1、Good is good, but better carries it.精益求精，善益求善。PCB術(shù)語(yǔ)總整理朮語(yǔ)總整理AbieticAcid松脂酸.AbrasionResistance耐磨性.Abrasives磨料,刷材.ABS樹(shù)脂.Absorption吸收(入).AcImpedance交流阻抗.AcceleratedTest(Aging)加速老化(試驗(yàn)).Acceleration速化反應(yīng).Accelerator加速劑,速化劑.Acceptability,Acceptance允收性,允收.AccessHole露出孔,穿露孔.Accuracy準(zhǔn)確度.AcidNumber(AcidValue)酸值

2、.AcousticMicroscope(AM)感音成像顯微鏡.Acrylic壓克力(聚丙烯酸樹(shù)脂).ActinicLight(orIntensity,orRadiation)有效光.Activation活化.Activator活化劑.ActiveCarbon活性炭.ActiveParts(Devices)主動(dòng)零件.Acutance解像銳利度.AdditionAgent添加劑.AdditiveProcess加成法.Adhesion附著力.AdhesionPromotor附著力促進(jìn)劑.Adhesive膠類或接著劑.Admittance導(dǎo)納(阻抗的倒數(shù)).Aerosol噴霧劑,氣熔膠,氣懸體.Agi

3、ng老化.AirInclusion氣泡夾雜.AirKnife風(fēng)刀.Algorithm算法.AliphaticSolvent脂肪族溶劑.AluminiumNitride(AlN)氮化鋁.AmbientTamp環(huán)境溫度.Amorphous無(wú)定形,非晶形.Amp-Hour安培小時(shí).AnalogCircuit/AnalogSignal模擬電路/模擬訊號(hào).AnchoringSpurs著力爪.AngleofContack接觸角.AngleofAttack攻角.Anion陰離子.Anisotropic異向性,單向的.Anneal韌化(退火).AnnularRing孔環(huán).Anode陽(yáng)極.AnodeSludge

4、陽(yáng)極泥.Anodizing陽(yáng)極化.ANSI美國(guó)標(biāo)準(zhǔn)協(xié)會(huì).Anti-FoamingAgent消泡劑.Anti-pitAgent抗凹劑.AOI自動(dòng)光學(xué)檢驗(yàn).Apertures開(kāi)口,鋼版開(kāi)口.AQL品質(zhì)允收水準(zhǔn).AQL(AcceptableQualityLevel)允收品質(zhì)水準(zhǔn).AramidFiber聚醯胺纖維.ArcResistance耐電弧性.Array排列.Artwork底片.ASIC特定用途績(jī)體電路器.AspectRatio縱橫比.Assembly組裝裝配.A-stageA階段.ATE自動(dòng)電測(cè)設(shè)備.Attenuation訊號(hào)衰減.Autoclave壓力鍋.Axial-lead軸心引腳.Aze

5、otrope共沸混合液.*B*BackLight(BackLighting)背光法.BackTaper反錐斜角.Backpanels,Backplanes支撐板.Back-up墊板.BalancedTransmissionLines平衡式傳輸線.BallGridArray球腳數(shù)組(封裝).Bandability彎曲性.BankingAgent護(hù)岸劑.BareChipAssembly裸體芯片組裝.Barrel孔壁,滾鍍.BaseMaterial基材.BasicGrid基本方格.Batch批.Baume波美度(凡液體比重比水重則Be=145-(145Sp.Gr)凡液體比重比水輕則Be=140(Sp

6、.Gr-130)*Sp.Gr為比重即同體績(jī)物質(zhì)對(duì)純水1g/cm的比值).Beamlead光芒式的平行密集引腳.Bed-of-NailTesting針床測(cè)試.BellowsConact彈片式接觸.BetaRayBackscatter貝他射線反彈散射.Bevelling切斜邊.Bias斜張綱布,斜纖法.Bi-LevelStencil雙階式鋼板.Binder粘結(jié)劑.Bits頭(DrillBits).BlackOxide黑氧化層.Blanking沖空斷開(kāi).Bleack漂洗.Bleeding溢流.BlindViaHole肓通孔.Blister局部性分層或起泡.BlockDiagram電路系統(tǒng)塊圖.Blo

7、ckout封綱.Blotting干印.BlottingPaper吸水紙.BlowHole吹孔.BluePlaque藍(lán)紋(錫面鈍化層).BlurEdge(Circle)模糊邊帶(圈).BombSight彈標(biāo).BondStrength結(jié)合強(qiáng)度.Bondability結(jié)合性.BondingLayer結(jié)合層接著層.BondingSheet(Layer)接合片.BondingWire結(jié)合線.Bow,Bowing板彎.Braid編線.Brazing硬焊(用含銀的銅鋅合金焊條).在425870下進(jìn)行熔接的方式).BreakPoint顯像點(diǎn).Break-awayPanel可斷開(kāi)板.BreakdownVolta

