1Warp與經向料或Prepreg)向(Fill)指料或Prepreg)2多層板開料時長方將Panel3Thickness)：客或度Thickness)無要求,4CopperThickness：或Spec無特別說明情況下，均指5Pitch：節(jié)6SolderClearance：綠油開窗的直徑；7阻焊油：液態(tài)感光成像阻焊,俗8．SMOBC：Copper等9．BGA：(BGA球柵列陣：

Blindvia(盲)：PCB的；via(孔：PCB接的Pattern：正像圖形、正片、照相原版、生產底版上Pattern：負像圖形，負片，照相原版、生產底版上我們綠油干UVFPT：精術Free：無鉛；Free：無鹵素，指環(huán)保型材料；RoHS：RestrictionofUse危險物（Cadmium）（HexavaChromium）（FlameRetardents）；OSP：Organic防氧

相住50Proof住V表示Tg：Glass玻;以1：1;孔、SMT、IC手指、BGA;綜合詞1印制電2印制線3印制板：4印制板5印制線6印制元7印制接8印制板9板：board

單：single-sided雙：double-sided多：多：多：剛：rigidprinted剛：rigid剛：rigid剛：rigid撓：撓：撓：撓：撓：撓：剛：剛：r齊：flushprinted

金：metalcore金：metalbase多：mulit-wiring陶：ceramicsubstrate導：electroconductive模：moldedcircuit模：stampedprinted順：sequentially-laminated散：微：microwire積：積：表：surfacelaminar埋：b2itprinted多：multi-layeredfilm層：載：chipon埋：buriedresistance母：motherboard子：daughterboard背：backplane

裸：鍵：copper-invar-copperboard動：dynamicflex靜：staticflex可：電：cable撓：薄：混：hybrid厚：thick厚：thickfilm?。罕。簍hinfilm互：interconnection導：conductor齊：flush傳：transmission跨：crossover板：增：stiffener基：substrate基：

導：conductorside元：componentside焊：solderside?。簆rinting網(wǎng)：圖：pattern導：非：字：legend標：基材：1基材：base2層壓板：laminate3覆金屬：metal-cladbade4覆銅箔：copper-clad5單面覆6雙面覆7復合層：composite8薄層壓：thin9金屬芯：金：metal撓：

基：basismaterial預：prepreg粘：bonding預：環(huán)：epoxyglass加：預：mass內：core催：catalyzed涂：adhesive-coatedcatalyzed涂：adhesive-coated粘：bonding粘：涂：無：unsupported覆：cover增：stiffener銅：copper-cladsurface去：foilremoval層：unclad基：膠：

原：platefinish粗：縱：lengthwise模：cross剪：cutto環(huán)：epoxide環(huán)：epoxideepoxide環(huán)n聚：ployester聚：polyimidec雙

聚：teflon/fiberglass超：ultrathin陶：紫：uvs基材的1a：a-stage2b：b-stage3c：c-stage4環(huán)氧樹：epoxy5酚醛樹：phenolicresin6聚酯樹：polyesterresin7聚酰亞：polyimide8雙馬來：bismaleimide-triazine9丙烯酸：acrylicresin三：多：溴：環(huán)：epoxynovolac氟：fluroresin

硅：siliconeresin硅：silane聚：polymer無：amorphous結：crystalline雙：共：copolymer合：synthetic熱：thermosetting熱：thermoplastic感：環(huán)：weightper環(huán)：epoxy雙：dicyandiamide粘：binder膠：adesive固：curingagent阻：flame遮：opaquer增：plasticizers不：unsatuiated聚：polyester

聚：polyimide聚：polytetrafluoetylene(ptfe)聚：perfluorinated增：reinforcing玻：glassfibere玻璃纖維：d玻璃纖維：s玻璃纖維：玻：glass非：non-woven玻：glassmats紗：單：filament絞：strand緯：經：但：denier經：warp-wise緯：weft-wise,織：threadcount織：weave

平：plain壞：?。簑ovenscrim弓：bowof斷：end缺：mis-picks緯：折：crease云：waviness魚：毛：feather厚：裂：split捻：twistof浸：sizecontent浸：sizeresidue處：finishlevel浸：偶：couplintagent處：聚：聚：non-woven

浸：impregnatinginsulation聚：斷：breaking吸：heightof濕：wet白：whitenness陶：ceramics導：conductive銅：copperfoil壓：rolled退：壓：rolledannealedf?。和浚和浚簉esincoated復：composite載：carrier殷：invar箔：foilprofile光：shinyside

粗：matteside處：treatedside防：stain雙：doubletreated設計1原理圖：shematicdiagram2邏輯圖：logic3印制線：printed4布設總：master5可制造：design-for-manufacturability6計算機：computer-aided7計算機：computer-aided8計算機：computerintegrat9計算機：computer-aided計：電：工：engineering計：計：布：placement

布：routing布：layout重：rerouting模：simulation邏：logic電：circitsimulation時：timingsimulation模：modularization布：layout機：machine機：mdfdatabse設：designdatabase設：design優(yōu)供：predominantaxis表：tableorigin鏡：mirroring驅：drivefile中：intermediate制：manufacturing隊：queuesupport元：componentpositioning

圖：比：scalingfactor掃：scanfilling矩：rectangle填：regionfilling實：邏：logicdesign邏：logiccircuit層：hierarchical自：自：bottom-up線：net數(shù)：digitzing設：designrule走：router(cad)網(wǎng)：net計：computer-aided子：subnet目：objective設：postdesign交：interactive費：costmetrix

工：engineeringdrawing方：blockdiagram迷：元：component巡：traveling自：degrees入：out出：incoming曼：manhatton歐：euclidean網(wǎng)：network陣：array段：segment邏：logic邏：logicdesign分：separatedtime分：separated定：definite形狀與1導線（：conduction(track)2導線（：conductor3導線距：conductorspacing

4導線層：conductor5導線寬度：conductorline/space6第一導：conductor7圓形盤：round8方形盤：squarepad9菱形盤：diamond長：oblongpad子：bulletpad淚：teardroppad雪：snowmanv形盤：v-shaped環(huán)：annular非：non-circular隔：isolation非：monfunctionalpad偏：offsetland腹：back-bard盤：anchoring連：landpattern連：landgrid孔：annular元：componenthole

安：mountinghole支：supportedhole非：unsupportedhole導：via鍍：platedthrough余：accesshole盲：blindvia埋：buriedviahole埋/盲孔：buried/blind任：any全：all定：toaling無：中：interstitial無：引：pilot端：準：quasi-interfacing準：dimensionedhole在：via-in-pad孔：孔：

孔：鉆：drill裝：assembly?。簆rintedboard參：datum形狀與1導線（：conduction2導線（：conductor3導線距：conductorspacing4導線層：conductor5導線寬度：conductorline/space6第一導：conductor7圓形盤：round8方形盤：squarepad9菱形盤：diamond長：oblongpad子：bulletpad淚：teardroppad雪：snowmanV形盤：V-shaped環(huán)：annular非：non-circular

隔：isolation非：monfunctionalpad偏：offsetland腹：back-bard盤：anchoring連：landpattern連：landgrid孔：annular元：componenthole安：mountinghole支：supportedhole非：unsuppo