7 顯影(Develop)h-8 后烘烤(Postcure) h-9 UV 烘烤(UV Cure)h-10 文字印刷( Printing of Legend ) h-11 噴砂( Pumice)(Wet Blasting)h-12 印可剝離防焊(Peelable Solder Mask)I . 鍍金 Gold plating金手指鍍鎳金( Gold

6、 Finger )電鍍軟金(Soft Ni/Au Plating)浸鎳金( Immersion Ni/Au) (Electroless Ni/Au)噴錫(Hot Air Solder Leveling)j-1 水平噴錫(Horizontal Hot Air Solder Leveling) j-2 垂直噴錫( Vertical Hot Air Solder Leveling)j-3 超級(jí)焊錫(Super Solder )j-4. 印焊錫突點(diǎn)(Solder Bump)成型(Profile)(Form)k-1 撈型(N/C Routing ) (Milling) k-2 模具沖(Punch)k-3

7、 板面清洗烘烤(Cleaning & Backing) k-4 V 型槽( V-Cut)(V-Scoring)k-5 金手指斜邊( Beveling of G/F)開(kāi)短路測(cè)試(Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光學(xué)檢查( AOI Inspection)VRS 目檢(Verified & Repaired)泛用型治具測(cè)試(Universal Tester) l-4 專(zhuān)用治具測(cè)試(Dedicated Tester)l-5 飛針測(cè)試(Flying Probe)終檢( Final Visual Inspectio

8、n) m-1 壓板翹( Warpage Remove) m-2 X-OUT 印刷(X-Out Marking)m-3 包裝及出貨(Packing & shipping)m-4 m-4 目檢( Visual Inspection)m-5 清洗及烘烤( Final Clean & Baking)m-6 護(hù)銅劑(ENTEK Cu-106A)(OSP)m-7 離子殘余量測(cè)試(Ionic Contamination Test )(Cleanliness Test)m-8 冷熱沖擊試驗(yàn)(Thermal cycling Testing)m-9 焊錫性試驗(yàn)( Solderability Testing )N.

9、 雷射鉆孔(Laser Ablation)N-1 雷射鉆 Tooling 孔(Laser ablation Tooling Hole)N-2 雷射曝光對(duì)位孔(Laser Ablation Registration Hole)N-3 雷射 Mask 制作(Laser Mask)N-4 雷射鉆孔(Laser Ablation)N-5 AOI VRS ( AOI Inspection & Verified & Repaired)N-6 Blaser AOI (after Desmear and Microetching)N-7 除膠渣(Desmear)N-8 微蝕(Microetching )流程簡(jiǎn)

10、介：開(kāi)料 流程簡(jiǎn)介：開(kāi)料 Cut Lamination鉆孔 Drilling干膜制程 Photo Process(D/F)LaminationCopper Horizontal Electrolytic PlatingPlug 綠漆綠油)SolderMaskGold 噴錫Hot Air Solder 成型Profile開(kāi)短路測(cè)試ElectricalTesting Final Visual InspectionpcbpcbPCB(printedcircuitboardPWB(printedwiring以往裝置電子元器件的底盤(pán)，并實(shí)現(xiàn)電子元器件之間的相互連接。由于這種板是采用電子以往裝置電子元器件

11、的底盤(pán)，并實(shí)現(xiàn)電子元器件之間的相互連接。由于這種板是采用電子印刷術(shù)制作的，故被稱(chēng)為“印刷”電路板。習(xí)慣稱(chēng)“印制線路板”為“印制電路”是不確 pcb 電路板制作流程目前的電路板，主要由以下組成目前的電路板，主要由以下組成線路與圖面線路與圖面(Pattern):線路是做為原件之間導(dǎo)通的工具，在設(shè)計(jì)上會(huì)另外設(shè)計(jì)大銅面作為接地及電源層。線路與圖面是同時(shí)做出的。介電層介電層(Dielectric):用來(lái)保持線路及各層之間的絕緣性，俗稱(chēng)為基材?？卓?Through hole / 件插件用，另外有非導(dǎo)通孔(nPTH)通常用來(lái)作為表面貼裝定位，組裝時(shí)固定螺絲用。防焊油墨防焊油墨(Solder resistant /Solder Mask)通常為環(huán)氧樹(shù)脂不同的工藝，分為綠油、紅油、藍(lán)油。絲?。ńz?。↙eg