8、ge崩潰電壓.Break-out破出.Bridging搭橋.BrightDip光澤浸漬處理.Brightener光澤劑.BrownOxide棕氧化.BrushPlating刷鍍.B-stageB階段.BuildUpProcess增層法制程.Build-up堆積.Bulge鼓起.Bump突塊.BumpingProcess凸塊制程.Buoyancy浮力.BuriedViaHole埋導(dǎo)孔.Burn-in高溫加速老化試驗(yàn).Burning燒焦.Burr毛頭.BusBar匯電桿.ButterCoat外表樹(shù)脂層.*C*C4ChipJointC4芯片焊接.Cable電纜.CAD計(jì)算機(jī)輔助設(shè)計(jì).Calender

9、edFabric軋平式綱布.CapLamination帽式壓合法.Capacitance電容.CapacitiveCoupling電容耦合.CapillaryAction毛細(xì)作用.Carbide碳化物.CarbonArcLamp碳弧燈.CarbonTreatment,Active活化炭處理.Card卡板.CardCages/CardRacks電路板構(gòu)裝箱.CarlsonPin卡氏定位稍.Carrier載體.Cartridge濾心.Castallation堡型績(jī)體電路器.CatalyzedBoard,CatalyzedSubstrate催化板材.Catalyzing催化.Cathode陰極.Ca

10、tion陰向離子,陽(yáng)離子.CaulPlate隔板.Cavitation空泡化半真空.Center-to-CenterSpacing中心間距.Ceramics陶瓷.Cermet陶金粉.Certificate證明書(shū).CFC氟氫碳化物.Chamfer倒角.CharacteristicImpedance特性阻抗.Chase綱框.CheckList檢查清單.Chelate螯合.ChemicalMilling化學(xué)研磨.ChemicalResistance抗化性.Chemisorption化學(xué)吸附.Chip芯片(粒).ChipInterconnection芯片互連.ChiponBoard芯片粘著板.Chip

11、OnGlass晶玻接裝(COG).Chisel鉆針的尖部.ChlorinatedSolvent含氯溶劑,氯化溶劑.CircumferentialSeparation環(huán)狀斷孔.Clad/Cladding披覆.CleanRoom無(wú)塵室.Cleanliness清潔度.Clearance余地,余環(huán).ClinchedLeadTerminal緊箝式引腳.Clinched-wireThroughConnection通孔彎線連接法.ClipTerminal繞線端接.Coat,Coating皮膜表層.CoaxialCable同軸纜線.CoefficientofThermalExpansion熱膨脹系數(shù).Co-F

12、iring共繞.ColdFlow冷流.ColdSolderJoint冷焊點(diǎn).CollimatedLight平行光.Colloid膠體.ColumnarStructure柱狀組織.CombPattern梳型電路.ComplexIon錯(cuò)離子.ComponentHole零件孔.ComponentOrientation零件方向.ComponentSide組件面.Composites,(CEM-1,CEM-3)復(fù)合板材.CondensationSoldering凝熱焊接,液化放熱焊接.Conditioning整孔.Conductance導(dǎo)電.ConductiveSalt導(dǎo)電鹽.Conductivity導(dǎo)

13、電度.ConductorSpacing導(dǎo)體間距.ConformalCoating貼護(hù)層.Conformity吻合性,服貼性.Connector連接器.ContactAngle接觸角.ContactArea接觸區(qū).ContactResistance接觸電阻.Continuity連通性.ContractService協(xié)力廠,分包廠.ControlledDepthDrilling定深鉆孔.ConversionCoating轉(zhuǎn)化皮膜.Coplanarity共面性.Copolymer共聚物.CopperFoil銅皮.CopperMirrorTest銅鏡試驗(yàn).CopperPaste銅膏.Copper-In

14、var-Copper(CIC)綜合夾心板.CoreMaterial內(nèi)層板材,核材.CornerCrack通孔斷角.CornerMark板角標(biāo)記.Counterboring方型擴(kuò)孔.Countersinking錐型擴(kuò)孔.CouplingAgent偶合劑.Coupon,TestCoupon板邊試樣.Coverlay/Covercoat表護(hù)層.Crack裂痕.Crazing白斑.Crease皺折.Creep潛變.CrossectionArea截面積.CrosshatchTesting十字割痕試驗(yàn).Crosshatching十字交叉區(qū).Crosslinking,Crosslinkage交聯(lián),架橋.Cr

15、ossover越交,搭交.Crosstalk噪聲,串訊.CrystallineMeltingPoint晶體熔點(diǎn).C-StageC階段.Cure硬化,熟化.CurrentDensity電流密度.Current-CarryingCapability載流能力.CurtainCoating濂涂法.*D*DaisyChainedDesign菊瓣設(shè)計(jì).DatumReference基準(zhǔn)參考.DaughterBoard子板.Debris碎屑,殘材.Deburring去毛頭.DeclinationAngle斜射角.Definition邊緣逼真度.Degradation劣化.Degrasing脫脂.Deioniz

16、edWater去離子水.Delamination分離.DendriticGrowth枝狀生長(zhǎng).Denier丹尼爾(是編織紡織所用各種紗類直徑單位,定義9000米紗束所具有的重量(以克米計(jì)).Densitomer透光度計(jì).Dent凹陷.Deposition皮膜處理.Desiccator干燥器.Desmearing去膠渣.Desoldering解焊.Developer顯像液,顯像機(jī).Developing顯像.Deviation偏差.Device電子組件.Dewetting縮錫.D-glassD玻璃.DiazeFilm偶氮棕片.Dichromate重鉻酸鹽.Dicing芯片分割.Dicyandiam

17、ide(Dicy)雙氰胺.Die沖模.DieAttach晶粒安裝.DieBonding晶粒接著.DieStamping沖壓.Dielectric介質(zhì).DielectricBreakdownVoltage介質(zhì)崩潰電壓.DielectricConstant介質(zhì)常數(shù).DielectricStrength介質(zhì)強(qiáng)度.DifferentialScanningCalorimetry(DSC)微差掃瞄熱卡分析法.DiffusionLayer擴(kuò)散層.Digitizing數(shù)字化.DihedralAngle雙反斜角.DimensionalStability尺度安定性.Diode二極管.DipCoating浸涂法.D

18、ipSoldering浸焊法.DIP(DualInlinePackage)雙排腳封裝體.Dipole偶極,雙極.Direct/IndirectStencil直接/間接版膜.DirectEmulsion直接乳膠.DirectPlating直接電鍍.DiscreteCompenent散裝零件.DiscreteWiringBoard散線電路板,復(fù)線板.DishDown碟型下陷.Dispersant分散劑.DissipationFactor散失因素.DisspationFactor散逸因子.DisturbedJoint受擾焊點(diǎn).DoctorBlade修平刀,刮平刀.DogEar狗耳.Doping摻雜.

19、DoubleLayer雙電層.DoubleTreatedFoil雙面處理銅箔.DragIn/DragOut帶進(jìn)/帶出.DragSoldering拖焊.Drawbridging吊橋效應(yīng).Drift漂移.DrillFacet鉆尖切削面.DrillPointer鉆針重磨機(jī).DrilledBlank已鉆孔的裸板.Dross浮渣.DrumSide銅箔光面.DryFilm干膜.DualWaveSoldering雙波焊接.Ductility展性.DummyLand假焊墊.Dummy,Dummying假鍍(片).Durometer橡膠硬度計(jì).DYCOstrate電漿蝕孔增層法.DynamicFlex(FPC)

20、動(dòng)態(tài)軟板.*E*E-Beam(ElectronBeam)電子束.EddyCurrent渦電流.EdgeSpacing板邊空地.Edge-BoardConnector板邊(金手指)承接器.Edge-BoardContact板邊金手指.Edge-DipSolderabilityTest板邊焊錫性測(cè)試.EDTA乙二胺四乙酸.Effluent排放物.E-glass電子級(jí)玻璃.Elastomer彈性體.ElectricStrength(耐)電性強(qiáng)度.Electrodeposition電鍍.Electro-depositionPhotoresist電著光阻,電泳光阻.Electroforming電鑄.El

21、ectroless-Deposition無(wú)電鍍.ElectrolyticToughPitch電解銅.Electrolytic-Cleaning電解清洗.Electro-migration電遷移.Electro-phoresis電泳動(dòng),電滲.Electro-tinning鍍錫.Electro-Winning電解冶煉.Elongation延伸性,延伸率.Embossing凸出性壓花.EMF(ElectromotiveForce)電動(dòng)勢(shì).EMI(ElectromagneticInterference)電磁干擾.Emulsion乳化.EmulsionSide藥膜面.Encapsulating膠囊.En

22、croachment沾污,侵犯.EndTap封頭.Entek有機(jī)護(hù)銅處理.Entrapment夾雜物.EntryMaterial蓋板.EpoxyResin環(huán)氧樹(shù)脂.EtchFactor蝕刻因子.Etchant蝕刻劑(液).Etchback回蝕.EtchingIndicator蝕刻指針.EtchingResist蝕刻阻劑.EuteticComposition共融組成.Exotherm放熱(曲線).Exposure曝光.Eyelet鉚眼.*F*Fabric綱布.FaceBonding反面朝下結(jié)合.Failure故障.FanOutWiring/FanInWiring扇出布線/扇入布線.Farad法拉

23、.Farady法拉第.FatigueStrength抗疲勞強(qiáng)度.Fault缺陷.FaultPlane斷層面.FeedThroughHole導(dǎo)通孔.Feeder進(jìn)料器.FiberExposure玻纖顯露.FiducialMark基準(zhǔn)記號(hào).Filament纖絲.Fill緯向.Filler填充料.Fillet內(nèi)圓填角.Film底片.FilmAdhesive接著膜,粘合膜.Filter過(guò)濾器.FineLine細(xì)線.FinePitch密腳距,密線距,密墊距.Fineness粒度,純度.Finger手指.Finishing終修(飾).FiniteElementMethod有限要素分析法.FirstArti

24、cle首產(chǎn)品.FirstPass-Yield初檢良品率.Fixture夾具.Flair刃角變形.FlamePoint自燃點(diǎn).FlameResistant耐燃性.FlammabilityRate燃性等級(jí).Flare扇形崩口.FlashPlating閃鍍.Flashover閃絡(luò).FlatCable扁平排線.FlatPack扁平封裝(之零件).Flatness平坦度.FlexiblePrintedCircuit(FPC)軟板.FlexuralFailure撓曲損壞.FlexuralModule彎曲模數(shù),抗撓性模數(shù).FlexuralStrength抗撓強(qiáng)度.FlipChip覆晶,扣晶.Floccula

25、tion絮凝.FloodStrokePrint覆墨沖程印刷.FlowSoldering(WaveSoldering)流焊.Fluorescence熒光.FlurocarbonResin碳氟樹(shù)脂.FlushConductor嵌入式線路,貼平式導(dǎo)體.FlushPoint閃火點(diǎn).Flute退屑槽.Flux助焊劑.FoilBurr銅箔毛邊.FoilLamination銅箔壓板法.Foot殘足(干膜殘余物).FootPrint(LandPattern)腳墊.ForeignMaterial外來(lái)物,異物.Form-to-List布線說(shuō)明清單.FourPointTwisting四點(diǎn)扭曲法.FreeRadica

26、l自由基.Freeboard干舷.Frequency頻率.Frit玻璃熔料.Fully-AdditiveProcess全加成法.FungusResistance抗霉性.FusedCoating熔錫層.Fusing熔合.FusingFluid助熔液.*G*G-10由連續(xù)玻纖所織成的玻纖布與環(huán)氧樹(shù)脂粘結(jié)劑所復(fù)合成的材料.Gage,Gauge量規(guī).GalliumArsenide(GaAs)砷化鎵.GalvanicCorrosion賈凡尼式腐蝕(電解式腐蝕).GalvanicSeries賈凡尼次序(電動(dòng)次序).Galvanizing鍍鋅.GAP第一面分離,長(zhǎng)刃斷開(kāi).GateArray閘列,閘極數(shù)組.G

27、elTime膠化時(shí)間.GelationParticle膠凝點(diǎn).GerberData,GerberFile格博檔案(是美商Gerber公司專為PCB面線路圖形與孔位,所發(fā)展一系列完整的軟件檔案).GhostImage陰影.Gilding鍍金(現(xiàn)為:GlodPlating).GlassFiber玻纖.GlassFiberProtrusion/Gouging,Groove玻纖突出/挖破.GlassTransitionTemperature,Tg玻璃態(tài)轉(zhuǎn)化溫度.Glaze釉面,釉料.GlobTop圓頂封裝體.GloubleTest球狀測(cè)試法.Glycol(EthyleneGlycol)乙二醇.Gold

28、enBoard測(cè)試用標(biāo)準(zhǔn)板.GrainSize結(jié)晶粒度.GrassLeak大漏.Grid標(biāo)準(zhǔn)格.GroundPlane/EarthPlane接地層.GroundPlaneClearance接地空環(huán).GuidePin導(dǎo)針.Gull/WingLead鷗翼引腳.*H*Halation環(huán)暈.HalfAngle半角.Halide鹵化物.Haloing白圈,白邊.Halon海龍,是CFC氟碳化物的一種商品名.HardAnodizing硬陽(yáng)極化.HardChromePlating鍍硬鉻.HardSoldering硬焊.Hardener(CuringAgent)硬化劑(或CuringAgent).Hardne

29、ss硬度.Haring-BlumCell海固槽.Harness電纜組合.HayWire跳線.HeatCleaning燒潔.HeatDissipation散熱.HeatDistortionPoint(Temp)熱變形點(diǎn)(溫度).HeatSealing熱封.HeatSinkPlane散熱層.HeatTransferPaste導(dǎo)熱膏.HeatsinkTool散熱工具.Hertz(Hz)赫.HighEfficiencyParticulateAirFilter(HEPA)高效空氣塵粒過(guò)瀘機(jī).HipotTest高壓電測(cè).Hi-Rel高度靠度.Hit擊(鉆孔時(shí)鉆針每一次刺下的動(dòng)作).HoldingTime停

30、置時(shí)間.HoleBreakout孔位破出.HoleCounter數(shù)孔機(jī).HoleDensity孔數(shù)密度.HolePreparation通孔準(zhǔn)備.HolePullStrength孔壁強(qiáng)度.HoleVoid破洞.Hook切削刀緣外凸.HotAirLevelling噴錫.HotBarSoldering熱把焊接.HotGasSoldering熱風(fēng)手焊.HTE(HighTemperatureElongation)高溫延伸性.HullCell哈氏槽.HybridIntegratedCircuit混成電路.HydraulicBulgeTest液壓鼓起試驗(yàn).HydrogenEmbrittlement氫脆.Hy

31、drogenOvervoltage氫過(guò)(超)電壓.Hydrolysis水解.Hydrophilic親水性.Hygroscopic吸濕性.Hypersorption超吸咐.*I*I.C.Socket績(jī)體電路器插座.Icicle錫尖.Illuminance照度.ImageTransfer影像轉(zhuǎn)移.ImmersionPlating浸鍍.Impedance阻抗.ImpedanceMatch阻抗匹配.Impregnate含浸.In-CircuitTesting組裝板電測(cè).Inclusion異物,夾雜物.IndexingHole基準(zhǔn)孔.Inductance(L)電感.Infrared(IR)紅外線.Inp

32、ut/Output輸入/輸出.Insert,Insertion插接.InspectionOverlay套檢底片.InsulationResistance絕緣電阻.IntegratedCircuit(IC)績(jī)體電路器.InterFace接口.Interconnection互連.IntermetallicCompound(IMC)接口共化物.InternalStress內(nèi)應(yīng)力.Interposer互邊導(dǎo)電物.InterstitialVia-Hole(IVH)局部層間導(dǎo)通孔.Invar殷鋼(63.8%Fe,36%Ni,0.2%C).IonCleanliness離子清潔度.IonExchangeRes

33、ins離子交換樹(shù)脂.IonMigration離子遷移.Ionizable(Ionic)Contaimination離子性污染.Ionization游離,電離.IonizationVoltage(CoronaLevel)電離化電壓(電纜內(nèi)部狹縫空氣中,引起其電離所施加之最小電壓).IPC美國(guó)印刷電路板協(xié)會(huì).Isolation隔離性,隔絕性.*J*JEDEC(JointElectronicDevice聯(lián)合電子組件工程委員會(huì).EngineeringCouncil)J-LeadJ型接腳.JobShop專業(yè)工廠.Joule焦耳.JumperWire跳線.Junction接(合)面,接頭.Just-In-

34、Time(JIT)適時(shí)供應(yīng),及時(shí)出現(xiàn).*K*Kapton聚亞醯胺軟板.Karat克拉(1克拉(鉆石)=0.2g純金則24k金為100%的鈍金.Kauri-ButanolValue考立丁醇值(簡(jiǎn)稱K.B.值).Kerf.切形,裁剪.Kevlar聚醯胺纖維.Key電鍵KeyBoard鍵盤(pán).KissPressure吻壓,低壓.KnoopHardness努普硬度.KnownGoodDie(KGD)已知之良好芯片.Kovar科伐合金(Fe53%,Ni29%,Co17%).KraftPaper牛皮紙.*L*LamdaWave延伸平波.LaminarFlow平流.LaminarStructure片狀結(jié)構(gòu).L

35、aminateVoid板材空洞.Laminate(s)基板.LaminationVoid壓合空洞.Laminator壓膜機(jī).Land孔環(huán)焊墊,表面焊墊.LandlessHole無(wú)環(huán)通孔.LaserDirectImaging(LDI)雷射直接成像.LaserMaching雷射加工法.LaserPhotogenerator(LPG),LaserPhotoplotter雷射曝光機(jī).LaserSoldering雷射焊接法.LayBack刃角磨損.LayOut布線,布局.LayUp疊合.LayertoLayerSpacing層間距離Leaching焊散漂出,熔出.Lead引腳.LeadFrame腳架.L

36、eadPitch腳距.LeakageCurrent漏電電流.Legend文字標(biāo)記.Leveling整平.LiftedLand孔環(huán)(焊墊)浮起.Ligand錯(cuò)離子附屬體.LightEmittingDiodes(LED)發(fā)光二極管.LightIntegrator光能累積器.LightIntensity光強(qiáng)度.LimitingCurrentDensity極限電流密度.LiquidCrystalDisplay(LCD)液晶顯示器.LiquidDielectrics液態(tài)介質(zhì).LiquidPhotoimagibleSolderMask,(LPSM)液態(tài)感光防焊綠漆.LocalAreaNetwork區(qū)域性網(wǎng)

37、絡(luò).Logic邏輯.LogicCircuit邏輯電路.LossFactor損失因素.LossTangent(TanDK)損失正切.LotSize批量.Luminance發(fā)光強(qiáng)度.Lyophilic親水性膠體.*M*Macro-ThrowingPower巨觀分布力.MajorDefect主要(嚴(yán)重)缺點(diǎn).MajorWeaveDirection主要織向.Margin刃帶(鉆頭尖部).Marking標(biāo)記.Mask阻劑.MassFinishing大量整面(拋光).MassLamination大型壓板.MassTransport質(zhì)量輸送.MasterDrawing主圖.Mat席(用于CEM-3(Comp

38、ositeEpoxyMaterial)的復(fù)合材料.)MatteSide毛面(電鍍銅皮(EDFoil)之粗糙面).Mealing泡點(diǎn).MeanTimeToFailure(MTTF)故障前可用之平均時(shí)數(shù).Measling白點(diǎn).MechanicalStretcher機(jī)械式張網(wǎng)機(jī).MechanicalWarp機(jī)械式纏繞.Mechanism機(jī)理.MembraneSwitch薄膜開(kāi)關(guān).MeniscographTest弧面狀沾錫試驗(yàn).Meniscus彎月面.MercuryVaperLamp汞氣燈.MeshCount綱目數(shù).MetalHalideLamp金屬鹵素?zé)?Metallization金屬化.Metal

39、lizedFabric金屬化綱布.Micelle微胞.MicroWireBoard微封線板.Micro-electronios微電子.Microetching微蝕.Microsectioning微切片法.Microstrip微條.MicrostripLine微條線,微帶線.MicrothrowingPower微分布力.Microwave微波.Migration遷移.MigrationRate遷移率.Mil英絲.MinimumAnnularRing孔環(huán)下限.MinimumElectricalSpacing電性間距下限.MinorWeaveDirection次要織向.Misregistration

40、對(duì)不準(zhǔn)度.MixedComponmtMountingTechnology混合零件之組裝技術(shù).Modem調(diào)變及解調(diào)器.Modification修改.Module模塊.ModulusofElasticity彈性系數(shù).MoistureandInsulationResistanceTest濕氣與絕緣電阻試驗(yàn).MoldRelease脫模劑,離型劑.Mole摩爾.Monofilament單絲.MotherBoard主機(jī)板,母板.MouldedCircuit模造立體電路機(jī).MountingHole安裝孔.MountingHole組裝孔,機(jī)裝孔.MouseBite鼠齒(蝕刻后線路邊緣出現(xiàn)不規(guī)則缺口).Mult

41、i-Chip-Module(MCM)多芯片芯片模塊.MultiwiringBoard(orDiscreteWiringBoard)復(fù)線板.*N*N.C.數(shù)值控制.NailHead釘頭.NearIR近紅外線.Negative負(fù)片,鉆尖的第一面外緣變窄.NegativeEtch-back反回蝕.NegativeStencil負(fù)性感光膜.Negative-ActingResist負(fù)性作用之阻劑.Network綱狀元件.Newton牛頓.NewtonRing牛頓環(huán).NewtonianLiquid牛頓流體.Nick缺口.N-MethylPyrrolidine(NMP)N-甲基四氫嗶咯.NobleMeta

42、lPaste貴金屬印膏.Node節(jié)點(diǎn).Nodule節(jié)瘤.Nomencleature標(biāo)示文字符號(hào).NominalCuredThickness標(biāo)示厚度.Non-CircularLand非圓形孔環(huán)焊墊.Non-flammable非燃性.Non-wetting不沾錫.NormalConcentration(Strength)標(biāo)準(zhǔn)濃度,當(dāng)量濃度.NormalDistribution常態(tài)分布.Novolac酯醛樹(shù)脂.Nucleation,Nucleating核化.NumericalControl數(shù)值控制.Nylon尼龍.*O*Occlusion吸藏.Off-Contact架空.Offset第一面大小不均.

43、OFHC(OxyenFreeHighConductivity)無(wú)氧高導(dǎo)電銅.Ohm歐姆.Oilcanning蓋板彈動(dòng).OLB(OuterLeadBond)外引腳結(jié)合.Oligomer寡聚物.OmegaMeter離子污染檢測(cè)儀.OmegaWave振蕩波.On-ContactPrinting密貼式印刷.Opaquer不透明劑,遮光劑.OpenCircuits斷線.OpticalComparater光學(xué)對(duì)比器(光學(xué)放大器.)OpticalDensity光密度.OpticalInspection光學(xué)檢驗(yàn).OpticalInstrument光學(xué)儀器.OrganicSolderabilityPreserv

44、atives(OSP)有機(jī)保焊劑.Osmosis滲透.Outgassing出氣,吹氣.Outgrowth懸出,橫出,側(cè)出.Output產(chǎn)出,輸出.Overflow溢流.Overhang總懸空.Overlap鉆尖點(diǎn)分離.Overpotantial(Overvoltage)過(guò)電位,過(guò)電壓.Oxidation氧化.OxygenInhibitor氧化抑制劑.OzoneDepletion臭氧層耗損.*P*Packaging封裝,構(gòu)裝.Pad焊墊,圓墊.PadMaster圓墊底片.PadsOnlyBoard唯墊板.Palladium鈀.Panel制程板.PanelPlating全板鍍銅.PanelProc

45、ess全板電鍍法.PaperPhenolic紙質(zhì)酚醛樹(shù)脂(板材).PartingAgent脫膜劑.Passivation鈍化,鈍化外理.PassiveDevice(Component)被動(dòng)組件(零件)Paste膏,糊.Pattern板面圖形.PatternPlating線路電鍍.PatternProcess線路電鍍法.PeakVoltage峰值電壓.PeelStrength抗撕強(qiáng)度.PeriodicReverse(PR)Current周期性反電流.Peripheral周邊附屬設(shè)備.Permeability透氣性,導(dǎo)磁率.Permittivity誘電率,透電率.pHValue酸堿值.Phase相

46、.PhaseDiagram相圖.Phenolic酚醛樹(shù)脂.Photofugitive感光褪色.Photographicfilm感光成像之底片.Photoinitiator感光啟始劑.Photomask光罩.Photoplotter,Plotter光學(xué)繪圖機(jī).Photoresist光阻.PhotoresistChemicalMachinning(Milling)光阻式化學(xué)(銑刻)加工.Phototool底片.PickandPlace拾取與放置.Piezoelectric壓電性.Pin插腳,插梢,插針.PinGridArray(PGA)矩陣式針腳對(duì)裝.Pinhole針孔.PinkRing粉紅圈.P

47、itch跨距,腳距,墊距,線距.Pits凹點(diǎn).PlainWeave平織.Plasma電漿.Plasticizers可塑劑,增塑劑.PlatedThroughHole鍍通孔.Platen熱盤(pán).Plating鍍.Plotting標(biāo)繪.Plowing犁溝.Plug插腳,塞柱.Ply層,股.PneumaticStretcher氣動(dòng)拉伸器.PogoPin伸縮探針.Point鉆尖.PointAngle鉆尖面.PointSourceLight點(diǎn)狀光源.Poise泊.粘滯度單位=1dyne*sec/cm2.PolarSolvent極性溶劑.Polarity電極性.Polarization分極,極化.Polar

48、izingSlot偏槽.PolyesterFilms聚酯類薄片.PolymerThickFilm(PTF)厚膜糊.Polymerization聚合.Polymide(PI)聚亞醯胺.PopcornEffect爆米花效應(yīng).Porcelain瓷材,瓷面.PorosityTest疏孔度試驗(yàn).PositiveActingResist正性光阻劑.PostCure后續(xù)硬化,后烤.PostSeparation后期分離,事后公離.PotLife運(yùn)用期,鍋中壽命.Potting鑄封,模封.PowerSupply電源供應(yīng)器.Preform預(yù)制品.Preheat預(yù)熱.Prepreg膠片,樹(shù)脂片.PressPlate

49、鋼板.Press-FitContact擠入式接觸.PressureFoot壓力腳.Pre-tinning預(yù)先沾錫.PrimaryImage線路成像.PrintThrough壓透,過(guò)度擠壓.Probe探針.ProcessCamera制程用照像機(jī).ProcessWindow操作范圍.ProductionMaster生產(chǎn)底片.Profile輪廓,部面圖,升溫曲線圖棱線.Propagation傳播.PropagationDelay傳播延遲.PuddleEffect水坑效應(yīng).PullAway拉離.PulsePlating脈沖電鍍法.PumicePowder浮石粉.Punch沖切.Purge,Purgin

50、g凈空,凈洗.PurplePlague紫疫(金與鋁的共化物層).Pyrolysis熱裂解,高溫分解.*Q*QuadFlatPack(QFP)方扁形封裝體.QualificationAgency資格認(rèn)證機(jī)構(gòu).QualificationInspection資格檢驗(yàn).QualifiedProductsList合格產(chǎn)品(供應(yīng)者)名單.QualitativeAnalysis定性分析.QualityConformanceTestCircuitry(Coupon)品質(zhì)符合之試驗(yàn)線路(樣板).QuantitativeAnalysis定量分析.Quench淬火,驟冷.QuickDisconnect快速接頭.Qu

51、ill緯紗繞軸.*R*Rack掛架.RadialLead放射狀引腳.RadioFrequencyInterference(RFI)射頻干擾.RakeAngle摳角,耙角.RatedTemperature,Voltage額定溫度,額定電壓.Reactance電抗.RealEstate底材面,基板面.RealTimeSystem實(shí)時(shí)系統(tǒng).Reclaiming再生,再制.Rediometer輻射計(jì),光度計(jì).ReeltoReel卷輪(盤(pán))式操作.ReferenceDimension參考尺度.ReferenceEdge參考邊緣.Reflection反射.ReflowSoldering重熔焊接,熔焊.Re

52、fraction折射.RefractiveIndex折射率.RegisterMark對(duì)準(zhǔn)用標(biāo)記.Registration對(duì)準(zhǔn)度.Reinforcement補(bǔ)強(qiáng)物.Rejection剔退,拒收.Relamination(Re-Lam)多層板壓合.Relaxation松弛.緩和.Relay繼電器.ReleaseAgent,ReleaseSheets脫模劑,離模劑.Reliability可靠度,可信度.ReliefAngle浮角.Repair修理.ResinCoatedCopperFoil背膠銅箔.ResinContent膠含量,樹(shù)脂含量.ResinFlow膠流量,樹(shù)脂流量.ResinRecessi

53、on樹(shù)脂下陷.ResinRichArea多膠區(qū),樹(shù)脂豐富區(qū).ResinSmear膠(糊)渣.ResinStarveArea缺膠區(qū),樹(shù)脂缺乏區(qū).Resist阻膜,阻劑.Resistivity電阻系數(shù),電阻率.Resistor電阻器,電阻.ResistorDrift電阻漂移.ResistorPaste電阻印膏.Resolution解像,解像度,分辨率.ResolvingPower解析(像)力,分辨力.ReverseCurrentCleaning反電流(電解)清洗.ReverseEtchback反回蝕.ReverseImage負(fù)片影像(阻劑).ReverseOsmosis(RO)反(逆滲透).Rev

54、ersion反轉(zhuǎn),還原.Revision修正版.改訂版.Rework(ing)重工,再加工.Rhology流變學(xué),流變性質(zhì).RibbonCable圓線纜帶.Rigid-FlexPrintedBoard硬軟合板.Ring套環(huán).Rinsing水洗,沖洗.Ripple紋波(指整流器所輸出電流中不穩(wěn)定成分).RiseTime上升時(shí)間.Roadmap線路與零件之布局圖.Robber輔助陰極.RollerCoating輥輪涂布.RollerCoating滾動(dòng)涂布法.RollerCutter輥切機(jī).RollerTinning輥錫法,滾錫法.Rosin松香.RotaryDipTest擺動(dòng)沾錫試驗(yàn).Routin

55、g切外型.Runout偏轉(zhuǎn),累績(jī)距差.Rupture迸裂.*S*SacrificialProtection犧牲性保護(hù)層.SaltSprayTest鹽霧試驗(yàn).SandBlast噴砂.Saponification皂化作用.Saponifier皂化劑.SatinFinish緞面處理.ScaledFlowTest比例流量實(shí)驗(yàn).SchemeticDiagram電路概略圖.ScoringV型刻槽.Scratch刮痕.ScreenPrinting綱版印刷.Screenability綱印能力.Scrubber磨刷機(jī),磨刷器.Scum透明殘膜.Sealing封孔.SecondarySide第二面.Seeding

56、下種.SelectivePlating選擇性電鍍.Self-Extinguishing自熄性.Selvage布邊.Semi-AdditiveProcess半加成制程.Semi-Conductor半導(dǎo)體.Sensitizing敏化.SeparableComponentPart可分離式零件.SeparatorPlate隔板,鋼板.SequentialLamination接續(xù)性壓合法.SequesteringAgent螯合劑.Shadowing陰影,回蝕死角.Shank鉆針柄部.ShearStrength抗剪強(qiáng)度.ShelfLife儲(chǔ)齡.Shield遮蔽.ShoreHardness蕭氏硬度.Shor

57、t短路.ShoulderAngle肩斜角.Shunt分路.SideWall側(cè)壁.Siemens電阻值.Sigma(StandardDeviation)標(biāo)準(zhǔn)差.Signal訊號(hào).Silane硅烷.SilicaGel硅膠砂.Silicon硅.Silicone硅銅.SilkScreen綱版印刷,絲綱印刷.SilverMigration銀遷移.SilverPaste銀膏.Single-In-LinePackage(SIP)單邊插腳封裝體.Sintering燒結(jié).Sizing上膠,上漿.Sizing上漿處理.SkinEffect集膚效應(yīng)(高頻下,電流在傳遞時(shí)多集中在導(dǎo)體表面,使得道線內(nèi)部通過(guò)電流甚少,造

58、成內(nèi)部導(dǎo)體浪費(fèi),并也使得表面導(dǎo)體部分電阻升高.SkipPrinting,SkipPlating漏印,漏鍍.SkipSolder缺錫,漏焊.Slashing漿經(jīng).SleeveJint套接.Sliver邊絲,邊余.Slot,Slotting槽口.Sludge于泥.Slump塌散.Slurry稠漿,懸浮漿.SmallHole小孔.Smear膠渣.Smudging錫點(diǎn)沾污.Snap-off彈回高度.Socket插座.SoftContact輕觸.SoftGlass軟質(zhì)玻璃(鉛玻璃).Solder焊錫.SolderBall錫球.SolderBridging錫橋.SolderBump焊錫凸塊.SolderC

59、olumnPackage錫柱腳封裝法.SolderConnection焊接.SolderCost焊錫著層.SolderDam錫堤.SolderFillet填錫.SolderLevelling噴錫,熱風(fēng)整平.SolderMasking(S/M)防焊膜綠漆.SolderPaste錫膏.SolderPlug錫塞(柱).SolderPreforms預(yù)焊料.SolderProjection焊錫突點(diǎn).SolderSag焊錫垂流物.SolderSide焊錫面.SolderSpatter濺錫.SolderSplash賤錫.SolderSpreadTest散錫試驗(yàn).SolderWebbing錫綱.SolderW

60、ebbing錫綱.SolderWicking滲錫,焊錫之燈芯效應(yīng).Solderability可焊性.Soldering軟焊,焊接.SolderingFluid,SolderingOil助焊液,護(hù)焊油.SolidContent固體含量,固形分.SolidusLine固相線.Spacing間距.Span跨距.SparkOver閃絡(luò).SpecificHeat比熱.Specification(Spec)規(guī)范,規(guī)格.Specimen樣品,試樣.Spectrophotometry分光光度計(jì)檢測(cè)法.Spindle主軸,鉆軸.SpinningCoating自轉(zhuǎn)涂布.Splay斜鉆孔.SprayCoating噴